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Terahertz microsystems - Enabling the large-scale exploitation of the terahertz gap

Objective

This project envisions the wide-spread use of THz technology in various applications in our society, which is enabled by the proposed THz microsystems, providing an unprecedented way of creating highly-integrated, volume-manufacturable, cost and energy-efficient, reconfigurable and thus adaptive submillimeter-wave and THz systems. Advanced three-dimensional micromachining is used as the key enabling fabrication technology. In connection with the technology convergence of advancing microwave semiconductor technology according to international technology programmes and roadmaps, the findings of this project are expected to comprise a significant contribution towards the large-scale exploitation of the heavily sought-after frequency space between 100 GHz and 1 THz, the so-called ‘terahertz gap’.
Primary application fields with high impact of the proposed technology are wireless short-range communication links to interconnect future small-cell clouds replacing the current macro-basestation radio access network, and submillimeter-wave/THz sensing with application fields including medical diagnosis, food quality control, agriculture and industrial sensors.
The proposed THz microsystems are based on rectangular waveguide-technology integrated into a multi-wafer stacked silicon substrate, which integrates all passive components needed for completing a submillimeter-wave/THz system around the monolithic-microwave integrated circuits (MMIC). Novel key building blocks investigated in this proposal include platform-integrated sensor and antenna interfaces, micro-electromechanically tuneable filters, phase-shifters, impedance-matching networks and non-galvanic microsystem-to-IC interfaces. The micro-mechanical reconfigurability enables unprecedented adaptive THz systems.
Key outcomes of this project are proof-of-concept prototypes of all key building blocks up to 650 GHz, and of complete THz microsystems implemented for the two key applications telecom links and medical sensors.

Field of science

  • /natural sciences/chemical sciences/inorganic chemistry/inorganic compounds
  • /natural sciences/physical sciences/electromagnetism and electronics/electrical conductivity/semiconductor
  • /agricultural sciences/agriculture, forestry, and fisheries
  • /agricultural sciences/agriculture, forestry, and fisheries/agriculture

Call for proposal

ERC-2013-CoG
See other projects for this call

Funding Scheme

ERC-CG - ERC Consolidator Grants

Host institution

KUNGLIGA TEKNISKA HOEGSKOLAN
Address
Brinellvagen 8
100 44 Stockholm
Sweden
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 1 727 189
Principal investigator
Joachim Oberhammer (Dr.)
Administrative Contact
Erika Appel (Mrs.)

Beneficiaries (1)

KUNGLIGA TEKNISKA HOEGSKOLAN
Sweden
EU contribution
€ 1 727 189
Address
Brinellvagen 8
100 44 Stockholm
Activity type
Higher or Secondary Education Establishments
Principal investigator
Joachim Oberhammer (Dr.)
Administrative Contact
Erika Appel (Mrs.)