Ziel
The project targets the incorporation of advanced functional materials to deliver customised conductive inks and flexible adhesives compatible with high volume manufacturing platforms. Specifically the development of these enabling materials will support high speed roll to roll integration of hybrid and large area electronics to address internet of things opportunities
The consortium will integrate materials development with end application requirements in terms of technical performance (thermal/electrical conductivity, processing conditions, materials integrity and adhesion) and unit cost of production to facilitate market adoption. The project will utilise and build on existing CPI pilot facilities (R2R print line) to demonstrate technology integration, manufacturability and produce components for end user evaluation to enable the direct comparison of production techniques.
The project delivers a supply chain to support future commercialisation: incorporating materials suppliers of inks and adhesives, supporting RTO in Formulation and nano-particle production, established high fidelity print equipment manufacturers, electronic device manufacturers, established pilot line facilities and potential end users from the apparel, packaging and healthcare sector – relating to the internet of things.
Wissenschaftliches Gebiet
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradio frequency
- natural sciencesphysical scienceselectromagnetism and electronics
- engineering and technologynanotechnologynano-materialstwo-dimensional nanostructuresgraphene
- engineering and technologymaterials engineeringcomposites
- engineering and technologymaterials engineeringcoating and films
Programm/Programme
Aufforderung zur Vorschlagseinreichung
Andere Projekte für diesen Aufruf anzeigenUnterauftrag
H2020-NMBP-PILOTS-2016
Finanzierungsplan
IA - Innovation actionKoordinator
TS10 4RF Redcar Cleveland
Vereinigtes Königreich