CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Deliverables
Report
Integrated demonstrator on modelling, verification and reliability analysis (opens in new window)Report
System-level reliability analysis tools (opens in new window)Report
FDIR schemes (incl. reconfiguration, health map, fault classification) (opens in new window)Report
Dynamic, semi-formal and formal reliability analysis tools (opens in new window)report
Fault management infrastructure verification tools (opens in new window)Report
Market analysis (opens in new window)Report
Status on fault management (opens in new window)Report
Verification, debugging and testing tools (opens in new window)Report
Dissemination and communication report (opens in new window)Report
Status on modelling, fault/reconfiguration modelling and reliability metrics (opens in new window)Cross-layer CPS modelling framework (opens in new window)
Report
Reconfiguration modelling (opens in new window)Report
CPS run-time for SW task deployment (opens in new window)Report
Dynamic, semi-formal and formal reliability analysis methods (opens in new window)Report
Fault models and reliability metrics (opens in new window)Report
Verification, debugging and testing methods (opens in new window)Report
Publications
Author(s):
Thiago Copetti, Guilherme Medeiros, Leticia Bolzani Poehls, Fabian Vargas, Sergei Kostin, Maksim Jenihhin, Jaan Raik, Raimund Ubar
Published in:
2016 17th Latin-American Test Symposium (LATS), 2016, Page(s) 75-80, ISBN 978-1-5090-1331-9
Publisher:
IEEE
DOI:
10.1109/LATW.2016.7483343
Author(s):
Anton Karputkin, Jaan Raik
Published in:
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), 2016, Page(s) 1124-1127, ISBN 978-3-9815370-7-9
Publisher:
Research Publishing Services
DOI:
10.3850/9783981537079_0260
Author(s):
Heinz Riener, Goerschwin Fey
Published in:
2016 1st IEEE International Verification and Security Workshop (IVSW), 2016, Page(s) 1-6, ISBN 978-1-5090-1141-4
Publisher:
IEEE
DOI:
10.1109/IVSW.2016.7566605
Author(s):
Hans G. Kerkhoff, Ghazanfar Ali, Jinbo Wan, Ahmed Ibrahim, Jerrin Pathrose
Published in:
2017 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), 2017, Page(s) 1-6, ISBN 978-1-5386-2880-5
Publisher:
IEEE
DOI:
10.1109/VLSI-SoC.2017.8203464
Author(s):
Hans G. Kerkhoff, Ghazanfar Ali, Hassan Ebrahimi, Ahmed Ibrahim
Published in:
2017 International Test Conference in Asia (ITC-Asia), 2017, Page(s) 65-70, ISBN 978-1-5386-3051-8
Publisher:
IEEE
DOI:
10.1109/ITC-ASIA.2017.8097113
Author(s):
Andreina Zambrano, Hans G. Kerkhoff
Published in:
2017 International Test Conference in Asia (ITC-Asia), 2017, Page(s) 59-64, ISBN 978-1-5386-3051-8
Publisher:
IEEE
DOI:
10.1109/ITC-ASIA.2017.8097112
Author(s):
Ahmed Ibrahim, Hans G. Kerkhoff
Published in:
2017 IEEE 35th VLSI Test Symposium (VTS), 2017, Page(s) 1-6, ISBN 978-1-5090-4482-5
Publisher:
IEEE
DOI:
10.1109/VTS.2017.7928955
Author(s):
Ahmed Ibrahim, Hans G. Kerkhoff
Published in:
2017 IEEE 23rd International Symposium on On-Line Testing and Robust System Design (IOLTS), 2017, Page(s) 1-2, ISBN 978-1-5386-0352-9
Publisher:
IEEE
DOI:
10.1109/IOLTS.2017.8046166
Author(s):
Vain, Jüri; Tsiopoulos, Leonidas; Kharchenko, Vyacheslav; Kaur, Apneet; Jenihhin, Maksim; Raik, Jaan
Published in:
2017
Publisher:
ICT in Education, Research and Industrial Applications
Author(s):
Adeboye Stephen Oyeniran, Raimund Ubar, Siavoosh Payandeh Azad, Jaan Raik
