Skip to main content

new generation of High thErmAl efficiency componenTs PACKages for space

Objective

HEATPACK project aims to develop and validate critical technology building blocks for enabling transformative packages for space applications with very low thermal resistance. This is to fully exploit the potential of wide-bandgap technologies which are now being considered as critical in numerous sectors and for space applications in particular, as enhanced thermal management solutions beyond state-of-the-art need to be provided. Benefits will range from improved performance to increased components reliability and lifetime. HEATPACK concepts for achieving high power / high thermal efficiency packages include:
- Diamond based composite materials with a thermal conductivity >600W/m.K to be used as baseplate or insert
- Silver sintering based Thermal Interface Material (TIM) for components assembly
- TIM for package to structure assembly with both electrical and thermal enhanced properties (in excess of 10W/m.K)
- Innovative cooling solutions with strategic implementation possibilities (baseplate, lid, structure…). Using these technologies, two different modules implementing Gallium Nitride (GaN) components will be developed:
-A power supply switching module based on a multilayer ceramic substrate
-A Ka-band High Power Amplifier based on a surface mount hermetic micro package.
The main applications targeted are satellite’s output power section for telecommunication missions in particular, as well as power conditioning / power supply units concerning all satellite payload’s equipment consisting of high power supplies.
To secure a fully European supply chain for high power components thermal management, the technologies developed will reach a TRL of 6, demonstrating commercial viable solutions providing reliability levels compliant with space environments.

Call for proposal

H2020-SPACE-2018
See other projects for this call

Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

THALES ALENIA SPACE FRANCE SAS
Address
Avenue Jean Francois Champollion 26
31100 Toulouse
France
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
EU contribution
€ 617 517,50

Participants (8)

ADAMANT AERODIASTIMIKES EFARMOGES ETAIREIA PERIORISMENIS EFTHYNIS
Greece
EU contribution
€ 251 375
Address
Agias Lavras Thesi Skamnies
265 04 Ano Kastritsi-patras
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
ALTER TECHNOLOGY TUV NORD SA
Spain
EU contribution
€ 258 035
Address
Calle Tomas Alba Edison 4 Isla De La Cartuja
41092 Sevilla
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT
Switzerland
EU contribution
€ 359 850
Address
Rue Jaquet Droz 1
2000 Neuchatel
Activity type
Research Organisations
EGIDE SA
France
EU contribution
€ 308 623,75
Address
Site Industriel Du Sactar
84500 Bollene
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
ALTER TECHNOLOGY TUV NORD UK LIMITED
United Kingdom
EU contribution
€ 320 000
Address
Bain Square 5
EH54 7DQ Livingston
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
RHP TECHNOLOGY GMBH
Austria
EU contribution
€ 276 875
Address
Forschungszentrum Seibersdorf Gebaude Ca
2444 Seibersdorf An Der Leitha
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
UNIVERSITY OF BRISTOL
United Kingdom
EU contribution
€ 279 392,50
Address
Beacon House Queens Road
BS8 1QU Bristol
Activity type
Higher or Secondary Education Establishments
POLITECHNIKA WARSZAWSKA
Poland
EU contribution
€ 269 630
Address
Plac Politechniki 1
00 661 Warszawa
Activity type
Higher or Secondary Education Establishments