CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Publications
Author(s):
D. Bosch, P. Acosta Alba, S. Kerdiles, V. Benevent, C. Perrot, J. Lassarre, J. Richy, J. Lacord, B. Sklenard, L. Brunet, P. Batude, C. Fenouillet-Béranger, D. Lattard, J. P. Colinge, F. Balestra, F. Andrieu
Published in:
IEEE S3S conference, 2019
Publisher:
IEEE
Author(s):
E. Esmanhotto, L. Brunet, N. Castellani, D. Bonnet, T. Dalgaty, L. Grenouillet, D. R. B. Ly, C. Cagli, C. Vizioz, N. Allouti, F. Laulagnet, O. Gully, N. Bernard-Henriques, M. Bocquet, G. Molas, P. Vivet, D. Querlioz, JM. Portal, S. Mitra, F. Andrieu, C. Fenouillet-Beranger, E. Nowak, E. Vianello
Published in:
2020 IEEE International Electron Devices Meeting (IEDM), 2020, Page(s) 36.5.1-36.5.4, ISBN 978-1-7281-8888-1
Publisher:
IEEE
DOI:
10.1109/iedm13553.2020.9372019
Author(s):
T. Dubreuil;S. Barraud;J.-M. Pedini;J.-M. Hartmann;F. Boulard;A. Sarrazin;A. Gharbi;J. Sturm;A. Lambert;S. Martin;N. Castellani;A. Anotta;A. Magalhaes-Lucas;A. Souhaité;F. Andrieu
Published in:
ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC), 2023
Publisher:
IEEE
DOI:
10.1109/essderc59256.2023.10268513
Author(s):
T. Dubreuil;P. Amari;S. Barraud;J. Lacord;E. Esmanhotto;V. Meli;S. Martin;N. Castellani;B. Previtali;F. Andrieu
Published in:
2022 IEEE International Memory Workshop (IMW), 2022
Publisher:
IEEE
DOI:
10.1109/imw52921.2022.9779306
Author(s):
M. Ezzadeen, A. Majumdar, M. Bocquet, B. Giraud, J.-P. Noel, F. Andrieu, D. Querlioz, J.-M. Portal
Published in:
ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, Page(s) 83-86, ISBN 978-1-6654-3751-6
Publisher:
IEEE
DOI:
10.1109/esscirc53450.2021.9567742
Author(s):
S. Barraud, B. Previtali, C. Vizioz, J. M. Hartmann, J. Sturm, J. Lassarre, C. Perrot, Ph. Rodriguez, V. Loup, A. Magalhaes-Lucas, R. Kies, G. Romano, M. Casse, N. Bernier, A. Jannaud, A. Grenier, F. Andrieu
Published in:
2020 IEEE Symposium on VLSI Technology, 2020, Page(s) 1-2, ISBN 978-1-7281-6460-1
Publisher:
IEEE
DOI:
10.1109/vlsitechnology18217.2020.9265025
Author(s):
S. Barraud, M. Ezzadeen, D. Bosch, T. Dubreuil, N. Castellani, V. Meli, J.M. Hartmann, M. Mouhdach, B. Previtali, B. Giraud, J. P. Noel, G. Molas, J.M. Portal, E. Nowak, F. Andrieu
Published in:
2020 IEEE International Electron Devices Meeting (IEDM), 2020, Page(s) 29.5.1-29.5.4, ISBN 978-1-7281-8888-1
Publisher:
IEEE
DOI:
10.1109/iedm13553.2020.9371982
Author(s):
T. Dubreuil;S. Barraud;B. Previtali;S. Martinie;J. Lacord;S. Martin;N. Castellani;A. Anotta;F. Andrieu
Published in:
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT), 2023
Publisher:
IEEE
DOI:
10.1109/vlsi-tsa/vlsi-dat57221.2023.10134182
Author(s):
Olivier Faynot;Sylvain Barraud;Theophile Dubreuil;Elisa Vianello;Emmanuel Oilier;Denis Dutoit;François Andrieu;Fabien Clermidy;Julien Arcamone
Published in:
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT), 2023
Publisher:
IEEE
DOI:
