Skip to main content

High density scalable optically interconnected Tb/s Board

Objective

Optical communications are becoming always more relevant because of the continuous growth of the requiested bandwidth. In the last decade we assisted a continuous growing of transport and metro netwotks, presently the bottleneck is in the processing of the huge amount of data constituted by the growing number of users, the capacity of the content that is exchanged and the convergence of Telecom and Datacom. This accumulation of data are elaborated and redirected within data centers with a continuous growing of traffic congestion. The continuous growth of traffic require therefore a roadmap of bandwidth density growth that necessarily has to be scalable on the timeframe of several years. To this point photonics plays a crucial role that is always more pervasive. However a major limiting factor is also arising from the energy cost and latency accumulated by the need of aggregation to route signals. To limitate this effect is necessary to make possible data exchange and processing without or with limited aggregation. Teraboard project consists in developing a full intra data center photonic platform for intraboard, intrarack and intra data center optical communications. The Teraboard interconnection platform will be based on ultra-high density and scalable bandwidth optical interconnectivity with low insertion loss and a target of lowest energy cost per channel of 2.5pJ/bit and a manufacturing cost of 0.1$/Gb/s in volumes. These target values are 10x reduction respect to commercial state of the art. Teraboard demonstrates: 1) passive, scalable, 3D inter processor interconnection layer, 2) novel WDM optical connector to plug the fiber ribbons directly onto the transceiver chip, 3) intraboard transceiver bank with high density bandwidth of 7Tb/s/cm2. Single wavelength laser arrays will be directly integrated on the silicon photonics transceiver circuits, 4) and edge single and four wavelength transceiver interface with bandwidth density of 50 and 7Tb/s/cm2 respectively.

Field of science

  • /natural sciences/computer and information sciences/data science/data exchange
  • /natural sciences/chemical sciences/inorganic chemistry/inorganic compounds
  • /social sciences/social and economic geography/transport
  • /engineering and technology/environmental engineering/waste management/energy efficiency
  • /natural sciences/physical sciences/optics/laser physics

Call for proposal

H2020-ICT-2015
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI
Address
Viale G. P. Usberti 181A
43124 Parma
Italy
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 1 029 750

Participants (7)

ERICSSON TELECOMUNICAZIONI SPA
Italy
EU contribution
€ 241 250
Address
Via Anagnina 203
00118 Roma
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
STMICROELECTRONICS SRL
Italy
EU contribution
€ 370 350
Address
Via C.olivetti 2
20864 Agrate Brianza
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium
EU contribution
€ 1 955 357,50
Address
Kapeldreef 75
3001 Leuven
Activity type
Research Organisations
NOKIA SOLUTIONS AND NETWORKS ITALIA SPA
Italy
EU contribution
€ 119 950
Address
Piazzale Biancamano 8
20121 Milano
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
CONSIGLIO NAZIONALE DELLE RICERCHE
Italy
EU contribution
€ 206 250
Address
Piazzale Aldo Moro 7
00185 Roma
Activity type
Research Organisations
UNIVERSITAT POLITECNICA DE VALENCIA
Spain
EU contribution
€ 270 000
Address
Camino De Vera Sn Edificio 3A
46022 Valencia
Activity type
Higher or Secondary Education Establishments
EUROPEAN PHOTONICS INDUSTRY CONSORTIUM
France
EU contribution
€ 56 250
Address
Rue Hamelin 17
75116 Paris 16
Activity type
Other