Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond

Informazioni relative al progetto

TERIPHIC

ID dell’accordo di sovvenzione: 825502

DOI 10.3030/825502

Progetto chiuso

Data della firma CE 24 Ottobre 2018

Data di avvio 1 Gennaio 2019

Data di completamento 31 Marzo 2023

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale € 5 626 642,50

Contributo UE € 4 737 468,75

Coordinato da

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON
Greece

Risultati finali

Documents, reports (1)

Project Final report

The report is a concluding summary describing the objectives conducted work outcomes as well as the impact achieved within the active period of the TERIPHIC project

Websites, patent fillings, videos etc. (2)

Announcement of TERIPHIC (Preparation of fact-sheet, presentation, press-release)

The document will report on the preparation of basic material for the announcement of TERIPHIC project to the general public through the official tools of the EC and the dissemination channels of the consortium partners

Website availability and set up of social media accounts

The document will report on the preparation of the project website, presenting its structure and initial content. It will also report on the setting up of TERIPHIC accounts in popular social media

Pubblicazioni

Conference proceedings (10)

Design, Modelling and Characterization of a 3-Vppd 90-GBaud Over-110-GHz-Bandwidth Linear Driver in 0.5-μm InP DHBTs for Optical Communications

Autori: R. Hersent; Tom K. Johansen; V. Nodjiadjim; F. Jorge; B. Duval; F. Blache; M. Riet; C. Mismer; A. Konczykowska
Pubblicato in: 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2021, ISBN 978-1-6654-3990-9
Editore: IEEE
DOI: 10.1109/bcicts50416.2021.9682463

Optical bench for multi-lane high-rate transceiver testing

Autori: M. Valvo, E. Andrianopoulos, P. Groumas, R. Mercinelli, A. Pagano and H. Avramopoulos
Pubblicato in: 2022 Italian Conference on Optics and Photonics (ICOP), Numero Annual, 2023, ISBN 978-1-6654-8882-2
Editore: IEEE
DOI: 10.1109/icop56156.2022.9911733

Recent Advances in High-Speed and Large-Swing Integrated Circuits Implemented in InGaAs and GaAsSb InP DHBT for Terabit-Class Optical Communications

Autori: Agnieszka Konczykowska, Romain Hersent
Pubblicato in: "InP bipolar transistors to analog front-end integrated circuits: Innovations in devices, THz measurements, compact modeling and circuits"" workshop", 2021
Editore: ESSCIRC ESSDERC 2021

112 GBaud (224 Gb/s) large output swing InP DHBT PAM-4 DAC-driver

Autori: A. Konczykowska; R. Hersent; F. Jorge; M. Riet; V. Nodjiadjim; C. Mismer; C. R. Bolognesi; O. Ostinelli; J.-Y. Dupuy
Pubblicato in: 24th IEEE International Microwave and Radar Conference (MIKON), Numero Annual, 2022, Pagina/e pp 1-4, ISBN 978-1-6654-1106-6
Editore: IEEE
DOI: 10.23919/mikon54314.2022.9924653

4x 200 Gb/s EML-Array with a Single MQW Layer Stack

Autori: M. Theurer, C. Kottke, R. Freund, F. Ganzer, P. Runge, M. Moehrle, U. Troppenz, A. Sigmund, and M. Schell
Pubblicato in: Optical Fiber Communication Conference 2023, Numero Annual, 2023, ISBN 978-1-957171-18-0
Editore: OPTICA
DOI: 10.1364/ofc.2023.m2d.5

Over 70-GHz 4.9-V ppdiff InP linear driver for next generation coherent optical communications

Autori: Hersent Romain, Ouslimani Achour, Dupuy Jean-Yves, Konczykowska Agnieszka, Jorge Filipe, Blache Fabrice, Riet Muriel, Nodjiadjim Virginie, Mismer Colin, Kasbari Abed-Elhak
Pubblicato in: 2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2019, Pagina/e 1-4, ISBN 978-1-7281-0586-4
Editore: IEEE
DOI: 10.1109/bcicts45179.2019.8972779

Disaggregation and Cloudification of Metropolitan Area Networks: impact on Architecture, Cost and Power Consumption

Autori: Marco Quagliotti, Laura Serra, Annachiara Pagano
Pubblicato in: 2021 European Conference on Optical Communication (ECOC), Numero Annual, 2021, Pagina/e 1-4, ISBN 978-1-6654-3868-1
Editore: IEEE
DOI: 10.1109/ecoc52684.2021.9606070

Enabling low-cost high-volume production compatible terabit transceivers with up to 1.6 Tbps capacity and 100Gbps per lane PAM-4 modulation for intra-data center optical interconnects up to 2km: The TERIPHIC project approach

Autori: Panos Groumas, Christos Tsokos, David de Felipe, Ute Troppenz, Romain Hersent, Paraskevas Bakopoulos, Boaz Atias, Jean-Yves Dupuy, Annachiara Pagano, Anna Chiado Piat, Simon Kibben, Lefteris Gounaridis, Adam Raptakis, Moritz Seyfried, Martin Moehrle, Christos Kouloumentas, Norbert Keil, Hercules Avramopoulos
Pubblicato in: Metro and Data Center Optical Networks and Short-Reach Links III, 2020, Pagina/e 10, ISBN 9781510633803
Editore: SPIE
DOI: 10.1117/12.2545352

Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays

Autori: Ute Troppenz, Michael Theurer, Martin Moehrle, Ariane Sigmund, Marko Gruner, and Martin Schell
Pubblicato in: 2022
Editore: IEEE

InP/GaAsSb DHBTs: THz Analog Performance and Record 180-Gb/s 5.5Vppd-Swing PAM-4 DAC-Driver

Autori: C. R. Bolognesi; A. M. Arabhavi; R. Hersent; S. Hamzeloui; F. Jorge; X. Wen; M. Riet; M. Luisier; V. Nodjiadjim; F. Ciabatti; C. Mismer; O. Ostinelli; A. Konczykowska
Pubblicato in: 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), Numero Annual, 2022, Pagina/e pp 112-119, ISBN 978-1-6654-9133-4
Editore: IEEE
DOI: 10.1109/bcicts53451.2022.10051763

Peer reviewed articles (1)

106-GHz bandwidth InP DHBT linear driver with a 3-Vppdiff swing at 80 GBd in PAM-4

Autori: R. Hersent, F. Jorge, B. Duval, J.-Y. Dupuy, A. Konczykowska, M. Riet, V. Nodjiadjim, C. Mismer, F. Blache, A. Kasbari, A. Ouslimani
Pubblicato in: Electronics Letters, Numero 56/14, 2020, Pagina/e 691-693, ISSN 0013-5194
Editore: Institute of Electrical Engineers
DOI: 10.1049/el.2020.0654