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CORDIS - Risultati della ricerca dell’UE
CORDIS

Extended Image Sensing Technologies

Risultati finali

Second Benchmarking report
First Benchmarking report
Public final evaluation results

o Censored version of deliverable D3.5, that can be published

Final Public Demonstrator Results

Shortened version of summary of the performance of all demonstrators to be published outside the consortium

Pubblicazioni

Adimec_and_partners_awarded_two_projects_developing_next_generation_image_sensor_and_camera_technologies

Autori: ADMIEC
Pubblicato in: Press Release, 2016
Editore: -

CCD-in-CMOS Time Delay Integration Imagers: the best of 2 worlds

Autori: Piet De Moor
Pubblicato in: 2017
Editore: -

Time Delay Integration CCD-in-CMOS platform development

Autori: Pierre Boulenc, Linkun Wu, Vasyl Motsnyi, David San Segundo Bello, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans, Piet De Moor
Pubblicato in: 2017
Editore: -

TDI imaging using embedded CCD in CMOS technology: the optimal solution for low orbit earth observation

Autori: Piet De Moor, Paul Goetschalckx, Jonathan Borremans, Maarten Rosmeulen, Luc Haspeslagh, Andy Lambrechts
Pubblicato in: 2016
Editore: -

TDI Imaging Using CCD-in-CMOS Technology: An Optimal Solution for Earth Observation, Industrial Inspection and Life Sciences Applications

Autori: Piet De Moor
Pubblicato in: 2017
Editore: -

New image sensor technologies for enhanced vision systems

Autori: Piet De Moor
Pubblicato in: 2018
Editore: -

Ultimate earth observation using time delay integration line scan imagers using the CCD-in-CMOS technology

Autori: P. De Moor, Paul Goetschalckx, Maarten Rosmeulen, Luc Haspeslagh, David San Segundo Bello, Pierre Boulenc, Steven Thijs, Stefano Guerrieri
Pubblicato in: 2018
Editore: -

Multispectral time delay integration line scan imagers using CCD-in-CMOS technology

Autori: Piet De Moor
Pubblicato in: 2018
Editore: -

Goals and directions of the newly started EXIST project

Autori: Piet De Moor
Pubblicato in: 2015
Editore: -

Multispectral Time Delay Integration imager using CCD-in-CMOS technology

Autori: Piet De Moor et al
Pubblicato in: 2018
Editore: -

CCD-in-CMOS Platform for Time Delay Integration

Autori: David San Segundo Bello, Pierre Boulenc, Linkun Wu, Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans, Piet De Moor
Pubblicato in: 2018
Editore: -

Imec presented a poster about the EXIST project

Autori: -
Pubblicato in: 2015
Editore: -

Imec advertised both the CCD-in-CMOS TDI technology and the hyperspectral imaging systems at a booth at the SPIE Photonics West show (Jan 30th – Feb 1st 2018, San Francisco, US)

Autori: -
Pubblicato in: 2018
Editore: -

Goals and directions of the newly started EXIST project.

Autori: Piet De Moor et al.
Pubblicato in: Advanced Concepts for Intelligent Vision Systems, 2015
Editore: Springer

CMOS Image Sensors: Masterpieces of 3D Integration

Autori: Albert Theuwissen
Pubblicato in: 6th Fraunhofer CMOS Image Sensor workshop, 2016
Editore: Fraunhofer

CMOS Image Sensors: Masterpieces of 3D Integration

Autori: Albert Theuwissen
Pubblicato in: Norwegian Electro-Optical meeting, 2016
Editore: Norwegian Electro-Optical Society

Noise : You Love It or You Hate It

Autori: Albert Theuwissen
Pubblicato in: ISSCC, 2016
Editore: IEEE

CMOS Image Sensors: Masterpieces of 3D integration

Autori: Albert Theuwissen
Pubblicato in: Workshop Smart Sensors, Delft University of Technology, 2016
Editore: Delft University

A new way of seeing tissues

Autori: Nanda van der Stap et al.
Pubblicato in: 24th International Congress of the European Association of Endoscopic Surgery, 2016
Editore: TNO

Spectral imaging “Beyond Vision” and even “Beyond Silicon: High potential does EXIST!

Autori: Fokko P. Wieringa
Pubblicato in: 2016
Editore: TNO

High-speed and TDI CMOS imagers for machine vision, life-sciences, remote sensing and scientific applications

Autori: Jonathan Borremans
Pubblicato in: SPIE Industry Events at SPIE defense and commercial sensing, 2016
Editore: SPIE

EXIST project poster

Autori: JU ECSEL office with input from Piet De Moor, IMEC
Pubblicato in: European Nanoelectronics Forum, 2015
Editore: European Commission

CMOS-based hyperspectral imaging enabling innovation in health care, agriculture and food safety

Autori: Jerome Baron
Pubblicato in: SPIE Industry Events at SPIE defense and commercial sensing, 2016
Editore: SPIE

