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Contenuto archiviato il 2024-04-30

Micro-electronics for large area, high resolution, real time, flat, digital image detectors

Obiettivo

- The proposed high resolution detector subsystem will build on existing expertise and prototypes. It will be based on an active matrix sensor where each pixel is made of thin film amorphous silicon photodiodes acting as sensitive elements coupled to switching diodes. Silicon Sensor Panel Technology taking advantage of microelectronic technologies is actually the best candidate to fulfil advanced real-time digital imaging requirements with cost-effective solutions.

- High data volume/real-time pre-processing electronics will be also developed. These components will be integrated in a digital detector which will be tested under working conditions to meet application needs.

- Marketing of the resulting detector is expected within one year after project completion.

Professional markets (medical, factory automation, etc.) have increasing need for real-time direct digital image sensors, of large area, small thickness, high resolution and high reliability, for operation in specific environments. Present sensors do not meet all these requirements. MEDID aims to develop a high sensitivity flat panel detector prototype of large area (~40x40 cm), high resolution (pixel pitch ~ 140 micron) and high image processing capability (> 1 GOPS). The detector will meet user/end-user needs for digital real-time radiography, including the high reliability and endurance required by medical and industrial environments. This detector subsystem will allow significant application innovation including the possibility of radiological film substitution, lower irradiation dose and exploitation costs, and immediate electronic image availability.

Invito a presentare proposte

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Meccanismo di finanziamento

CSC - Cost-sharing contracts

Coordinatore

Thomson Tubes Electroniques
Contributo UE
Nessun dato
Indirizzo
Avenue Du Marechal Juin 18
92366 Meudon La Foret
Francia

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Costo totale
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Partecipanti (1)