Objective
The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits.
3DAM will be a path-finding project which supports and complements several existing and future ECSEL pilot-line projects and is linked to the MASP area 7.1 (subsection More Moore). Innovative demonstrators and methodologies will be built and evaluated within the themes of metrology and characterization of 3D device architectures and new materials, across the full IC manufacturing cycle from Front to Back-End-Of-Line. 3D structural metrology and defect analysis techniques will be developed and correlated to address challenges around 3D CD, strain and crystal defects at the nm scale. 3D compositional analysis and electrical properties will be investigated with special attention to interfaces, alloys and 2D materials. The project will develop new workflows combining different technologies for more reliable and faster results; fit for use in future semiconductor processes.
The consortium includes major European semiconductor equipment companies in the area of metrology and characterization. The link to future needs of the industry, as well as critical evaluation of concepts and demonstrators, is ensured by the participation of IMEC and LETI. The project will directly increase the competitiveness of the strong Europe-based semiconductor Equipment industry. Closely connected European IC manufacturers will benefit by accelerated R&D and process ramp-up. The project will generate technologies essential for future semiconductor processes and for the applications enabled by the new technology nodes.
Fields of science
- engineering and technologynanotechnologynano-materialstwo-dimensional nanostructures
- natural sciencesphysical sciencesopticsmicroscopy
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
- natural scienceschemical sciencesinorganic chemistrymetalloids
- engineering and technologynanotechnologynanoelectronics
Programme(s)
Call for proposal
H2020-ECSEL-2015-1-RIA-two-stage-Master
See other projects for this callSub call
H2020-ECSEL-2015-1-RIA-two-stage
Funding Scheme
ECSEL-RIA - ECSEL Research and Innovation ActionCoordinator
5651 GG Eindhoven
Netherlands
See on map
Participants (18)
76705 Rehovot
See on map
3001 Leuven
See on map
2595 DA Den Haag
See on map
76100 REHOVOT
See on map
2306990 Migdal Haemek
See on map
Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
DH1 1TW Durham
See on map
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
76187 Karlsruhe
See on map
75015 PARIS 15
See on map
1015 Lausanne
See on map
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
1117 BUDAPEST
See on map
92230 Gennevilliers
See on map
Participation ended
2 Dublin
See on map
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
33700 Merignac
See on map
38920 Crolles
See on map
5612 AE Eindhoven
See on map
2800 Kgs. Lyngby
See on map
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
2800 Kongens Lyngby
See on map
38190 Bernin
See on map