Published in:
2017 12th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC), 2017, Page(s) 1-8, ISBN 978-1-5386-3344-1
Publisher:
IEEE
DOI:
10.1109/ReCoSoC.2017.8016156
Author(s):
Tsotne Putkaradze, Siavoosh Payandeh Azad, Behrad Niazmand, Jaan Raik, Gert Jervan
Published in:
2017 12th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC), 2017, Page(s) 1-8, ISBN 978-1-5386-3344-1
Publisher:
IEEE
DOI:
10.1109/ReCoSoC.2017.8016161
Author(s):
Igor Aleksejev, Artur Jutman, Sergei Devadze
Published in:
2016 IEEE AUTOTESTCON, 2016, Page(s) 1-8, ISBN 978-1-5090-0790-5
Publisher:
IEEE
DOI:
10.1109/AUTEST.2016.7589627
Author(s):
Sergei Odintsov, Artur Jutman, Sergei Devadze, Igor Aleksejev
Published in:
2017 IEEE AUTOTESTCON, 2017, Page(s) 1-9, ISBN 978-1-5090-4922-6
Publisher:
IEEE
DOI:
10.1109/AUTEST.2017.8080516
Author(s):
Sergei Odintsov, Artur Jutman, Sergei Devadze
Published in:
2017 IEEE International Test Conference (ITC), 2017, Page(s) 1-10, ISBN 978-1-5386-3413-4
Publisher:
IEEE
DOI:
10.1109/TEST.2017.8242070
Author(s):
Laura Humphrey, Bettina Könighofer, Robert Könighofer, Ufuk Topcu
Published in:
2017, Page(s) 134-151
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-49052-6_9
Author(s):
Tino Flenker, Jan Malburg, Gorschwin Fey, Serhiy Avramenko, Massimo Violante, Matteo Sonza Reorda
Published in:
2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2017, Page(s) 533-538, ISBN 978-1-5090-6762-6
Publisher:
IEEE
DOI:
10.1109/ISVLSI.2017.99
Author(s):
Roderick Bloem, Hannes Gross, Rinat Iusupov, Bettina Konighofer, Stefan Mangard, and Johannes Winter
Published in:
2018
Publisher:
EUROCRYPT
Author(s):
H. Ebrahimi and H.G. Kerkhoff
Published in:
2018
Publisher:
DDECS
Author(s):
G. Ali, J. Pathrose, Y. Zhao and H.G. Kerkhoff
Published in:
2018
Publisher:
submitted to International Test Conference Asia (ITC-Asia)
Author(s):
J.Pathrose, G.Ali, and H. G. Kerkhoff
Published in:
2018
Publisher:
2018 19th IEEE Latin American Test Symposium (LATS)
Author(s):
Malburg, Jan and Riener, Heinz and Fey, Görschwin
Published in:
2018
Publisher:
IEEE International Symposium on Multiple-Valued Logic
Author(s):
Heinz Riener, Robert Könighofer, Görschwin Fey, and Roderick Bloem (DLR, TU Graz)
Published in:
Applied Verification for Continuous and Hybrid Systems, 2016
Publisher:
ARCH'16
Author(s):
A. Jutman, S. Devadze, K. Shibin (Testonica Lab)
Published in:
2016, Page(s) 1-6
Publisher:
WRTLT’2016
Author(s):
Ali, G. and Badawy, A. and Kerkhoff, H.G. (U.Twente)
Published in:
2016, Page(s) 776-779
Publisher:
IEEE Circuits & Systems Society
Author(s):
Zhao, Yong and Kerkhoff, H.G. (U.Twente)
Published in:
2016, Page(s) 10-14
Publisher:
IEEE Computer Society
Author(s):
Copetti, Thiago; Medeiros, Guilherme; Poehls, Leticia; Vargas, Fabian; Kostin, Sergei; Jenihhin, Maksim; Raik, Jaan (Tallinn UT)
Published in:
2016, Page(s) 75-80
Publisher:
IEEE Computer Society Press
Author(s):
Heinz Riener and Goerschwin Fey (DLR)
Published in:
2016
Publisher:
IVSW
Author(s):
Roderick Bloem, Robert Konighofer, Ingo Pill, Franz Rock
Published in:
2016 Formal Methods in Computer-Aided Design (FMCAD), 2016, Page(s) 17-24, ISBN 978-0-9835678-6-8
Publisher:
IEEE
DOI:
10.1109/FMCAD.2016.7886656
Author(s):
Siavoosh Payandeh Azad, Behrad Niazmand, Peeter Ellervee, Jaan Raik, Gert Jervan, Thomas Hollstein (Tallinn UT)
Published in:
2016
Publisher:
ReCoSoC
Author(s):
