Advanced RF Transceivers for 5G base stations based on GaN Technology.

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Newsletter 2

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Project website

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Newsletter 1.

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Workshop on devices and applications

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Communication kit targeted towards middle school students

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Workshop on material research

Publikacje

Evaluation of novel iron-free QuanFINE® structure by 100nm and 150nm AlGaN/GaN HEMT technology

Autorzy: Jan Grünenpütt, Daniel Sommer, Jörg Splettstößer, Olof Kordina, Jr-Tai Chen, Hermann Stieglauer, Hervé Blanck
Opublikowane w: 2021 CS Mantech digest, 2021
Wydawca: "CS MANTECH 9450 SW Gemini Drive #26585 Beaverton, OR 97008"

Workshop on Highly Linear and Linearized Power Amplifiers for mm-Wave Communications: Innovative Integrated Solutions for mm-Wave 5G Front Ends, Combining 150nm GaN PA with GaAs Receiver

Autorzy: Mohammed Ayad, Pascal Poilvert, Houzefa Moulakarimdjy, Laurent Marechal, Philippe Auxemery
Opublikowane w: 2021 RFIC Virtual Technical Program | RFIC Symposium, 2021
Wydawca: RFIC IEEE

Reliability of Fan-Out Wafer Level Packaging For III-V RF Power MMICs

Autorzy: Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier
Opublikowane w: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, Strona(/y) 1779-1785, ISBN 978-1-6654-4097-4
Wydawca: IEEE
DOI: 10.1109/ectc32696.2021.00281

IDENTIFICATION OF ELECTRICALLY ACTIVE DEFECTSIN MODERN STRUCTURES BASED ON GALLIUM NITRIDE

Autorzy: J.Drobny, A.Kosa,M. Weis, J. Kovac, L. Stuchlikova
Opublikowane w: 2019, ISBN 978-80-7582-097-6
Wydawca: MITAV 2019

DLTFS Study of Defect Distribution in InAlGaN/GaN/SiC HEMT Heterostructures

Autorzy: L. Stuchlikova, J. Drobny, A. Kosa, P. Benko, A. Kopecky, S. L. Delage, J. Kovac
Opublikowane w: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Strona(/y) 1-4, ISBN 978-1-5386-7490-1
Wydawca: IEEE
DOI: 10.1109/asdam.2018.8544477

Heterogeneous Integration for WLP RF Transceivers : Challenges and Issues

Autorzy: Didier Floriot,Philippe Auxemery, Jean-Pierre Viaud
Opublikowane w: IMS2019 proceedings, 2019
Wydawca: IEEE MTT International Microwave Symposium

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Autorzy: Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Opublikowane w: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2018, ISBN 978-0-7918-5192-0
Wydawca: American Society of Mechanical Engineers
DOI: 10.1115/ipack2018-8256

Defect Analysis of InAlGaN/GaN/SiC HEMT heterostructures

Autorzy: L. Stuchlikova, J. Drobny, A. Kosa, J. Vadovsky, P. Benko, A. Skoda, J. Kovac, jr., S. L. Delage
Opublikowane w: wocsdice2019, 2019
Wydawca: wocsdice2019 : Workshop on Compound Semiconductor Devices and Integrated Circuits

"Deep level effects and degradation of 0.15 μm RF AlGaN/GaN HEMTs with Mono-layer and Bi-layer AlGaN backbarrier"

Autorzy: Z. Gao, F. Chiocchetta, N. Modolo, C. De Santi, F. Rampazzo, M. Meneghini, G. Meneghesso, et al
Opublikowane w: 2022 IEEE International Reliability Physics Symposium, Numer Pages P51-1–P51-6, 2022
Wydawca: IEEE Press
DOI: 10.1109/irps48227.2022.9764531

System in package embedding III-V chips by fan-out wafer-level packaging for RF applications

Autorzy: Arnaud Garnier, Laetitia Castagne, Florent Greco, Thomas Guillemet, Laurent Marechal, Mehdy Neffati, Remi Franiatte, Perceval Coudrain, Stephane Piotrowicz, Gilles Simon
Opublikowane w: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, Strona(/y) 2016-2023, ISBN 978-1-6654-4097-4
Wydawca: IEEE
DOI: 10.1109/ectc32696.2021.00318

Failure physics and reliability of GaN-based HEMTs for microwave and millimeter-wave applications: a review of consolidated data and recent results