10.1109/vlsi-tsa/vlsi-dat57221.2023.10134262
Author(s):
D. Bosch, J. P. Colinge, G. Ghibaudo, X. Garros, S. Barraud, J. Lacord, B. Sklenard, L. Brunet, P. Batude, C. Fenouillet-Beranger, J. Cluzel, R. Kies, J. M. Hartmann, C. Vizioz, G. Audoit, F. Balestra, F. Andrieu
Published in:
2020 IEEE Symposium on VLSI Technology, 2020, Page(s) 1-2, ISBN 978-1-7281-6460-1
Publisher:
IEEE
DOI:
10.1109/vlsitechnology18217.2020.9265036
Author(s):
Mona Ezzadeen;Atreya Majumdar;Sigrid Thomas;Jean-Philippe Noël;Bastien Giraud;Marc Bocquet;François Andrieu;Damien Querlioz;Jean-Michel Portal
Published in:
2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 2023
Publisher:
IEEE
DOI:
10.23919/date56975.2023.10137057
Author(s):
D. Bosch, J.P. Colinge, J. Lugo, A. Tataridou, C. Theodorou, X. Garros, S. Barraud, J. Lacord, B. Sklenard, M. Casse, L. Brunet, P. Batude, C. Fenouillet-Beranger, D. Lattard, J. Cluzel, F. Allain, R. Nait Youcef, J.M. Hartmann, C. Vizioz, G. Audoit, F. Balestra, F. Andrieu
Published in:
2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 2020, Page(s) 126-127, ISBN 978-1-7281-4232-6
Publisher:
IEEE
DOI:
10.1109/vlsi-tsa48913.2020.9203690
Author(s):
C. Fenouillet-Beranger, L. Brunet, P. Batude, L. Brevard, X. Garros, T. Mota Frutuoso, M. Casse, J. Lugo, J. Lacord, D. Bosch, N. Bernard, A. Magalhaes-Lucas, M. Ribotta, B. Sklenard, F. Milesi, R. Kies, G. Romano, P. Acosta-Alba, S. Kerdiles, A. Tavernier, C. Vizioz, P. Besson, R. Gassilloud, J. Kanyandekwe, D. Cooper, V. Lapras, W. H. Kim, Y. Sasaki, S. Oh, P. Kang, S. W. Lee, H. Na, J. Arcamone
Published in:
2020 IEEE Symposium on VLSI Technology, 2020, Page(s) 1-2, ISBN 978-1-7281-6460-1
Publisher:
IEEE
DOI:
10.1109/vlsitechnology18217.2020.9265092
Author(s):
C. Fenouillet-Beranger, L. Brunet, P. Batude, L. Brevard, X. Garros, M. Casse, J. Lacord, B. Sklenard, P. Acosta-Alba, S. Kerdiles, A. Tavernier, C. Vizioz, P. Besson, R. Gassilloud, J.-M. Pedini, J. Kanyandekwe, F. Mazen, A. Magalhaes-Lucas, C. Cavalcante, D. Bosch, M. Ribotta, V. Lapras, M. Vinet, F. Andrieu, J. Arcamone
Published in:
IEEE Transactions on Electron Devices, Issue 68/7, 2021, Page(s) 3142-3148, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2021.3084916
Author(s):
Mona Ezzadeen, Atreya Majumdar, Olivier Valorge, Niccolo Castellani, Valentin Gherman, Guillaume Regis, Bastien Giraud, Jean-Philippe Noel, Valentina Meli, Marc Bocquet, Francois Andrieu, Damien Querlioz, Jean-Michel Portal
Published in:
Communications Engineering, Issue 3, 2024, ISSN 2731-3395
Publisher:
Nature
DOI:
10.1038/s44172-024-00226-z
Author(s):
M. Ezzadeen, D. Bosch, B. Giraud, S. Barraud, J. -P. Noel, D. Lattard, J. Lacord, J. M. Portal, F. Andrieu
Published in:
IEEE Transactions on Electron Devices, Issue 67/11, 2020, Page(s) 4626-4630, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2020.3020779
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