Deliverables
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Publications
Author(s):
Anshuma Pathak, Mathias Böttcher, Sebastiaan Kersjes, Thomas Oppert, Thorsten Teutsch
Published in:
IMAPS Device Packaging 2021, 2021
Publisher:
IMAPS Device Packaging 2021
Author(s):
Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
Published in:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2020, ISBN 978-0-7918-8404-1
Publisher:
American Society of Mechanical Engineers
DOI:
10.1115/ipack2020-2555
Author(s):
Ghanshyam Gadhiya, Heikki Kuisma, Andre Cardoso, Birgit Bramer, Sven Rzepka, Thomas Otto
Published in:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, Page(s) 1-8, ISBN 978-1-7281-6049-8
Publisher:
IEEE
DOI:
10.1109/eurosime48426.2020.9152629
Author(s):
Heikki Kuisma, Andre Cardoso, Nikolai Mantyoja, Rudiger Rosenkrantz, Sami Nurmi, Martin Gall
Published in:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-7, ISBN 978-1-5386-6814-6
Publisher:
IEEE
DOI:
10.1109/estc.2018.8546447
Author(s):
Thomas Uhrmann, Matthias Pichler, Julian Bravin, Daniel Burgstaller, Boris Povazay
Published in:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-5, ISBN 978-1-5386-6814-6
Publisher:
IEEE
DOI:
10.1109/estc.2018.8546451
Author(s):
Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka
Published in:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-7, ISBN 978-1-5386-6814-6
Publisher:
IEEE
DOI:
10.1109/estc.2018.8546352
Author(s):
Christopher Johnston, Fabien Piallat
Published in:
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-4, ISBN 978-1-5386-6814-6
Publisher:
IEEE
DOI:
10.1109/estc.2018.8546448
Author(s):
Ghanshyam Gadhiya ; Birgit Braemer ; Sven Rzepka ; Thomas Otto
Published in:
Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, ISBN 978-3-8007-4919-5
Publisher:
VDE
Author(s):
Ayad Ghannam, Niek van Haare, Julian Bravin, Elisabeth Brandl, Birgit Brandstatter, Hannes Klingler, Benedikt Auer, Philippe Meunier, Sebastiaan Kersjes
Published in:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, Page(s) 1789-1795, ISBN 978-1-7281-1499-6
Publisher:
IEEE
DOI:
10.1109/ectc.2019.00276
Author(s):
Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka, Thomas Otto
Published in:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0
Publisher:
IEEE
DOI:
10.23919/empc44848.2019.8951805
Author(s):
Emre Topal, Jurgen Gluch, Andre Clausner, Andre Cardoso, Ehrenfried Zschech
Published in:
IEEE Transactions on Components, Packaging and Manufacturing Technology, Issue 11/3, 2021, Page(s) 504-509, ISSN 2156-3950
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/tcpmt.2020.3048672
Author(s):
Sabine Scherbaum ; Christof Landesberger ; Benedikt Auer ; Hannes Klingler ; Birgit Brandstaetter ; Elisabeth Brandl ; Julian Bravin
Published in:
Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019, ISBN 978-3-8007-4919-5
Publisher:
VDE
Author(s):
Heikki Kuisma, André Cardoso and Tanja Braun
Published in:
2020, Page(s) Pages 707-720, ISBN 9780128177860
Publisher:
Elsevier
Intellectual Property Rights
Application/Publication number:
20
20053342
Date:
2020-04-08
Applicant(s):
MURATA ELECTRONICS OY
Application/Publication number:
20
19050654
Date:
2019-09-12
Application/Publication number:
18
748943
Date:
2018-08-08
Applicant(s):
3DIS TECHNOLOGIES
Application/Publication number:
18
748941
Date:
2018-08-08
Applicant(s):
3DIS TECHNOLOGIES
Application/Publication number:
16
770715
Date:
2016-09-14
Applicant(s):
3DIS TECHNOLOGIES
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