Objective
The aim of the project is the development of a novel methodology for the fabrication of low power semiconductor gas sensors and sensor arrays addressing the application com-petencies of portability, high performance, reliability, endurance and high yield. The project faces two separate challenges, a novel low-power structure and CMOS integration, that both are of interest individually, but especially once combined promise a high performance device. The final device will consist of a gas sensor array fabricated on a thermally isolated silicon diaphragm and with high added value thanks to its combination with on-chip CMOS circuitry. The mechanical structure that guarantees high yield, robustness, endurance and low-power consumption is achieved with the use of a glass cover which is fabricated on wafer level.
The project is pro-posed on a two-step basis, being the first for demonstrating the feasibility of the new concept. Three partial demonstrators are defined to tackle the technological risks and pass-fail criteria have been fixed for them. They are defined to assess the compatibility of the gas sensor and electronic circuit technologies, their interconnectability and the manu-facturability of the wafer level packaging glass-silicon structure. The coexistence of high temperatures for sensors and low temperatures for the circuitry on the same chip will be demonstrated with the demonstrators and FEM simulations.
The device will consist of a low power semiconductor gas sensor array fabricated on a thermally isolated silicon diaphragm and with high added value thanks to its combination with on-chip CMOS circuitry. The robustness of the structure that assesses high yield and endurance is achieved with the use of a glass cover that is an important part of the structure. Apart of improving on the industrial concerns of robustness and packaging cost, the glass-silicon structures can be used for the fabrication of new devices for both high volume markets and high price advanced systems.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- engineering and technology materials engineering amorphous solids
- natural sciences chemical sciences inorganic chemistry metalloids
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
28006 Madrid
Spain
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.