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Wafer-scale, CMOS integration of photonics, plasmonics and electronics devices for mass manufacturing 200Gb/s non-return-to-zero (NRZ) transceivers towards low-cost Terabit connectivity in Data Centers

Objective

The goal of the PlaCMOS project is to develop and demonstrate the next generation optical-electronic CMOS platform that will enable transceivers capable of real-time communication with data rates exceeding 200 Gb/s. To achieve this goal the PlaCMOS platform will be based on the latest bipolar CMOS (BiCMOS) technology and will be cointegrated with a ferroelectric plasmonic and SiGe detector technology. By exploiting plasmonics rather than photonics PlaCMOS will not only be able to extend the bandwidth far beyond 100 GHz but also reduce the footprint of the photonics device to the micrometer scale. To demonstrate the technology, a single channel 200 Gb/s non-return-to-zero (NRZ) transmitter and receiver pair will be implemented. To further show the scalability an ultra-compact 4 x 50 Gb/s transceiver directly interfacing a multicore optical fiber will be implemented and tested for temperature stability beyond 150 degree Celsius. And while the project goes far beyond the current state-of-the art, the approach is not speculative but is substantiated by recent experiments performed by the members of the consortium that indicate that both electronic and photonic limits can be stretched beyond the current limits. To this end a team with complementary skill sets from both industry and universities – all with outstanding track records in the field – have committed to address the needs outlined in current roadmaps for data communication. This project will demonstrate the capabilities of the technology for a single exemplary field of applications. Yet, the project has far wider implications with applications that go beyond the field of communications.

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Keywords

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Programme(s)

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Topic(s)

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

RIA - Research and Innovation action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-ICT-2016-2017

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Coordinator

MELLANOX TECHNOLOGIES LTD - MLNX
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 481 250,00
Address
YOKNEAM ILIT INDUSTRIAL ZONE HERMON BUILDING
20692 YOKNEAM
Israel

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Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 481 250,00

Participants (7)

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