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Metrology for future 3D-technologies

Objetivo

Within the food chain of equipment delivery for the semiconductor industry, Europe has kept a very strong position in the metrology area with many companies establishing themselves as main leaders in the field. Hence in line with the objectives of the ICT25 call for innovation action to overcome the (initial) barriers for the successful commercialization of novel European products, this project aims at exploring for a number of metrology solutions their technological readiness, reliability and relevance of the developed protocols, and the COO. The portfolio within the project covers new metrology concepts addressing specifically the processing challenges linked to 3D-Devices and range from probing basic layer properties (composition, electrical properties) in FEOL to control of metallization in BEOL up to issues linked to die stacking.
Due to the specific processing steps which need to be addressed, three separate metrology tools will be assessed in this project i.e a Tofsims system (IonTOF) with build-in Scanning Probe stage and FIB column for true 3D-composition profiling, a completely automated micro-Hall and sheet resistance measurement tool (Capres) with additional capabilities for measurements on dedicated test structures (prior to full BEOL) and an GHz acoustic Microscope (Tepla) for probing voids in TSV’s and stacked dies. As some of them (IonTOf, Capres) are addressing partly complementary information (composition versus electrical properties), their co-existence in this project creates additional value as beyond the tool assessment also a methodology based on combining these concepts can be explored and certified. Moreover a significant efficiency gain is created as they can employ similar test structures and devices. For each of these tools, the basic metrology concepts are existing and validated in the lab on selected applications but their general applicability field within the semiconductor industry still needs to be established

Convocatoria de propuestas

H2020-ICT-2015
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Régimen de financiación

IA - Innovation action

Coordinador

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Dirección
Kapeldreef 75
3001 Leuven
Bélgica
Tipo de actividad
Research Organisations
Aportación de la UE
€ 1 137 903,75

Participantes (9)

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Francia
Aportación de la UE
€ 249 221,25
Dirección
Rue Leblanc 25
75015 Paris 15
Tipo de actividad
Research Organisations
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Alemania
Aportación de la UE
€ 246 325
Dirección
Hansastrasse 27C
80686 Munchen
Tipo de actividad
Research Organisations
MATERIALS CENTER LEOBEN FORSCHUNG GMBH
Austria
Aportación de la UE
€ 234 136,25
Dirección
Roseggerstrasse 12
8700 Leoben
Tipo de actividad
Research Organisations
DANMARKS TEKNISKE UNIVERSITET
Dinamarca
Aportación de la UE
€ 300 473,75
Dirección
Anker Engelundsvej 1 Bygning 101 A
2800 Kgs Lyngby
Tipo de actividad
Higher or Secondary Education Establishments
EIDGENOSSISCHE MATERIALPRUFUNGS- UND FORSCHUNGSANSTALT
Suiza
Aportación de la UE
€ 0
Dirección
Ueberlandstrasse 129
8600 Dubendorf
Tipo de actividad
Higher or Secondary Education Establishments
ION-TOF TECHNOLOGIES GMBH
Alemania
Aportación de la UE
€ 117 600
Dirección
Heisenbergstrasse 15
48149 Munster
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
CAPRES AS
Dinamarca
Aportación de la UE
€ 301 875
Dirección
Diplomvej 373
2800 Kgs. Lyngby
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
PVA TEPLA ANALYTICAL SYSTEMS GMBH
Alemania
Aportación de la UE
€ 101 500
Dirección
Deutschordenstrasse 38
73463 Westhausen
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
LAM RESEARCH BELGIUM
Bélgica
Aportación de la UE
€ 0
Dirección
Kapeldreef 75
3001 Leuven
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)