Objective
PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated towards establishing a pool of meaningful elementary plasmonic waveguides on co-planar photonic (Si, SiO2 and SiN) platforms along with the associated photonic-plasmonic interfaces. The functional advantages of PLASMOfab technology will be practically demonstrated by developing two novel functional prototypes with outstanding performances:
1) a compact, plasmonic bio-sensor for label-free inflammation markers detection with multichannel capabilities and record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, high-speed biofunctionalization techniques and microfluidics
2) a 100 Gb/s NRZ transmitter for datacom applications by consolidating low energy and low footprint plasmonic modulator and ultra high-speed SiGe driving electronics in a single monolithic chip.
The new integration technology will be verified through wafer-scale fabrication of the prototypes at commercial CMOS fabs, demonstrating volume manufacturing and cost reduction capabilities. PLASMOfab technology will be supported by an EDA software design kit library paving the way for a standardized, fabless plasmonic/photonic IC eco-system.
Fields of science
- natural sciencesphysical sciencesclassical mechanicsfluid mechanicsmicrofluidics
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsbiosensors
- engineering and technologyenvironmental biotechnologybiosensing
- natural scienceschemical sciencesinorganic chemistrytransition metals
- natural sciencesbiological sciencesbiochemistrybiomoleculesproteins
Programme(s)
Topic(s)
Funding Scheme
RIA - Research and Innovation actionCoordinator
546 36 Thessaloniki
Greece
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Participants (10)
21078 Dijon Cedex
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
75794 Paris
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8092 Zuerich
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52074 Aachen
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
8141 Unterpremstatten
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44801 Bochum
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
66123 Saarbrucken
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20692 Yokneam
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7521 PL Enschede
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
1210 Wien
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