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Evaluation of 22 nm Fully-depleted Silicon-on-insulator technology for Space

Project description

High-performance miniature chip technology for space applications

Complex integrated circuits such as application-specific integrated circuits (ASICs) act as the brains that process all incoming and outgoing data in spacecraft. The EU-funded EFESOS project aims to develop and evaluate a cutting-edge ASIC technology that utilises the 22FDX platform developed by USA-based semiconductor manufacturing company GlobalFoundries. The 22FDX platform provides the best path for cost-sensitive applications by leveraging the industry’s first 22-nm, 2D, fully-depleted, silicon-on-insulator technology. It delivers FinFET-like performance and energy-efficiency at a cost comparable to 28-nm planar technologies, while its die size is smaller by 20 %. The project will provide Europe with a technical capability beyond state of the art, aspiring to become a global reference in space microelectronics.

Objective

The EFESOS project aims to develop and evaluate a cutting-edge ASIC technology for space applications. More specifically, departing from the characterization of the commercial technology, a radiation-hardened-by-design digital library and a set of complex analog IP cores (ADC, DAC, SERDES and PLL) will be implemented using the 22FDX process from Global Foundries, available at their production facility in Dresden (Germany). A complete electrical, environmental (radiation) and reliability validation of the technology will be performed, and the resulting fully-European design flow will be evaluated according to the ESCC standards with a representative sample chip.
The 22FDX is a 22nm Fully-Depleted SOI technology providing up to 40% die scaling relative to the standard 28nm node, nearly 70% lower power than 28nm and similar power efficiency to FinFET technology.
EFESOS responds to the increasing demand of the European space industry of more integrated ASICs at higher performance, and greatly contributes to the strategic goal of achieving non-dependence on critical technologies. The project will provide Europe with a technical capability beyond the current state-of-the-art, thus becoming a global reference in space microelectronics.

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Topic(s)

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RIA - Research and Innovation action

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Call for proposal

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(opens in new window) H2020-SPACE-2018-2020

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Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 1 635 600,50
Address
KAPELDREEF 75
3001 Leuven
Belgium

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Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Activity type
Research Organisations
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 1 635 600,50

Participants (3)

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