A 7-band CCD-in-CMOS multispectral TDI imager

Autori: David San Segundo Bello, Maarten De Bock, Pierre Boulenc, Roeland Vandebriel, Linkun Wu, Jan Van Olmen, Vezio Malandruccolo, Jan Craninckx, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans
Pubblicato in: International Image Sensor Workshop 2017, 2017, Pagina/e 129-132
Editore: -

High speed TDI embedded CCD in CMOS sensor

Autori: P. Boulenc, J. Robbelein, Linkun Wu, L. Haspeslagh, P. De Moor, J. Borremans, M. Rosmeulen
Pubblicato in: International Conference on Space Optics — ICSO 2016, 2017, Pagina/e 152, ISBN 9781-510616141
Editore: SPIE
DOI: 10.1117/12.2296149

High speed backside illuminated TDI CCD-in-CMOS sensor

Autori: Pierre Boulenc, Jo Robbelein, Linkun Wu, Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Jonathan Borremans, Maarten Rosmeulen
Pubblicato in: International Image Sensor Workshop 2017, 2017, Pagina/e 364-367
Editore: -

A first order analytical TOD sensor performance model

Autori: Piet Bijl, Maarten A. Hogervorst
Pubblicato in: Electro-Optical and Infrared Systems: Technology and Applications XIII, Numero 9987, 2016, Pagina/e 99870P
Editore: SPIE
DOI: 10.1117/12.2242262

Progress in sensor performance testing, modeling and range prediction using the TOD method: an overview

Autori: Piet Bijl, Maarten A. Hogervorst, Alexander Toet
Pubblicato in: Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVIII, Numero 10178, 2017, Pagina/e 101780U
Editore: SPIE
DOI: 10.1117/12.2266788

High speed TDI embedded CCD in CMOS sensor

Autori: Pierre Boulenc, Jo Robbelein, Linkun Wu, Luc Haspeslagh, Piet De Moor, Jonathan Borremans, Maarten Rosmeulen
Pubblicato in: International Conference on Space Optics 2016 proceedings, Numero Every 2 years, 2016
Editore: CNES / ESA

Joint denoising, demosaicing, and chromatic aberration correction for UHD video

Autori: Ljubomir Jovanov, Wilfried Philips, Klaas Jan Damstra, Frank Ellenbroek,
Pubblicato in: Applications of Digital Image Processing XL, Proceedings of SPIE Vol. 10396, 2017, Pagina/e 10396-2, ISBN 9781-510612495
Editore: SPIE

Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

Autori: C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, and H. Osman
Pubblicato in: ECS Transastions 2016, Numero volume 75, issue 7, 2016, Pagina/e 43-46
Editore: ECS transactions

Rotation invariant similarity measure for non-local self-similarity based image denoising

Autori: Chenglin Zuo, Ljubomir Jovanov, Hiep Quang Luong, Bart Goossens, Wilfried Philips, Yu Liu, Maojun Zhang
Pubblicato in: 2015 IEEE International Conference on Image Processing (ICIP), 2015, Pagina/e 1618-1622, ISBN 978-1-4799-8339-1
Editore: IEEE
DOI: 10.1109/ICIP.2015.7351074

HDR video synthesis for vision systems in dynamic scenes

Autori: Shopovska, I. and Jovanov, L. and Goossens, B. and Philips, W.
Pubblicato in: Applications of Digital Image Processing XXXIX, Proceedings of SPIE Vol. 9971, 2016
Editore: SPIE

High Dynamic Range Spectral Imaging Pipeline For Multispectral Filter Array Cameras

Autori: Pierre-Jean Lapray, Jean-Baptiste Thomas, Pierre Gouton
Pubblicato in: Sensors, Numero 17/6, 2017, Pagina/e 1281, ISSN 1424-8220
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s17061281

Energy balance in Spectral Filter Array camera design

Autori: Pierre-Jean Lapray, Jean-Baptiste Thomas, Pierre Gouton, Yassine Ruichek
Pubblicato in: Journal of the European Optical Society-Rapid Publications, Numero 13/1, 2017, ISSN 1990-2573
Editore: Institute of Physics Publishing
DOI: 10.1186/s41476-016-0031-7

Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

Autori: C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, H. Osman
Pubblicato in: ECS Transactions, Numero 75/7, 2016, Pagina/e 43-46, ISSN 1938-5862
Editore: Electrochemical Society, Inc.
DOI: 10.1149/07507.0043ecst

Content-aware objective video quality assessment

Autori: Benhur Ortiz-Jaramillo, Jorge Niño-Castañeda, Ljiljana Platiša, Wilfried Philips
Pubblicato in: Journal of Electronic Imaging, Numero 25/1, 2016, Pagina/e 013011, ISSN 1017-9909
Editore: S P I E - International Society for Optical Engineering
DOI: 10.1117/1.JEI.25.1.013011

Paper No S8.3: Content Capture and View Interpolation Algorithm for Multiview Autostereoscopic Displays

Autori: Ljubomir Jovanov, Hiep Luong, Wilfried Philips
Pubblicato in: SID Symposium Digest of Technical Papers, Numero 46/S1, 2015, Pagina/e 35-35, ISSN 0097-966X
Editore: Society for Information Display-SID
DOI: 10.1002/sdtp.10572

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