Deliverables Demonstrators, pilots, prototypes (1) First active cooler available First breadboard of a silicon block embedding horizontal micro heat pipes active cooler available Publications Conference proceedings (5) A novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment of packaged devices Author(s): Zeina Abdallah, Nathawat Poopakdee, James W. Pomeroyand Martin Kuball Published in: CS MANTECH, 2022 Publisher: CS MANTECH Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles Author(s): Marcin Myśliwiec; Ryszard Kisiel; Krystian Pavłov; Mirosław J. Kruszewski Published in: 45th International Spring Seminar on Electronics Technology (ISSE), 2022 Publisher: IEEE In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging Author(s): Nathawat Poopakdee, Zeina Abdallah, James W. Pomeroy, and Martin Kuball Published in: ACS Applied Electronic Materials, 2022, ISSN 1558-1566 Publisher: American Chemical Society Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications Author(s): Ryszard Kisiel; Piotr Śpiewak; Mirosław J. Kruszewski Published in: 44th International Spring Seminar on Electronics Technology (ISSE), 2021 Publisher: IEEE Influence of Ag particle shape on mechanical and thermal properties of TIM joints Author(s): Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski Published in: Microelectronics International, 2022 Publisher: Emerald Publishing Limited Other (4) Multifunctional adhesives through nano-enabling for use in space Author(s): Nicolas Blasakis, Athanasios Baltopoulos, Antonios Vavouliotis Published in: 15th International Symposium on Materials in the Space Environment (ISMSE), 2022 Publisher: ESA High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices Author(s): Guido Spinola Durante Published in: SWISS IEEE EPS Webinar Event, 2021 Publisher: IEEE Electronics Packaging Society Active cooling: a solution for low TCE, high thermal conductivity packages Author(s): A. Hoogerwerf, T. Frei, G. Spinola Durante, R. Jose James Published in: IEEE EPS Switzerland Chapter Webinar, 2021 Publisher: IEEE Electronics Packaging Society Taking the heat out of space applications Author(s): HEATPACK consortium Published in: EU Research, 2021 Publisher: EU Research Searching for OpenAIRE data... There was an error trying to search data from OpenAIRE No results available
