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Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond

Deliverables

Announcement of TERIPHIC (Preparation of fact-sheet, presentation, press-release)

The document will report on the preparation of basic material for the announcement of TERIPHIC project to the general public through the official tools of the EC and the dissemination channels of the consortium partners

Website availability and set up of social media accounts

The document will report on the preparation of the project website, presenting its structure and initial content. It will also report on the setting up of TERIPHIC accounts in popular social media

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Publications

Over 70-GHz 4.9-V ppdiff InP linear driver for next generation coherent optical communications

Author(s): Hersent Romain, Ouslimani Achour, Dupuy Jean-Yves, Konczykowska Agnieszka, Jorge Filipe, Blache Fabrice, Riet Muriel, Nodjiadjim Virginie, Mismer Colin, Kasbari Abed-Elhak
Published in: 2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2019, Page(s) 1-4
DOI: 10.1109/bcicts45179.2019.8972779

Enabling low-cost high-volume production compatible terabit transceivers with up to 1.6 Tbps capacity and 100Gbps per lane PAM-4 modulation for intra-data center optical interconnects up to 2km: The TERIPHIC project approach

Author(s): Panos Groumas, Christos Tsokos, David de Felipe, Ute Troppenz, Romain Hersent, Paraskevas Bakopoulos, Boaz Atias, Jean-Yves Dupuy, Annachiara Pagano, Anna Chiado Piat, Simon Kibben, Lefteris Gounaridis, Adam Raptakis, Moritz Seyfried, Martin Moehrle, Christos Kouloumentas, Norbert Keil, Hercules Avramopoulos
Published in: Metro and Data Center Optical Networks and Short-Reach Links III, 2020, Page(s) 10
DOI: 10.1117/12.2545352

106-GHz bandwidth InP DHBT linear driver with a 3-Vppdiff swing at 80 GBd in PAM-4

Author(s): R. Hersent, F. Jorge, B. Duval, J.-Y. Dupuy, A. Konczykowska, M. Riet, V. Nodjiadjim, C. Mismer, F. Blache, A. Kasbari, A. Ouslimani
Published in: Electronics Letters, Issue 56/14, 2020, Page(s) 691-693, ISSN 0013-5194
DOI: 10.1049/el.2020.0654