Periodic Reporting for period 3 - PIXAPP (Photonic Integrated Circuits Assembly and Packaging Pilot Line)
Berichtszeitraum: 2020-01-01 bis 2021-09-30
The PIXAPP Pilot Line has been established to address the bottleneck in packaging of integrated photonic devices and is the first of its kind in the world. PIXAPP combines 22 of Europe’s leading research organisations and industry partners to provide users with a complete packaging technology offering, from optical and electrical, to thermal and mechanical assembly and packaging technologies. PIXAPP is a distributed Pilot Line with a single point of contact for all users, called the Pilot Line Gateway.
A key feature of the PIXAPP Pilot Line is the organisation of its wide range of advanced photonic packaging technologies. Packaging of integrated photonic devices can be complex and presents great challenges to users, especially non-photonic experts. A unique feature of the PIXAPP Pilot Line is the development of packaging building blocks, where users can easily select the exact packaging technologies to suit their particular needs, essentially a ‘menu’ of packaging technologies. These technologies will
PIXAPP has three key objectives:
1) Offer users custom solutions through standard packaging technologies
2) Training and educating the future workforce
3) Link the PIC ecosystem through the development of packaging standards and roadmaps
A key feature of the PIXAPP Pilot Line is the organisation of its wide range of advanced photonic packaging technologies. Packaging of integrated photonic devices can be complex and presents great challenges to users, especially non-photonic experts. A unique feature of the PIXAPP Pilot Line is the development of packaging building blocks, where users can easily select the exact packaging technologies to suit their particular needs, essentially a ‘menu’ of packaging technologies. These technologies will
PIXAPP has three key objectives:
1) Offer users custom solutions through standard packaging technologies
2) Training and educating the future workforce
3) Link the PIC ecosystem through the development of packaging standards and roadmaps
Although only established in January 2017, PIXAPP has become an internationally recognised brand, generating significant interest and providing a unique technology offering.
Significant achievements during this period (M19 - M36) include:
1) Expanding the consortium to include new technologies to the existing offers
2) Successful launch of the PIXAPP pre-commercial calls
3) Testing, re-design and fabrication of the Reference PICs
4) Assembly and packaging of the 4 technology demonstrators
5) Further engagement with user enquiries coming through the PIXAPP Gateway
6) Growing PIXAPP's photonic packaging training courses and workshops
7) Leading participant in technology roadmapping and design standards activities
8) Participation in numerous international high-profile promotional activities, including invited talks, sponsorship of workshops and exhibition booths, webinars and posters.
9) Preparation of a draft Pilot Line sustainability plan and discussions with regional governments to support Pilot Line sustainability after the (4 year) funded project.
Significant achievements during this period (M19 - M36) include:
1) Expanding the consortium to include new technologies to the existing offers
2) Successful launch of the PIXAPP pre-commercial calls
3) Testing, re-design and fabrication of the Reference PICs
4) Assembly and packaging of the 4 technology demonstrators
5) Further engagement with user enquiries coming through the PIXAPP Gateway
6) Growing PIXAPP's photonic packaging training courses and workshops
7) Leading participant in technology roadmapping and design standards activities
8) Participation in numerous international high-profile promotional activities, including invited talks, sponsorship of workshops and exhibition booths, webinars and posters.
9) Preparation of a draft Pilot Line sustainability plan and discussions with regional governments to support Pilot Line sustainability after the (4 year) funded project.
PIXAPP is ambitious, generating significant progress beyond state-of-the-art, resulting in increased innovation potential. To achieve this, advances beyond the state-of-the-art is required across a number of areas. These include:
• State-of-the-Art in PIC Assembly & Packaging Foundry Service
• State-of-the-Art in PIC Assembly & Packaging Technologies
• State-of-the-Art in PIC Packaging Design Rules
• State-of-the-Art in Generic PIC Packages
PIXAPP will contribute greatly to enhancing the innovation potential for a wide group of stakeholders. The innovation potential of all consortium partners will be greatly enhanced by the project results. The industrial technology partners (Argotech, Cordon, LioniX, Chipshop, ficonTEC and PhoeniX) will be more easily able to expand their services, and partner with complementary technology specialists. The innovation potential of the application/end-user partners (Randox, Eblana, IIIV Labs and Technobis) will be enhanced by the availability of demonstrators for their business development efforts along with the strategic experience of using the Pilot Line – particularly its potential for additional new product development.
PIXAPP will deliver a unified Open Access Pilot Line for the Assembly and Packaging of PICs, unleashing the power of photonics across multiple sectors. PIXAPP is a significant step forward in covering missing links in the value chain, and greatly enhances Europe’s industrial competiveness and leadership in advanced photonic technologies. By making the packaging and assembly of advanced PICs accessible to both companies and commercialisation-oriented research users, PIXAPP will galvanise and propel the photonics innovation communities at the regional, national, and EU level, greatly increasing the rate of new product innovation in emerging markets.
• State-of-the-Art in PIC Assembly & Packaging Foundry Service
• State-of-the-Art in PIC Assembly & Packaging Technologies
• State-of-the-Art in PIC Packaging Design Rules
• State-of-the-Art in Generic PIC Packages
PIXAPP will contribute greatly to enhancing the innovation potential for a wide group of stakeholders. The innovation potential of all consortium partners will be greatly enhanced by the project results. The industrial technology partners (Argotech, Cordon, LioniX, Chipshop, ficonTEC and PhoeniX) will be more easily able to expand their services, and partner with complementary technology specialists. The innovation potential of the application/end-user partners (Randox, Eblana, IIIV Labs and Technobis) will be enhanced by the availability of demonstrators for their business development efforts along with the strategic experience of using the Pilot Line – particularly its potential for additional new product development.
PIXAPP will deliver a unified Open Access Pilot Line for the Assembly and Packaging of PICs, unleashing the power of photonics across multiple sectors. PIXAPP is a significant step forward in covering missing links in the value chain, and greatly enhances Europe’s industrial competiveness and leadership in advanced photonic technologies. By making the packaging and assembly of advanced PICs accessible to both companies and commercialisation-oriented research users, PIXAPP will galvanise and propel the photonics innovation communities at the regional, national, and EU level, greatly increasing the rate of new product innovation in emerging markets.