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CORDIS

European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package

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Communication tools

Project website, LinkedIn pages, visual code, reporting and powerpoint templates, newsletter platform and general presentation - brochures, roll-ups if need be

Publikacje

Chip package bumping on wafer level for RDL first Fan-Out wafer

Autorzy: Anshuma Pathak, Mathias Böttcher, Sebastiaan Kersjes, Thomas Oppert, Thorsten Teutsch
Opublikowane w: IMAPS Device Packaging 2021, 2021
Wydawca: IMAPS Device Packaging 2021

The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

Autorzy: Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
Opublikowane w: ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2020, ISBN 978-0-7918-8404-1
Wydawca: American Society of Mechanical Engineers
DOI: 10.1115/ipack2020-2555

Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line

Autorzy: Ghanshyam Gadhiya, Heikki Kuisma, Andre Cardoso, Birgit Bramer, Sven Rzepka, Thomas Otto
Opublikowane w: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, Strona(/y) 1-8, ISBN 978-1-7281-6049-8
Wydawca: IEEE
DOI: 10.1109/eurosime48426.2020.9152629

FO-WLP multi-DOF inertial sensor for automotive applications

Autorzy: Heikki Kuisma, Andre Cardoso, Nikolai Mantyoja, Rudiger Rosenkrantz, Sami Nurmi, Martin Gall
Opublikowane w: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Strona(/y) 1-7, ISBN 978-1-5386-6814-6
Wydawca: IEEE
DOI: 10.1109/estc.2018.8546447

Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices

Autorzy: Thomas Uhrmann, Matthias Pichler, Julian Bravin, Daniel Burgstaller, Boris Povazay
Opublikowane w: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Strona(/y) 1-5, ISBN 978-1-5386-6814-6
Wydawca: IEEE
DOI: 10.1109/estc.2018.8546451

Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions

Autorzy: Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka
Opublikowane w: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Strona(/y) 1-7, ISBN 978-1-5386-6814-6
Wydawca: IEEE
DOI: 10.1109/estc.2018.8546352

Defect-Free Dicing for Higher Device Reliability

Autorzy: Christopher Johnston, Fabien Piallat
Opublikowane w: 2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, Strona(/y) 1-4, ISBN 978-1-5386-6814-6
Wydawca: IEEE
DOI: 10.1109/estc.2018.8546448

The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs

Autorzy: Ghanshyam Gadhiya ; Birgit Braemer ; Sven Rzepka ; Thomas Otto
Opublikowane w: Smart Systems Integration; 13th International Conference and Exhibition on Integration Numers of Miniaturized Systems, 2019, ISBN 978-3-8007-4919-5
Wydawca: VDE

Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices

Autorzy: Ayad Ghannam, Niek van Haare, Julian Bravin, Elisabeth Brandl, Birgit Brandstatter, Hannes Klingler, Benedikt Auer, Philippe Meunier, Sebastiaan Kersjes
Opublikowane w: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, Strona(/y) 1789-1795, ISBN 978-1-7281-1499-6
Wydawca: IEEE
DOI: 10.1109/ectc.2019.00276

Assessment of FOWLP process dependent wafer warpage using parametric FE study

Autorzy: Ghanshyam Gadhiya, Birgit Bramer, Sven Rzepka, Thomas Otto
Opublikowane w: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Strona(/y) 1-8, ISBN 978-0-9568086-6-0
Wydawca: IEEE
DOI: 10.23919/empc44848.2019.8951805

Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography

Autorzy: Emre Topal, Jurgen Gluch, Andre Clausner, Andre Cardoso, Ehrenfried Zschech
Opublikowane w: IEEE Transactions on Components, Packaging and Manufacturing Technology, Numer 11/3, 2021, Strona(/y) 504-509, ISSN 2156-3950
Wydawca: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2020.3048672

Toward improved FOWLP manufacturing by using self-alignment process

Autorzy: Sabine Scherbaum ; Christof Landesberger ; Benedikt Auer ; Hannes Klingler ; Birgit Brandstaetter ; Elisabeth Brandl ; Julian Bravin
Opublikowane w: Smart Systems Integration; 13th International Conference and Exhibition on Integration Numers of Miniaturized Systems, 2019, ISBN 978-3-8007-4919-5
Wydawca: VDE

Handbook of Silicon Based MEMS Materials and Technologies3rd EditionChapter 33 - Fan-out wafer-level packaging as packaging technology for MEMS

Autorzy: Heikki Kuisma, André Cardoso and Tanja Braun
Opublikowane w: 2020, Strona(/y) Pages 707-720, ISBN 9780128177860
Wydawca: Elsevier

Prawa własności intelektualnej

ELECTRICAL COMPONENT WITH INTERCONNECTION ELEMENTS

Numer wniosku/publikacji: 20 20053342
Data: 2020-04-08
Wnioskodawca/wnioskodawcy: MURATA ELECTRONICS OY

PRESSURE SENSOR

Numer wniosku/publikacji: 20 19050654
Data: 2019-09-12

ELECTRONIC SYSTEM COMPRISING A LOWER REDISTRIBUTION LAYER AND METHOD FOR PRODUCING SUCH AN ELECTRONIC SYSTEM

Numer wniosku/publikacji: 18 748943
Data: 2018-08-08
Wnioskodawca/wnioskodawcy: 3DIS TECHNOLOGIES

ELECTRONIC SYSTEM AND METHOD FOR THE PRODUCTION OF AN ELECTRONIC SYSTEM USING A SACRIFICIAL MEMBER

Numer wniosku/publikacji: 18 748941
Data: 2018-08-08
Wnioskodawca/wnioskodawcy: 3DIS TECHNOLOGIES

METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANUFACTURE OF AN INTEGRATED CIRCUIT

Numer wniosku/publikacji: 16 770715
Data: 2016-09-14
Wnioskodawca/wnioskodawcy: 3DIS TECHNOLOGIES

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