Imaging analysis in all lighting and off weather conditions

Projektinformationen

I-ALLOW

ID Finanzhilfevereinbarung: 645262

DOI

10.3030/645262

Projekt abgeschlossen

EK-Unterschriftsdatum 16 Dezember 2014

Startdatum 1 Januar 2015

Enddatum 30 April 2017

Finanziert unter

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Gesamtkosten

€ 2 409 223,00

EU-Beitrag

€ 2 409 223,00

Koordiniert durch

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium

Periodic Reporting for period 2 - I-ALLOW (Imaging analysis in all lighting and off weather conditions)

Berichtszeitraum: 2016-01-01 bis 2017-04-30

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

So far, in year 1, the consortium has achieved several parts of the targeted camera: an imaging module, the illuminator module and the processing sub-system.
The imaging module is not yet final, it is still based on a commercially available image sensor.
There were 2 delays in the delivery of the image sensor wafers: the first one caused by the alignment markers of BWV’s subcontractor that did not correspond with the equipment at IMEC’s cleanroom. A second one was caused by the limited production capacity at BWV’s subcontractor. This resulted in a 1st amendment.
To not further delay the project, it was decided to proceed with the filter design (but to simulate and validate on paper and blank wafers), and the development of an imaging module, based on a commercially available image sensor. This allows us to perform some work in parallel.
In the second year, when the hyperspectral filter is applied to BWV’s image sensor wafers, it will need to be integrated and tested on all levels of the camera development.
Also in the first year, all test-cases were specified and planned.

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

During the first year of the project, the consortium partners have made progress on the technical as well as the more management aspects.
Technical aspects:
First of all, all the requirements were collected.
In a second phase, the 3 technical levels have made the following progress
- Sensors and Filters:
• Further discussion and conclusion on the alignment markers
• Detailed specifications on the design of the filters
• Various filter designs were created and simulated
• Several of these designs were validated on paper and on blank wafers
• The image sensor wafers of BWV arrived at IMEC just before the end of year 1
- Camera Sub-system
• Detailed specification of the camera sub-system
• Development of the imaging module, based on a commercially available image sensor, awaiting IMEC’s hyperspectral image sensor.
• Development of the illuminator module
• Integration of the imaging and illuminator module into the camera sub-system
- Integrated system
• Detailed specification of the full system
• Definition of the Processing sub-system
• Physical and logical integration of the processing sub-system
Management aspects
Throughout the first year of the project, effort was spent on:
• Setting up the project
• Gathering the requirements, taking into account the ethical requirements
• Performing a thorough risk assessment
• Initiating the dissemination and exploitation of the project results
• Defining and planning the test phase

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

Since the integration of the camera is not yet complete, we still need to wait for the first results.

Physical integration