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A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices

Obiettivo

PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated towards establishing a pool of meaningful elementary plasmonic waveguides on co-planar photonic (Si, SiO2 and SiN) platforms along with the associated photonic-plasmonic interfaces. The functional advantages of PLASMOfab technology will be practically demonstrated by developing two novel functional prototypes with outstanding performances:
1) a compact, plasmonic bio-sensor for label-free inflammation markers detection with multichannel capabilities and record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, high-speed biofunctionalization techniques and microfluidics
2) a 100 Gb/s NRZ transmitter for datacom applications by consolidating low energy and low footprint plasmonic modulator and ultra high-speed SiGe driving electronics in a single monolithic chip.
The new integration technology will be verified through wafer-scale fabrication of the prototypes at commercial CMOS fabs, demonstrating volume manufacturing and cost reduction capabilities. PLASMOfab technology will be supported by an EDA software design kit library paving the way for a standardized, fabless plasmonic/photonic IC eco-system.

Invito a presentare proposte

H2020-ICT-2015
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Meccanismo di finanziamento

RIA - Research and Innovation action

Coordinatore

ARISTOTELIO PANEPISTIMIO THESSALONIKIS
Indirizzo
Kedea Building, Tritis Septemvriou, Aristotle Univ Campus
54636 Thessaloniki
Greece
Tipo di attività
Higher or Secondary Education Establishments
Contributo UE
€ 612 500

Partecipanti (9)

UNIVERSITE DIJON BOURGOGNE
Francia
Contributo UE
€ 430 200
Indirizzo
Esplanade Erasme Maison De L Universite
21078 Dijon Cedex
Tipo di attività
Higher or Secondary Education Establishments
EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH
Svizzera
Contributo UE
€ 0
Indirizzo
Raemistrasse 101
8092 Zuerich
Tipo di attività
Higher or Secondary Education Establishments
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Germania
Contributo UE
€ 429 860
Indirizzo
Otto Blumenthal Strasse
52074 Aachen
Tipo di attività
Other
AMS AG
Austria
Contributo UE
€ 502 833,75
Indirizzo
Tobelbaderstrasse 30
8141 Unterpremstaetten
Tipo di attività
Private for-profit entities (excluding Higher or Secondary Education Establishments)
MICRAM MICROELECTRONIC GMBH
Germania
Contributo UE
€ 281 265
Indirizzo
Konrad Zuse Strasse 16
44801 Bochum
Tipo di attività
Private for-profit entities (excluding Higher or Secondary Education Establishments)
UNIVERSITAT DES SAARLANDES
Germania
Contributo UE
€ 225 000
Indirizzo
Campus
66123 Saarbrucken
Tipo di attività
Higher or Secondary Education Establishments
MELLANOX TECHNOLOGIES LTD - MLNX
Israele
Contributo UE
€ 355 000
Indirizzo
Yokneam Ilit Industrial Zone - Hermon Building
20692 Yokneam
Tipo di attività
Private for-profit entities (excluding Higher or Secondary Education Establishments)
PHOENIX BV
Paesi Bassi
Contributo UE
€ 244 188,75
Indirizzo
Capitool 50
7521 PL Enschede
Tipo di attività
Private for-profit entities (excluding Higher or Secondary Education Establishments)
AIT AUSTRIAN INSTITUTE OF TECHNOLOGY GMBH
Austria
Contributo UE
€ 499 843,75
Indirizzo
Giefinggasse 4
1210 Wien
Tipo di attività
Research Organisations