Autorzy: Enrico Zanoni, Fabiana Rampazzo, Carlo De Santi, Veronica Gao Zhan, Chandan Sharma, Nicola Modolo, Giovanni Verzellesi, Alessandro Chini, Gaudenzio Meneghesso, Matteo Meneghini
Opublikowane w: Physic Status Solid a, 2022, ISSN 1862-6319
Wydawca: Editor-in-Chief: Stefan Hildebrandt, Deputy Editor: Marc Zastrow Online ISSN: 1862-6319 © Wiley-VCH GmbH, Weinheim
DOI: 10.1002/pssa.202100722

5G GaN2 project developing 28GHz, 38GHz and 80GHz demonstrators for 5G cellular network base stations

Autorzy: Dirk Schwantuschke and al
Opublikowane w: Semiconductor Today, Numer 18 September 2018, monthly journal, 2018, ISSN 1752-2935
Wydawca: Juno Publishing and Media Solutions Ltd, Suite no. 133, 20 Winchcombe Street, Cheltenham GL52 2LY, UK

Impact of growth conditions on AlN/GaN heterostructures with in-situ SiN capping layer

Autorzy: Joël Kanyandekwe, Yannick Baines, Jérôme Richy, Sylvie Favier, Charles Leroux, Denis Blachier, Yann Mazel, Marc Veillerot, Jean-Paul Barnes, Mrad Mrad, Cindy Wiese, Matthew Charles
Opublikowane w: Journal of Crystal Growth, Numer 515, 2019, Strona(/y) 48-52, ISSN 0022-0248
Wydawca: Elsevier BV
DOI: 10.1016/j.jcrysgro.2019.03.007

Reliability comparison of AlGaN/GaN HEMTs with different carbon doping concentration

Autorzy: Z. Gao, M. Meneghini, F. Rampazzo, M. Rzin, C. De Santi, G. Meneghesso, E. Zanoni
Opublikowane w: Microelectronics Reliability, Numer 100-101, 2019, Strona(/y) 113489, ISSN 0026-2714
Wydawca: Elsevier BV
DOI: 10.1016/j.microrel.2019.113489

Degradation mechanism of 0.15 μm AlGaN/GaN HEMTs: effects of hot electrons

Autorzy: Z. Gao, F. Rampazzo, M. Meneghini, C. De Santi, F. Chiocchetta, D. Marcon, G. Meneghesso, E. Zanoni
Opublikowane w: Microelectronics Reliability, Numer 114, 2020, Strona(/y) 113905, ISSN 0026-2714
Wydawca: Elsevier BV
DOI: 10.1016/j.microrel.2020.113905

Channel temperature analysis of AlGaN/GaN HEMTs in quasi-static and pulse operation mode

Autorzy: Martin Florovič, Róbert Szobolovszký, Jaroslav Kováč, Jaroslav Kováč, Aleš Chvála, Jean-Claude Jacquet, Sylvain Laurent Delage
Opublikowane w: Journal of Electrical Engineering, Numer 69/5, 2018, Strona(/y) 390-394, ISSN 1339-309X
Wydawca: SCIENDO journal of electronical engineering
DOI: 10.2478/jee-2018-0057

Impact of an AlGaN spike in the buffer in 0.15 μm AlGaN/GaN HEMTs during step stress

Autorzy: Zhan Gao, Fabiana Rampazzo, Matteo Meneghini, Nicola Modolo, Carlo De Santi, Hervé Blanck, Hermann Stieglauer, Daniel Sommer, Jan Grünenpütt, Olof Kordina, Jr-Tai Chen, Gaudenzio Meneghesso, Enrico Zanoni
Opublikowane w: Microelectronics Reliability, 2021, Strona(/y) 114318, ISSN 0026-2714
Wydawca: Elsevier BV
DOI: 10.1016/j.microrel.2021.114318

A 24–28-GHz Doherty Power Amplifier With 4-W Output Power and 32% PAE at 6-dB OPBO in 150-nm GaN Technology

Autorzy: Mingquan Bao, David Gustafsson, Rui Hou, Zineb Ouarch, Christophe Chang, Kristoffer Andersson
Opublikowane w: IEEE Microwave and Wireless Components Letters, Numer 31/6, 2021, Strona(/y) 752-755, ISSN 1531-1309
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/lmwc.2021.3063868

Models for the self-heating evaluation of a gallium nitride-based high electron mobility transistor

Autorzy: M Florovič, J Kováč, J Kováč, A Chvála, M Weis, J-C Jacquet, S L Delage
Opublikowane w: Semiconductor Science and Technology, Numer 36/2, 2020, Strona(/y) 025019, ISSN 0268-1242
Wydawca: Institute of Physics Publishing
DOI: 10.1088/1361-6641/abd15a

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Autorzy: Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet
Opublikowane w: Journal of Electronic Packaging, Numer 141/3, 2019, ISSN 1043-7398
Wydawca: ASME
DOI: 10.1115/1.4043477

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