Photonic Integrated Circuits Assembly and Packaging Pilot Line

Información del proyecto

PIXAPP

Identificador del acuerdo de subvención: 731954

DOI

10.3030/731954

Proyecto cerrado

Fecha de la firma de la CE 3 Noviembre 2016

Fecha de inicio 1 Enero 2017

Fecha de finalización 30 Septiembre 2021

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total

€ 15 690 921,43

Aportación de la UE

€ 13 407 812,76

Coordinado por

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Documents, reports (9)

Press release announcing Pilot Line project
Training activity report

Training activity report Mid interim Training activity report due on M24 and final report due M48.

Communication & dissemination yearly report 3

Communication & dissemination yearly report year 3

Communication & dissemination yearly report 4

Communication dissemination yearly report year 4

Large Scale Manufacturing of SiN Reference PICs for Industrial Packaging

This deliverable will report on the fabrication of 1000 SiN standardised reference PICs which will be used for large scale development and optimisation of fibre attachment processes The report will detail the yield quantity and initial testing results of the devices The report will also describe how these reference PICs will be used to support photonics assembly and equipment companies in Europe by acting as a universal gold standard reference

Communication & dissemination yearly report 1

Communication & dissemination yearly report Year 1

Pilot Line infrastructure inventory

Pilot Line infrastructure inventory (FIC)

Thermal management processes

Thermal management processes (TBS)

Communication & dissemination yearly report 2

Communication & dissemination yearly report year 2

Websites, patent fillings, videos etc. (5)

Project website, twitter account & social media profile
Final Communication Kit

Final communication kit to be sent to the commission as per WP4

Mid-termCommunication Kit

Communication kit to be sent to commission, as per WP4 Communication Requirements

Communication & dissemination plan

Communication & dissemination plan. Preparation of the PIXAPP data management plan (DMP), describing the data management life cycle for all datasets to be collected, processed and generated.

Project start communication kit

Communication kit to be sent to commission, as per WP4 Communication Requirements

Publicaciones

Conference proceedings (5)

Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting

Autores: T. Hoose, M. Blaicher, J. N. Kemal, H. Zwickel, M. R. Billah, P.-I. Dietrich, A. Hofmann, W. Freude, S. Randel, C. Koos
Publicado en: 2018 European Conference on Optical Communication (ECOC), Edición 23-27 Sept. 2018, 2018, Página(s) 1-3, ISBN 978-1-5386-4862-9
Editor: IEEE
DOI: 10.1109/ecoc.2018.8535258

Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production

Autores: C. Koos, W. Freude, S. Randel, M. R. Billah, M. Blaicher, P.-I. Dietrich, T. Hoose, Y. Xu, J. N. Kemal, A. Nesic, A. Hofmann
Publicado en: 2018 European Conference on Optical Communication (ECOC), Edición 23-27 Sept. 2018, 2018, Página(s) 1-2, ISBN 978-1-5386-4862-9
Editor: IEEE
DOI: 10.1109/ecoc.2018.8535426

Photonic-Electronic Ultra-Broadband Signal Processing: Concepts, Devices, and Applications

Autores: C. Koos, S. Randel, W. Freude, T. Zwick, J.C. Scheytt, J. Witzens, M. Walther, T. Harter, S. Ummethala, C. Kieninger, H. Zwickel, P. Marin-Palomo, S. Muehlbrandt, C. Fullner, J. Schaefer, S. Gudyriev, A. Zazzi, J. Muller, A. Tessmann
Publicado en: 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), Edición 16-19 Nov. 2020, 2020, Página(s) 1-3, ISBN 978-1-7281-9749-4
Editor: IEEE
DOI: 10.1109/bcicts48439.2020.9392969

3D-Printed Optics for Wafer-Scale Probing

Autores: Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Muhammad Rodlin Billah, Wolfgang Freude, Christian Koos
Publicado en: 2018 European Conference on Optical Communication (ECOC), Edición 23-27 Sept. 2018, 2018, Página(s) 1-3, ISBN 978-1-5386-4862-9
Editor: IEEE
DOI: 10.1109/ecoc.2018.8535123

Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics

Autores: C. Koos, W. Freude, S. Randel, P.-I. Dietrich, M. Blaicher, Y. Xu, M. R. Billah, T. Hoose, M. Trappen, A. Hofmann
Publicado en: 2018 20th International Conference on Transparent Optical Networks (ICTON), Edición 1-5 July 2018, 2018, Página(s) 1-2, ISBN 978-1-5386-6605-0
Editor: IEEE
DOI: 10.1109/icton.2018.8473851

Peer reviewed articles (8)

Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems

Autores: Philipp-Immanuel Dietrich, Robert J. Harris, Matthias Blaicher, Mark K. Corrigan, Tim J. Morris, Wolfgang Freude, Andreas Quirrenbach, Christian Koos
Publicado en: Optics Express, Edición 25/15, 2017, Página(s) 18288, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.25.018288

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Autores: Muhammad Rodlin Billah, Matthias Blaicher, Tobias Hoose, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Nicole Lindenmann, Aleksandar Nesic, Andreas Hofmann, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Publicado en: Optica, Edición 5/7, 2018, Página(s) 876, ISSN 2334-2536
Editor: Optica Publishing Group (formerly OSA)
DOI: 10.1364/optica.5.000876

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

Autores: P.-I. Dietrich, M. Blaicher, I. Reuter, M. Billah, T. Hoose, A. Hofmann, C. Caer, R. Dangel, B. Offrein, U. Troppenz, M. Moehrle, W. Freude, C. Koos
Publicado en: Nature Photonics, Edición 12/4, 2018, Página(s) 241-247, ISSN 1749-4885
Editor: Nature Pub. Group
DOI: 10.1038/s41566-018-0133-4

Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Autores: Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Yiyang Bao, Huanfa Peng, Muhammad Rodlin Billah, Stefan Singer, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Publicado en: Scientific Reports, Edición 11/1, 2021, Página(s) 16426, ISSN 2045-2322
Editor: Nature Publishing Group
DOI: 10.1038/s41598-021-95981-w

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Autores: Matthias Blaicher, Muhammad Rodlin Billah, Juned Kemal, Tobias Hoose, Pablo Marin-Palomo, Andreas Hofmann, Yasar Kutuvantavida, Clemens Kieninger, Philipp-Immanuel Dietrich, Matthias Lauermann, Stefan Wolf, Ute Troppenz, Martin Moehrle, Florian Merget, Sebastian Skacel, Jeremy Witzens, Sebastian Randel, Wolfgang Freude, Christian Koos
Publicado en: Light: Science & Applications, Edición 9/1, 2020, ISSN 2047-7538
Editor: Nature
DOI: 10.1038/s41377-020-0272-5

3D-printed optical probes for wafer-level testing of photonic integrated circuits

Autores: Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Colin Dankwart, Yilin Xu, Tobias Hoose, Muhammad Rodlin Billah, Amin Abbasi, Roel Baets, Ute Troppenz, Michael Theurer, Kerstin Wörhoff, Moritz Seyfried, Wolfgang Freude, Christian Koos
Publicado en: Optics Express, Edición 28/25, 2020, Página(s) 37996, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.405139

Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses

Autores: Aleksandar Nesic, Matthias Blaicher, Tobias Hoose, Andreas Hofmann, Matthias Lauermann, Yasar Kutuvantavida, Martin Nöllenburg, Sebastian Randel, Wolfgang Freude, Christian Koos
Publicado en: Optics Express, Edición 27/12, 2019, Página(s) 17402, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.27.017402

Superconducting nanowire single-photon detector with 3D-printed free-form microlenses

Autores: Yilin Xu, Artem Kuzmin, Emanuel Knehr, Matthias Blaicher, Konstantin Ilin, Philipp-Immanuel Dietrich, Wolfgang Freude, Michael Siegel, and Christian Koos
Publicado en: Optics Express, Edición Vol. 29, Edición 17, 2021, Página(s) 27708-27731, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.427639

Derechos de propiedad intelectual

Patent (1)

Fiber-less Photonic Package

Número de solicitud/publicación: US 62/682,034
Fecha: 2018-06-07
Solicitante(s): UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK