European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package

Deliverables

Project website, LinkedIn pages, visual code, reporting and powerpoint templates, newsletter platform and general presentation - brochures, roll-ups if need be

Publications

Chip package bumping on wafer level for RDL first Fan-Out wafer

Author(s): Anshuma Pathak, Mathias Böttcher, Sebastiaan Kersjes, Thomas Oppert, Thorsten Teutsch
Published in: IMAPS Device Packaging 2021, 2021

The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

Author(s): Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
Published in: ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2020
DOI: 10.1115/ipack2020-2555

Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line

Author(s): Ghanshyam Gadhiya, Heikki Kuisma, Andre Cardoso, Birgit Bramer, Sven Rzepka, Thomas Otto
Published in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, Page(s) 1-8
DOI: 10.1109/eurosime48426.2020.9152629

FO-WLP multi-DOF inertial sensor for automotive applications

Author(s): Heikki Kuisma, Andre Cardoso, Nikolai Mantyoja, Rudiger Rosenkrantz, Sami Nurmi, Martin Gall
Published in: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-7
DOI: 10.1109/estc.2018.8546447

Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices

Author(s): Thomas Uhrmann, Matthias Pichler, Julian Bravin, Daniel Burgstaller, Boris Povazay
Published in: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-5
DOI: 10.1109/estc.2018.8546451

Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions

Author(s): Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka
Published in: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-7
DOI: 10.1109/estc.2018.8546352

Defect-Free Dicing for Higher Device Reliability

Author(s): Christopher Johnston, Fabien Piallat
Published in: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Page(s) 1-4
DOI: 10.1109/estc.2018.8546448

The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs

Author(s): Ghanshyam Gadhiya ; Birgit Braemer ; Sven Rzepka ; Thomas Otto
Published in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019

Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices

Author(s): Ayad Ghannam, Niek van Haare, Julian Bravin, Elisabeth Brandl, Birgit Brandstatter, Hannes Klingler, Benedikt Auer, Philippe Meunier, Sebastiaan Kersjes
Published in: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, Page(s) 1789-1795
DOI: 10.1109/ectc.2019.00276

Assessment of FOWLP process dependent wafer warpage using parametric FE study

Author(s): Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka, Thomas Otto
Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8
DOI: 10.23919/empc44848.2019.8951805

Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography

Author(s): Emre Topal, Jurgen Gluch, Andre Clausner, Andre Cardoso, Ehrenfried Zschech
Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology, Issue 11/3, 2021, Page(s) 504-509, ISSN 2156-3950
DOI: 10.1109/tcpmt.2020.3048672

Toward improved FOWLP manufacturing by using self-alignment process

Author(s): Sabine Scherbaum ; Christof Landesberger ; Benedikt Auer ; Hannes Klingler ; Birgit Brandstaetter ; Elisabeth Brandl ; Julian Bravin
Published in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2019

Handbook of Silicon Based MEMS Materials and Technologies3rd EditionChapter 33 - Fan-out wafer-level packaging as packaging technology for MEMS

Author(s): Heikki Kuisma, André Cardoso and Tanja Braun
Published in: 2020, Page(s) Pages 707-720

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