Behrad Niazmand, Siavoosh Payandeh Azad, Jose Flich, Jaan Raik, Gert Jervan, Thomas Hollstein
Published in:
2016 Tenth IEEE/ACM International Symposium on Networks-on-Chip (NOCS), 2016, Page(s) 1-8, ISBN 978-1-4673-9030-9
Publisher:
IEEE
DOI:
10.1109/NOCS.2016.7579317
Author(s):
Siavoosh Payandeh Azad, Behrad Niazmand, Jaan Raik, Gert Jervan, Thomas Hollstein (Tallinn UT)
Published in:
2016
Publisher:
DREAMCloud
Author(s):
Andreina Zambrano, Hans G. Kerkhoff
Published in:
2016 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), 2016, Page(s) 1-6, ISBN 978-1-5090-3561-8
Publisher:
IEEE
DOI:
10.1109/VLSI-SoC.2016.7753579
Author(s):
Andreina Zambrano, Hans G. Kerkhoff
Published in:
2016 IEEE 21st International Mixed-Signal Testing Workshop (IMSTW), 2016, Page(s) 1-5, ISBN 978-1-5090-2751-4
Publisher:
IEEE
DOI:
10.1109/IMS3TW.2016.7524234
Author(s):
Niklas Krafczyk, Heinz Riener, Goerschwin Fey
Published in:
2016 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), 2016, Page(s) 1-6, ISBN 978-1-5090-3561-8
Publisher:
IEEE
DOI:
10.1109/VLSI-SoC.2016.7753559
Author(s):
Heinz Riener, Goerschwin Fey
Published in:
Proceedings of the 35th International Conference on Computer-Aided Design - ICCAD '16, 2016, Page(s) 1-8, ISBN 9781-450344661
Publisher:
ACM Press
DOI:
10.1145/2966986.2967036
Author(s):
Sandip Ray, Ian G. Harris, Goerschwin Fey, Mathias Soeken
Published in:
Proceedings of the 35th International Conference on Computer-Aided Design - ICCAD '16, 2016, Page(s) 1-6, ISBN 9781-450344661
Publisher:
ACM Press
DOI:
10.1145/2966986.2980093
Author(s):
Ahmed Ibrahim, Hans G. Kerkhoff
Published in:
2016 28th International Conference on Microelectronics (ICM), 2016, Page(s) 249-252, ISBN 978-1-5090-5721-4
Publisher:
IEEE
DOI:
10.1109/ICM.2016.7847862
Author(s):
Ahmed Ibrahim, Hans G. Kerkhoff
Published in:
2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2016, Page(s) 97-102, ISBN 978-1-5090-3623-3
Publisher:
IEEE
DOI:
10.1109/DFT.2016.7684077
Author(s):
Ahmed Ibrahim, Hans G. Kerkhoff
Published in:
2016 21th IEEE European Test Symposium (ETS), 2016, Page(s) 1-6, ISBN 978-1-4673-9659-2
Publisher:
IEEE
DOI:
10.1109/ETS.2016.7519301
Author(s):
J. Alt, P. Bernardi, A. Bosio, R. Cantoro, H. Kerkhoff, A. Leininger, W. Molzer, A. Motta, C. Pacha, A. Pagani, A. Rohani, R. Strasser
Published in:
2016 IEEE 34th VLSI Test Symposium (VTS), 2016, Page(s) 1-4, ISBN 978-1-4673-8454-4
Publisher:
IEEE
DOI:
10.1109/VTS.2016.7477278
Author(s):
Gadi Aleksandrowicz, Eli Arbel, Roderick Bloem, Timon Ter Braak, Sergei Devadze, Goerschwin Fey, Maksim Jenihhin, Artur Jutman, Hans G. Kerkhoff, Robert Konighofer, Jan Malburg, Shiri Moran, Jaan Raik, Gerard Rauwerda, Heinz Riener, Franz Rock, Konstantin Shibin, Kim Sunesen, Jinbo Wan, Yong Zhao
Published in:
2016 Forum on Specification and Design Languages (FDL), 2016, Page(s) 1-8, ISBN 979-10-92279-17-7
Publisher:
IEEE
DOI:
10.1109/FDL.2016.7880382
Author(s):
Jan Malburg, Heinz Riener, Goerschwin Fey (DLR)
Published in:
2017
Publisher:
DUHDe
Author(s):
Heinz Riener and Goerschwin Fey (DLR)
Published in:
2017
Publisher:
DUHDe
Author(s):
Tino Flenker and Goerschwin Fey (DLR)
Published in:
2017
Publisher:
DDECS
Author(s):
Heinz Riener, Ruediger Ehlers, and Goerschwin Fey (DLR)
Published in:
2017
Publisher:
MBMV
Author(s):
Siavoosh Payandeh Azad, Behrad Niazmand, Karl Janson, Thilo Kogge, Jaan Raik, Gert Jervan, Thomas Hollstein (Tallinn UT)
