PIXAPP is ambitious, generating significant progress beyond state-of-the-art, resulting in increased innovation potential. To achieve this, advances beyond the state-of-the-art is required across a number of areas. These include:
• State-of-the-Art in PIC Assembly & Packaging Foundry Service
• State-of-the-Art in PIC Assembly & Packaging Technologies
• State-of-the-Art in PIC Packaging Design Rules
• State-of-the-Art in Generic PIC Packages
PIXAPP will contribute greatly to enhancing the innovation potential for a wide group of stakeholders. The innovation potential of all consortium partners will be greatly enhanced by the project results. The industrial technology partners (Argotech, Cordon, LioniX, Chipshop, ficonTEC and PhoeniX) will be more easily able to expand their services, and partner with complementary technology specialists. The innovation potential of the application/end-user partners (Randox, Eblana, IIIV Labs and Technobis) will be enhanced by the availability of demonstrators for their business development efforts along with the strategic experience of using the Pilot Line – particularly its potential for additional new product development.
PIXAPP will deliver a unified Open Access Pilot Line for the Assembly and Packaging of PICs, unleashing the power of photonics across multiple sectors. PIXAPP is a significant step forward in covering missing links in the value chain, and greatly enhances Europe’s industrial competiveness and leadership in advanced photonic technologies. By making the packaging and assembly of advanced PICs accessible to both companies and commercialisation-oriented research users, PIXAPP will galvanise and propel the photonics innovation communities at the regional, national, and EU level, greatly increasing the rate of new product innovation in emerging markets.
