"
General Results
- All requirements specification defined: end-users, LED parameters, LED samples, modeling methodologies, simulation benchmarks, project demonstrators.
- Experience gained from all the measurements done by all the partners.
- A lot of work done for the preparation of the Round-Robin, 6 labs involved (+1 external). No information was available in literature for such RR.
- Established the framework for chip level multi-domain Spice-like modeling and package and luminaire level compact thermal modeling.
- CIE Technical committee TC 2-84 launchedm- 2 presentations held at Jeju (Jp) and Eindhoven (NL) meetings and 1 workshop held in Eindhoven
- “European Task force” specific discussions
- Participation at Lighthouse Industry 4.E
- Presentation at JEDEC (March2017, March2018)
- Website www.Delphi4led.org
- Create awareness to the public
- 14 publications in IEEE conferences and journals; 17 materials for outreach activities to the general public and 5 project demonstrators defined
WP1
- Requirements specification for creating LED Multi-domain compact models in Delphi4LED
- Identification of end-user and their requirements
- Output parameters and accuracy requirements from Delphi4LED partners
- Methodology of selecting representative LEDs for measurements (Round Robin and characterization), simulation, and demonstrators addressing aspects like e.g. #LED chip, different LED architecture, CCT, power ranges, applications, etc.
- Definition of LED simulation benchmark problems
- Identified methodologies to generate compact models based on:
- Measurements (Spice-like models)
- 3D FVM and RC-network optimization
- Mathematical model order reduction
- Defined project demonstrators
WP2
- Huge amount of samples selected, purchased, mounted and aged for the measurements
- More than 1000 measurements done
- JEDEC and CIE define different standards for LED testing: JEDEC focusing on Rth and CIE on optical properties which means two different methods of Tj setting
- Comparison and evaluation of the 2 methods is still in progress
- Many findings already: e.g. K-factor calibration, options to speed up measurements, etc
WP3
- Modular approach to compact modelling of LED based systems
- Multi-domain on chip level only
- Same techniques for package, module/luminaire level thermal compact modeling
- Improvement of chip level Spice-like LED multi-domain model
- Sources of inaccuracies identified
- Proposals for mitigation:
-Modified topology and model equations
- Minimal number of data points for parameter extraction suggested
WP4
- Awareness raised outside the consortium with positive reactions
- Contacts established with international standardisation bodies
- Challenge is that we cannot ensure the outcome of the voting within the standardization bodies
- In order to fully exploit the landing of the outcome of the project, follow up is required.
- We are already identifying the way forward to ensure the positive landing after this 3 year project. Further actions might be required to answer new identified questions gathered from feedbacks (CIE, JEDEC, EU Task Force).
WP5
- Project website running,
http://delphi4led.org/(si apre in una nuova finestra)- All following dissemination are available on our website:
10 IEEE publications
4 journal publications
2 education materials: Cooling of electronics magazine, contribution to the yearly book of the Hungarian lighting association
10 press releases in Finland, Hungary, France
4 exhibitions: Tiger meeting at Philips, Cluster Lumiere, ILIAD
ECSEL flyer
- 5 demonstrators defined
"