Published in:
2017
Publisher:
ISCAS
Author(s):
Siavoosh Payandeh Azad, Behrad Niazmand, Apneet Kaur Sandhu, Jaan Raik, Gert Jervan, Thomas Hollstein (Tallinn UT)
Published in:
2017
Publisher:
IEEE
Author(s):
Siavoosh Payandeh Azad, Behrad Niazmand, Karl Janson, Nevin George, Adeboye Stephen Oyeniran, Tsotne Putkaradze, Apneet Kaur, Jaan Raik, Gert Jervan, Raimund Ubar, Thomas Hollstein (Tallinn UT)
Published in:
2017
Publisher:
DDECS
Author(s):
Heinz Riener, Rüdiger Ehlers, Görschwin Fey (DLR)
Published in:
2017
Publisher:
ASP-DAC’17
Author(s):
Jan Malburg, Tino Flenker, Görschwin Fey (DLR)
Published in:
2017
Publisher:
ASP-DAC
DOI:
10.1109/ASPDAC.2017.7858327
Author(s):
Rudiger Ehlers, Robert Konighofer, Roderick Bloem
Published in:
2015 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2015, Page(s) 3478-3485, ISBN 978-1-4799-9994-1
Publisher:
IEEE
DOI:
10.1109/IROS.2015.7353862
Author(s):
Jaan Raik
Published in:
2015 International Conference on High Performance Computing & Simulation (HPCS), 2015, Page(s) 561-562, ISBN 978-1-4673-7813-0
Publisher:
IEEE
DOI:
10.1109/HPCSim.2015.7237092
Author(s):
K. Shibin, S. Devadze, A. Jutman
Published in:
2016
Publisher:
IEEE
Author(s):
Niels Thole, Lorena Anghel, and Goerschwin Fey
Published in:
2016
Publisher:
IEEE
Author(s):
Heinz Riener, Robert Könighofer, Görschwin Fey, and Roderick Bloem
Published in:
2016
Publisher:
IEEE
Author(s):
A. Zambrano
Published in:
2016
Publisher:
IOLTS
Author(s):
Tino Flenker and Goerschwin Fey
Published in:
2016
Publisher:
IEEE
Author(s):
G. Ali , A. Badewy and H.G. Kerkhoff
Published in:
2016
Publisher:
IEEE
Author(s):
Pietro Saltarelli, Behrad Niazmand, Jaan Raik, Ranganathan Hariharan, Gert Jervan, Thomas Hollstein
Published in:
2015 Euromicro Conference on Digital System Design, 2015, Page(s) 288-292, ISBN 978-1-4673-8035-5
Publisher:
IEEE
DOI:
10.1109/DSD.2015.15
Author(s):
Pietro Saltarelli, Behrad Niazmand, Ranganathan Hariharan, Jaan Raik, Gert Jervan, Thomas Hollstein
Published in:
2015 10th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC), 2015, Page(s) 1-8, ISBN 978-1-4673-7942-7
Publisher:
IEEE
DOI:
10.1109/ReCoSoC.2015.7238079
Author(s):
Pietro Saltarelli, Behrad Niazmand, Jaan Raik, Vineeth Govind, Thomas Hollstein, Gert Jervan, Ranganathan Hariharan
Published in:
Proceedings of the 9th International Symposium on Networks-on-Chip - NOCS '15, 2015, Page(s) 1-8, ISBN 9781-450333962
Publisher:
ACM Press
DOI:
10.1145/2786572.2788713
Author(s):
Karputkin, Anton; Raik, Jaan
Published in:
2016
Publisher:
IEEE
Author(s):
Artjom Jasnetski, Jaan Raik, Anton Tsertov, Raimund Ubar
Published in:
2015 IEEE 18th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2015, Page(s) 251-254, ISBN 978-1-4799-6780-3
Publisher:
IEEE
DOI:
10.1109/DDECS.2015.56
Author(s):
Jenihhin, Maksim; Squillero, Giovanni; Copetti, Thiago Santos; Tihhomirov, Valentin; Kostin, Sergei; Gaudesi, Marco; Vargas, Fabian; Raik, Jaan; Sonza Reorda, Matteo; Bolzani Poehls, Leticia; Ubar, Raimund; Medeiros, Guilherme Cardoso
Published in:
Journal of Electronic Testing-Theory and Applications (JETTA), 2016
Publisher:
SPRINGER
Author(s):
Patrick Klampfl, Robert Könighofer, Roderick Bloem, Ayrat Khalimov, Aiman Abu-Yonis, Shiri Moran
Published in:
2017
Publisher:
CoRR abs/1712.04291
Author(s):
