Objective
The aim of the project is the development of a novel methodology for the fabrication of low power semiconductor gas sensors and sensor arrays addressing the application com-petencies of portability, high performance, reliability, endurance and high yield. The project faces two separate challenges, a novel low-power structure and CMOS integration, that both are of interest individually, but especially once combined promise a high performance device. The final device will consist of a gas sensor array fabricated on a thermally isolated silicon diaphragm and with high added value thanks to its combination with on-chip CMOS circuitry. The mechanical structure that guarantees high yield, robustness, endurance and low-power consumption is achieved with the use of a glass cover which is fabricated on wafer level.
The project is pro-posed on a two-step basis, being the first for demonstrating the feasibility of the new concept. Three partial demonstrators are defined to tackle the technological risks and pass-fail criteria have been fixed for them. They are defined to assess the compatibility of the gas sensor and electronic circuit technologies, their interconnectability and the manu-facturability of the wafer level packaging glass-silicon structure. The coexistence of high temperatures for sensors and low temperatures for the circuitry on the same chip will be demonstrated with the demonstrators and FEM simulations.
The device will consist of a low power semiconductor gas sensor array fabricated on a thermally isolated silicon diaphragm and with high added value thanks to its combination with on-chip CMOS circuitry. The robustness of the structure that assesses high yield and endurance is achieved with the use of a glass cover that is an important part of the structure. Apart of improving on the industrial concerns of robustness and packaging cost, the glass-silicon structures can be used for the fabrication of new devices for both high volume markets and high price advanced systems.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
- engineering and technologymaterials engineering
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensors
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
- natural scienceschemical sciencesinorganic chemistrymetalloids
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Topic(s)
Call for proposal
Data not availableFunding Scheme
ACM - Preparatory, accompanying and support measuresCoordinator
28006 Madrid
Spain