Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond

Información del proyecto

TERIPHIC

Identificador del acuerdo de subvención: 825502

DOI 10.3030/825502

Proyecto cerrado

Fecha de la firma de la CE 24 Octubre 2018

Fecha de inicio 1 Enero 2019

Fecha de finalización 31 Marzo 2023

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total € 5 626 642,50

Aportación de la UE € 4 737 468,75

Coordinado por

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON
Greece

Resultado final

Documents, reports (1)

Project Final report

The report is a concluding summary describing the objectives conducted work outcomes as well as the impact achieved within the active period of the TERIPHIC project

Websites, patent fillings, videos etc. (2)

Announcement of TERIPHIC (Preparation of fact-sheet, presentation, press-release)

The document will report on the preparation of basic material for the announcement of TERIPHIC project to the general public through the official tools of the EC and the dissemination channels of the consortium partners

Website availability and set up of social media accounts

The document will report on the preparation of the project website, presenting its structure and initial content. It will also report on the setting up of TERIPHIC accounts in popular social media

Publicaciones

Conference proceedings (10)

Design, Modelling and Characterization of a 3-Vppd 90-GBaud Over-110-GHz-Bandwidth Linear Driver in 0.5-μm InP DHBTs for Optical Communications

Autores: R. Hersent; Tom K. Johansen; V. Nodjiadjim; F. Jorge; B. Duval; F. Blache; M. Riet; C. Mismer; A. Konczykowska
Publicado en: 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2021, ISBN 978-1-6654-3990-9
Editor: IEEE
DOI: 10.1109/bcicts50416.2021.9682463

Optical bench for multi-lane high-rate transceiver testing

Autores: M. Valvo, E. Andrianopoulos, P. Groumas, R. Mercinelli, A. Pagano and H. Avramopoulos
Publicado en: 2022 Italian Conference on Optics and Photonics (ICOP), Edición Annual, 2023, ISBN 978-1-6654-8882-2
Editor: IEEE
DOI: 10.1109/icop56156.2022.9911733

Recent Advances in High-Speed and Large-Swing Integrated Circuits Implemented in InGaAs and GaAsSb InP DHBT for Terabit-Class Optical Communications

Autores: Agnieszka Konczykowska, Romain Hersent
Publicado en: "InP bipolar transistors to analog front-end integrated circuits: Innovations in devices, THz measurements, compact modeling and circuits"" workshop", 2021
Editor: ESSCIRC ESSDERC 2021

112 GBaud (224 Gb/s) large output swing InP DHBT PAM-4 DAC-driver

Autores: A. Konczykowska; R. Hersent; F. Jorge; M. Riet; V. Nodjiadjim; C. Mismer; C. R. Bolognesi; O. Ostinelli; J.-Y. Dupuy
Publicado en: 24th IEEE International Microwave and Radar Conference (MIKON), Edición Annual, 2022, Página(s) pp 1-4, ISBN 978-1-6654-1106-6
Editor: IEEE
DOI: 10.23919/mikon54314.2022.9924653

4x 200 Gb/s EML-Array with a Single MQW Layer Stack

Autores: M. Theurer, C. Kottke, R. Freund, F. Ganzer, P. Runge, M. Moehrle, U. Troppenz, A. Sigmund, and M. Schell
Publicado en: Optical Fiber Communication Conference 2023, Edición Annual, 2023, ISBN 978-1-957171-18-0
Editor: OPTICA
DOI: 10.1364/ofc.2023.m2d.5

Over 70-GHz 4.9-V ppdiff InP linear driver for next generation coherent optical communications

Autores: Hersent Romain, Ouslimani Achour, Dupuy Jean-Yves, Konczykowska Agnieszka, Jorge Filipe, Blache Fabrice, Riet Muriel, Nodjiadjim Virginie, Mismer Colin, Kasbari Abed-Elhak
Publicado en: 2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2019, Página(s) 1-4, ISBN 978-1-7281-0586-4
Editor: IEEE
DOI: 10.1109/bcicts45179.2019.8972779

Disaggregation and Cloudification of Metropolitan Area Networks: impact on Architecture, Cost and Power Consumption

Autores: Marco Quagliotti, Laura Serra, Annachiara Pagano
Publicado en: 2021 European Conference on Optical Communication (ECOC), Edición Annual, 2021, Página(s) 1-4, ISBN 978-1-6654-3868-1
Editor: IEEE
DOI: 10.1109/ecoc52684.2021.9606070

Enabling low-cost high-volume production compatible terabit transceivers with up to 1.6 Tbps capacity and 100Gbps per lane PAM-4 modulation for intra-data center optical interconnects up to 2km: The TERIPHIC project approach

Autores: Panos Groumas, Christos Tsokos, David de Felipe, Ute Troppenz, Romain Hersent, Paraskevas Bakopoulos, Boaz Atias, Jean-Yves Dupuy, Annachiara Pagano, Anna Chiado Piat, Simon Kibben, Lefteris Gounaridis, Adam Raptakis, Moritz Seyfried, Martin Moehrle, Christos Kouloumentas, Norbert Keil, Hercules Avramopoulos
Publicado en: Metro and Data Center Optical Networks and Short-Reach Links III, 2020, Página(s) 10, ISBN 9781510633803
Editor: SPIE
DOI: 10.1117/12.2545352

Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays

Autores: Ute Troppenz, Michael Theurer, Martin Moehrle, Ariane Sigmund, Marko Gruner, and Martin Schell
Publicado en: 2022
Editor: IEEE

InP/GaAsSb DHBTs: THz Analog Performance and Record 180-Gb/s 5.5Vppd-Swing PAM-4 DAC-Driver

Autores: C. R. Bolognesi; A. M. Arabhavi; R. Hersent; S. Hamzeloui; F. Jorge; X. Wen; M. Riet; M. Luisier; V. Nodjiadjim; F. Ciabatti; C. Mismer; O. Ostinelli; A. Konczykowska
Publicado en: 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), Edición Annual, 2022, Página(s) pp 112-119, ISBN 978-1-6654-9133-4
Editor: IEEE
DOI: 10.1109/bcicts53451.2022.10051763

Peer reviewed articles (1)

106-GHz bandwidth InP DHBT linear driver with a 3-Vppdiff swing at 80 GBd in PAM-4

Autores: R. Hersent, F. Jorge, B. Duval, J.-Y. Dupuy, A. Konczykowska, M. Riet, V. Nodjiadjim, C. Mismer, F. Blache, A. Kasbari, A. Ouslimani
Publicado en: Electronics Letters, Edición 56/14, 2020, Página(s) 691-693, ISSN 0013-5194
Editor: Institute of Electrical Engineers
DOI: 10.1049/el.2020.0654