Chip package bumping on wafer level for RDL first Fan-Out wafer
Autores:
Anshuma Pathak, Mathias Böttcher, Sebastiaan Kersjes, Thomas Oppert, Thorsten Teutsch
Publicado en:
IMAPS Device Packaging 2021, 2021
Editor:
IMAPS Device Packaging 2021
The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
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Autores:
Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
Publicado en:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2020, ISBN 978-0-7918-8404-1
Editor:
American Society of Mechanical Engineers
DOI:
10.1115/ipack2020-2555
Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
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Autores:
Ghanshyam Gadhiya, Heikki Kuisma, Andre Cardoso, Birgit Bramer, Sven Rzepka, Thomas Otto
Publicado en:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, Página(s) 1-8, ISBN 978-1-7281-6049-8
Editor:
IEEE
DOI:
10.1109/eurosime48426.2020.9152629
FO-WLP multi-DOF inertial sensor for automotive applications
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Autores:
Heikki Kuisma, Andre Cardoso, Nikolai Mantyoja, Rudiger Rosenkrantz, Sami Nurmi, Martin Gall
Publicado en:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Página(s) 1-7, ISBN 978-1-5386-6814-6
Editor:
IEEE
DOI:
10.1109/estc.2018.8546447
Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices
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Autores:
Thomas Uhrmann, Matthias Pichler, Julian Bravin, Daniel Burgstaller, Boris Povazay
Publicado en:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Página(s) 1-5, ISBN 978-1-5386-6814-6
Editor:
IEEE
DOI:
10.1109/estc.2018.8546451
Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions
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Autores:
Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka
Publicado en:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Página(s) 1-7, ISBN 978-1-5386-6814-6
Editor:
IEEE
DOI:
10.1109/estc.2018.8546352
Defect-Free Dicing for Higher Device Reliability
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Autores:
Christopher Johnston, Fabien Piallat
Publicado en:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Página(s) 1-4, ISBN 978-1-5386-6814-6
Editor:
IEEE
DOI:
10.1109/estc.2018.8546448
The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs
Autores:
Ghanshyam Gadhiya ; Birgit Braemer ; Sven Rzepka ; Thomas Otto
Publicado en:
Smart Systems Integration; 13th International Conference and Exhibition on Integration Edicións of Miniaturized Systems, 2019, ISBN 978-3-8007-4919-5
Editor:
VDE
Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices
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Autores:
Ayad Ghannam, Niek van Haare, Julian Bravin, Elisabeth Brandl, Birgit Brandstatter, Hannes Klingler, Benedikt Auer, Philippe Meunier, Sebastiaan Kersjes
Publicado en:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, Página(s) 1789-1795, ISBN 978-1-7281-1499-6
Editor:
IEEE
DOI:
10.1109/ectc.2019.00276
Assessment of FOWLP process dependent wafer warpage using parametric FE study
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Autores:
Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka, Thomas Otto
Publicado en:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Página(s) 1-8, ISBN 978-0-9568086-6-0
Editor:
IEEE
DOI:
10.23919/empc44848.2019.8951805
