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A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices

Objectif

PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated towards establishing a pool of meaningful elementary plasmonic waveguides on co-planar photonic (Si, SiO2 and SiN) platforms along with the associated photonic-plasmonic interfaces. The functional advantages of PLASMOfab technology will be practically demonstrated by developing two novel functional prototypes with outstanding performances:
1) a compact, plasmonic bio-sensor for label-free inflammation markers detection with multichannel capabilities and record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, high-speed biofunctionalization techniques and microfluidics
2) a 100 Gb/s NRZ transmitter for datacom applications by consolidating low energy and low footprint plasmonic modulator and ultra high-speed SiGe driving electronics in a single monolithic chip.
The new integration technology will be verified through wafer-scale fabrication of the prototypes at commercial CMOS fabs, demonstrating volume manufacturing and cost reduction capabilities. PLASMOfab technology will be supported by an EDA software design kit library paving the way for a standardized, fabless plasmonic/photonic IC eco-system.

Appel à propositions

H2020-ICT-2015
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Coordinateur

ARISTOTELIO PANEPISTIMIO THESSALONIKIS
Adresse
Kedea Building, Tritis Septemvriou, Aristotle Univ Campus
54636 Thessaloniki
Greece
Type d’activité
Higher or Secondary Education Establishments
Contribution de l’UE
€ 612 500

Participants (9)

UNIVERSITE DIJON BOURGOGNE
France
Contribution de l’UE
€ 430 200
Adresse
Esplanade Erasme Maison De L Universite
21078 Dijon Cedex
Type d’activité
Higher or Secondary Education Establishments
EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH
Suisse
Contribution de l’UE
€ 0
Adresse
Raemistrasse 101
8092 Zuerich
Type d’activité
Higher or Secondary Education Establishments
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Allemagne
Contribution de l’UE
€ 429 860
Adresse
Otto Blumenthal Strasse
52074 Aachen
Type d’activité
Other
AMS AG
Autriche
Contribution de l’UE
€ 502 833,75
Adresse
Tobelbaderstrasse 30
8141 Unterpremstaetten
Type d’activité
Private for-profit entities (excluding Higher or Secondary Education Establishments)
MICRAM MICROELECTRONIC GMBH
Allemagne
Contribution de l’UE
€ 281 265
Adresse
Konrad Zuse Strasse 16
44801 Bochum
Type d’activité
Private for-profit entities (excluding Higher or Secondary Education Establishments)
UNIVERSITAT DES SAARLANDES
Allemagne
Contribution de l’UE
€ 225 000
Adresse
Campus
66123 Saarbrucken
Type d’activité
Higher or Secondary Education Establishments
MELLANOX TECHNOLOGIES LTD - MLNX
Israël
Contribution de l’UE
€ 355 000
Adresse
Yokneam Ilit Industrial Zone - Hermon Building
20692 Yokneam
Type d’activité
Private for-profit entities (excluding Higher or Secondary Education Establishments)
SYNOPSYS SOFTWARE NETHERLANDS BV
Pays-Bas
Contribution de l’UE
€ 244 188,75
Adresse
Capitool 50
7521 PL Enschede
Type d’activité
Private for-profit entities (excluding Higher or Secondary Education Establishments)
AIT AUSTRIAN INSTITUTE OF TECHNOLOGY GMBH
Autriche
Contribution de l’UE
€ 499 843,75
Adresse
Giefinggasse 4
1210 Wien
Type d’activité
Research Organisations