Deliverables
Newsletter 2
Project_WebsiteProject website
Newsletter_1Newsletter 1.
WS_devices_appliWorkshop on devices and applications
Kit_schoolCommunication kit targeted towards middle school students
Publications
Author(s):
Jan Grünenpütt, Daniel Sommer, Jörg Splettstößer, Olof Kordina, Jr-Tai Chen, Hermann Stieglauer, Hervé Blanck
Published in:
2021 CS Mantech digest, 2021
Publisher:
"CS MANTECH 9450 SW Gemini Drive #26585 Beaverton, OR 97008"
Author(s):
Mohammed Ayad, Pascal Poilvert, Houzefa Moulakarimdjy,
Laurent Marechal, Philippe Auxemery
Published in:
2021 RFIC Virtual Technical Program | RFIC Symposium, 2021
Publisher:
RFIC IEEE
Author(s):
Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier
Published in:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, Page(s) 1779-1785, ISBN 978-1-6654-4097-4
Publisher:
IEEE
DOI:
10.1109/ectc32696.2021.00281
Author(s):
J.Drobny, A.Kosa,M. Weis, J. Kovac, L. Stuchlikova
Published in:
2019, ISBN 978-80-7582-097-6
Publisher:
MITAV 2019
Author(s):
L. Stuchlikova, J. Drobny, A. Kosa, P. Benko, A. Kopecky, S. L. Delage, J. Kovac
Published in:
2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1
Publisher:
IEEE
DOI:
10.1109/asdam.2018.8544477
Author(s):
Didier Floriot,Philippe Auxemery, Jean-Pierre Viaud
Published in:
IMS2019 proceedings, 2019
Publisher:
IEEE MTT International Microwave Symposium
Author(s):
Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Published in:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2018, ISBN 978-0-7918-5192-0
Publisher:
American Society of Mechanical Engineers
DOI:
10.1115/ipack2018-8256
Author(s):
L. Stuchlikova, J. Drobny, A. Kosa, J. Vadovsky, P. Benko, A. Skoda, J. Kovac, jr., S. L. Delage
Published in:
wocsdice2019, 2019
Publisher:
wocsdice2019 : Workshop on Compound Semiconductor Devices and Integrated Circuits
Author(s):
Z. Gao, F. Chiocchetta, N. Modolo, C. De Santi, F. Rampazzo, M. Meneghini, G. Meneghesso, et al
Published in:
2022 IEEE International Reliability Physics Symposium, Issue Pages P51-1–P51-6, 2022
Publisher:
IEEE Press
DOI:
10.1109/irps48227.2022.9764531
Author(s):
Arnaud Garnier, Laetitia Castagne, Florent Greco, Thomas Guillemet, Laurent Marechal, Mehdy Neffati, Remi Franiatte, Perceval Coudrain, Stephane Piotrowicz, Gilles Simon
Published in:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, Page(s) 2016-2023, ISBN 978-1-6654-4097-4
Publisher:
IEEE
DOI:
10.1109/ectc32696.2021.00318
Author(s):
Enrico Zanoni, Fabiana Rampazzo, Carlo De Santi, Veronica Gao Zhan, Chandan Sharma, Nicola Modolo, Giovanni Verzellesi, Alessandro Chini, Gaudenzio Meneghesso, Matteo Meneghini
Published in:
Physic Status Solid a, 2022, ISSN 1862-6319
Publisher:
Editor-in-Chief: Stefan Hildebrandt, Deputy Editor: Marc Zastrow Online ISSN: 1862-6319 © Wiley-VCH GmbH, Weinheim
DOI:
10.1002/pssa.202100722
Author(s):
Dirk Schwantuschke and al
Published in:
Semiconductor Today, Issue 18 September 2018, monthly journal, 2018, ISSN 1752-2935
Publisher:
Juno Publishing and Media Solutions Ltd, Suite no. 133, 20 Winchcombe Street, Cheltenham GL52 2LY, UK
Author(s):
Joël Kanyandekwe, Yannick Baines, Jérôme Richy, Sylvie Favier, Charles Leroux, Denis Blachier, Yann Mazel, Marc Veillerot, Jean-Paul Barnes, Mrad Mrad, Cindy Wiese, Matthew Charles
Published in:
Journal of Crystal Growth, Issue 515, 2019, Page(s) 48-52, ISSN 0022-0248
Publisher:
Elsevier BV
DOI:
10.1016/j.jcrysgro.2019.03.007
Author(s):
Z. Gao, M. Meneghini, F. Rampazzo, M. Rzin, C. De Santi, G. Meneghesso, E. Zanoni
Published in:
Microelectronics Reliability, Issue 100-101, 2019, Page(s) 113489, ISSN 0026-2714
Publisher:
Elsevier BV
DOI:
10.1016/j.microrel.2019.113489
Author(s):
Z. Gao, F. Rampazzo, M. Meneghini, C. De Santi, F. Chiocchetta, D. Marcon, G. Meneghesso, E. Zanoni
Published in:
Microelectronics Reliability, Issue 114, 2020, Page(s) 113905, ISSN 0026-2714
Publisher:
Elsevier BV
DOI:
10.1016/j.microrel.2020.113905
Author(s):
Martin Florovič, Róbert Szobolovszký, Jaroslav Kováč, Jaroslav Kováč, Aleš Chvála, Jean-Claude Jacquet, Sylvain Laurent Delage
Published in:
Journal of Electrical Engineering, Issue 69/5, 2018, Page(s) 390-394, ISSN 1339-309X
Publisher:
SCIENDO journal of electronical engineering
DOI:
10.2478/jee-2018-0057
Author(s):
Zhan Gao, Fabiana Rampazzo, Matteo Meneghini, Nicola Modolo, Carlo De Santi, Hervé Blanck, Hermann Stieglauer, Daniel Sommer, Jan Grünenpütt, Olof Kordina, Jr-Tai Chen, Gaudenzio Meneghesso, Enrico Zanoni
Published in:
Microelectronics Reliability, 2021, Page(s) 114318, ISSN 0026-2714
Publisher:
Elsevier BV
DOI:
10.1016/j.microrel.2021.114318
Author(s):
Mingquan Bao, David Gustafsson, Rui Hou, Zineb Ouarch, Christophe Chang, Kristoffer Andersson
Published in:
IEEE Microwave and Wireless Components Letters, Issue 31/6, 2021, Page(s) 752-755, ISSN 1531-1309
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/lmwc.2021.3063868
Author(s):
M Florovič, J Kováč, J Kováč, A Chvála, M Weis, J-C Jacquet, S L Delage
Published in:
Semiconductor Science and Technology, Issue 36/2, 2020, Page(s) 025019, ISSN 0268-1242
Publisher:
Institute of Physics Publishing
DOI:
10.1088/1361-6641/abd15a
Author(s):
Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet
Published in:
Journal of Electronic Packaging, Issue 141/3, 2019, ISSN 1043-7398
Publisher:
ASME
DOI:
10.1115/1.4043477
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