Gadi Aleksandrowicz, Eli Arbel, Roderick Bloem, Timon D. ter Braak, Sergei Devadze, Goerschwin Fey, Maksim Jenihhin, Artur Jutman, Hans G. Kerkhoff, Robert Könighofer, Shlomit Koyfman, Jan Malburg, Shiri Moran, Jaan Raik, Gerard Rauwerda, Heinz Riener, Franz Röck, Konstantin Shibin, Kim Sunesen, Jinbo Wan, Yong Zhao
Published in:
2018, Page(s) 15-38
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-62920-9_2
Author(s):
G. Ali, H. Ebrahimi, J. Pathrose and H.G. Kerkhoff
Published in:
2018
Publisher:
submitted to Industrial Cyber-Physical Systems (ICPS)
Author(s):
Ofenloch, Annika and Greif, Fabian
Published in:
Journal of Communications, 2018
Publisher:
Journal of Communications
Author(s):
A. Jutman, K. Shibin, S. Devadze (Testonica Lab)
Published in:
2016, Page(s) 240-249
Publisher:
AUTOTESTCON’2016
Author(s):
Bernhard Aichernig, Roderick Bloem, Franz Pernkopf, Franz Röck, Tobias Schrank and Martin Tappler (TU Graz)
Published in:
2016
Publisher:
IEEE Symposium on Security and Privacy
Author(s):
Bernhard K. Aichernig, Harald Brandl, Elisabeth Jöbstl, Willibald Krenn, Rupert Schlick, Stefan Tiran
Published in:
Software Testing, Verification and Reliability, Issue 25/8, 2015, Page(s) 716-748, ISSN 0960-0833
Publisher:
John Wiley & Sons Inc.
DOI:
10.1002/stvr.1522
Author(s):
Konstantin Shibin, Sergei Devadze, Artur Jutman, Martin Grabmann, Robin Pricken
Published in:
IEEE Design & Test, Issue 34/6, 2017, Page(s) 27-35, ISSN 2168-2356
Publisher:
IEEE Computer Society
DOI:
10.1109/MDAT.2017.2750902
Author(s):
Maksim Jenihhin, Giovanni Squillero, Thiago Santos Copetti, Valentin Tihhomirov, Sergei Kostin, Marco Gaudesi, Fabian Vargas, Jaan Raik, Matteo Sonza Reorda, Leticia Bolzani Poehls, Raimund Ubar, Guilherme Cardoso Medeiros
Published in:
Journal of Electronic Testing, Issue 32/3, 2016, Page(s) 273-289, ISSN 0923-8174
Publisher:
Kluwer Academic Publishers
DOI:
10.1007/s10836-016-5589-x
Author(s):
Heinz Riener, Finn Haedicke, Stefan Frehse, Mathias Soeken, Daniel Große, Rolf Drechsler, Goerschwin Fey
Published in:
International Journal on Software Tools for Technology Transfer, 2016, ISSN 1433-2779
Publisher:
Springer Verlag
DOI:
10.1007/s10009-016-0426-1
Author(s):
Jan Malburg, Alexander Finder, Görschwin Fey (DLR)
Published in:
Journal of Microprocessors and Microsystems: Embedded Hardware Design (MICPRO), 2016, ISSN 0141-9331
Publisher:
Elsevier BV
Author(s):
Jinbo Wan, Hans Kerkhoff, Jaap Bisschop
Published in:
IEEE Transactions on Nanotechnology, 2016, Page(s) 1-1, ISSN 1536-125X
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/TNANO.2015.2505092
Author(s):
Vain,Jüri; Tsiopoulos, Leonidas; Kharchenko, Vyacheslav; Kaur, Apneet; Jenihhin, Maksim; Raik, Jaan; Nõmm Sven
Published in:
Green-IT Engineering: Social, Business and Industrial Applications (1−21), 2018
Publisher:
Springer
Author(s):
Roderick Bloem, Rüdiger Ehlers, Robert Könighofer
Published in:
Automated Technology for Verification and Analysis, 2015, Page(s) 394-410, ISBN 978-3-319-24953-7
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-24953-7_29
Author(s):
Roderick Bloem, Daniel Hein, Franz Röck, Richard Schumi
Published in:
Tests and Proofs, 2015, Page(s) 58-75, ISBN 978-3-319-21215-9
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-319-21215-9_4
Intellectual Property Rights
Application/Publication number:
US
9483591
Date:
2015-11-27
Applicant(s):
IBM ISRAEL - SCIENCE AND TECHNOLOGY LTD
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