new generation of High thErmAl efficiency componenTs PACKages for space

Project Information

HEATPACK

Grant agreement ID: 821963

DOI

10.3030/821963

Project closed

EC signature date 24 October 2018

Start date 1 January 2019

End date 31 March 2023

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Space

Total cost

€ 2 941 298,75

EU contribution

€ 2 941 298,75

Coordinated by

THALES ALENIA SPACE FRANCE SAS
France

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Documents, reports (1)

Thermally Conductive Adhesive film datasheet

Availability of a data sheet describing all the properties of the optimized products whose maturity level is sufficiently high to be marketed

Demonstrators, pilots, prototypes (1)

First active cooler available

First breadboard of a silicon block embedding horizontal micro heat pipes active cooler available

Publications

Conference proceedings (5)

A novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment of packaged devices

Author(s): Zeina Abdallah, Nathawat Poopakdee, James W. Pomeroyand Martin Kuball
Published in: CS MANTECH, 2022
Publisher: CS MANTECH

Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

Author(s): Marcin Myśliwiec; Ryszard Kisiel; Krystian Pavłov; Mirosław J. Kruszewski
Published in: 45th International Spring Seminar on Electronics Technology (ISSE), 2022
Publisher: IEEE

In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging

Author(s): Nathawat Poopakdee, Zeina Abdallah, James W. Pomeroy, and Martin Kuball
Published in: ACS Applied Electronic Materials, 2022, ISSN 1558-1566
Publisher: American Chemical Society

Ag-based Thermal Interface Materials for GaN-on-Si Assembly Chips in Power Applications

Author(s): Ryszard Kisiel; Piotr Śpiewak; Mirosław J. Kruszewski
Published in: 44th International Spring Seminar on Electronics Technology (ISSE), 2021
Publisher: IEEE

Influence of Ag particle shape on mechanical and thermal properties of TIM joints

Author(s): Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski
Published in: Microelectronics International, 2022
Publisher: Emerald Publishing Limited

Other (4)

Multifunctional adhesives through nano-enabling for use in space

Author(s): Nicolas Blasakis, Athanasios Baltopoulos, Antonios Vavouliotis
Published in: 15th International Symposium on Materials in the Space Environment (ISMSE), 2022
Publisher: ESA

High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices

Author(s): Guido Spinola Durante
Published in: SWISS IEEE EPS Webinar Event, 2021
Publisher: IEEE Electronics Packaging Society

Active cooling: a solution for low TCE, high thermal conductivity packages

Author(s): A. Hoogerwerf, T. Frei, G. Spinola Durante, R. Jose James
Published in: IEEE EPS Switzerland Chapter Webinar, 2021
Publisher: IEEE Electronics Packaging Society

Taking the heat out of space applications

Author(s): HEATPACK consortium
Published in: EU Research, 2021
Publisher: EU Research