Photonic Integrated Circuits Assembly and Packaging Pilot Line

Project Information

PIXAPP

Grant agreement ID: 731954

DOI 10.3030/731954

Closed project

EC signature date 3 November 2016

Start date 1 January 2017

End date 30 September 2021

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost € 15 690 921,43

EU contribution € 13 407 812,76

Coordinated by

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland