Deliverables
Publications
Author(s): Yannick Raffel, Sourav De, Maximilian Lederer, Ricardo Revello Olivo, Raik Hoffmann, Sunanda Thunder, Luca Pirro, Sven Beyer, Talha Chohan, Thomas Kämpfe, Konrad Seidel, Johannes Heitmann
Published in: ACS Applied Electronic Materials, 00000000, 2022, ISSN 0000-0000
Publisher: ACS
DOI: 10.1021/acsaelm.2c00771
Author(s): S. De, F. Müller, N. Laleni, M. Lederer, Y. Raffel, S. Mojumder, S. Abdulazhanov, T. Ali, S. Dünkel, S. Beyer, K. Seidel, T. Kämpfe
Published in: IEEE Electron Device Letters, 00000000, 2022, ISSN 0000-0000
Publisher: IEEE
DOI: 10.1109/led.2022.3216558
Author(s): Rubino, Arianna; Livanelioglu, Can; Qiao, Ning; Payvand, Melika; Indiveri, Giacomo
Published in: IEEE Transactions on Circuits and Systems I: Regular Papers, 68, 15498328, 2021, ISSN 1549-8328
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tcsi.2020.3035575
Author(s): Martino Sorbaro; Martino Sorbaro; Qian Liu; Massimo Bortone; Sadique Sheik
Published in: Frontiers in Neuroscience, Vol 14 (2020), 00000000, 2020, ISSN 0000-0000
Publisher: Frontiers in Neuroscience
DOI: 10.48550/arxiv.1912.01268
Author(s): S. De, F. Müller, H.-H. Le, M. Lederer, Y. Raffel, T. Ali, D. Lu, T. Kämpfe
Published in: IEEE Journal of the Electron Device Society, 21686734, 2022, ISSN 2168-6734
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/jeds.2022.3195119
Author(s): A. Sünbül, T. Ali, K. Mertens, R. Olivo, D. Lehninger, F. Müller, M. Lederer, K. Kühnel, M. Rudolph, S. Oehler, R. Hoffmann, K. Zimmermann, K. Biedermann, P. Schramm, M. Czernohorsky, K. Seidel, T. Kämpfe, L. M. Eng
Published in: IEEE Transactions on Electron Devices, 00189383, 2021, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3131971
Author(s): A. Kazemi, M.M. Sharifi, A.F. Balon Laguna, F. Muller, X. Yin, T. Kampfe, M. Niemier, X.S. Hu
Published in: IEEE Transactions on Computers, 00189340, 2021, ISSN 0018-9340
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tc.2021.3136576
Author(s): M. Chmurski, M. Zubert; K. Bierzynski, A. Santra
Published in: IEEE Access, 00000000, 2021, ISSN 0000-0000
Publisher: IEEE
DOI: 10.1109/access.2021.3081353
Author(s): M. Lederer, R. Olivo, N. Yadav, S. De, K. Seidel, L. M. Eng, T. Kämpfe
Published in: Solid State Electronics, 00000000, 2023, ISSN 0000-0000
Publisher: Elsevier
DOI: 10.1016/j.sse.2022.108501
Author(s): "Christensen, Dennis Valbjø rn; Dittmann, Regina; Linares-Barranco, Bernabe; Sebastian, Abu; Le Gallo, Manuel; Redaelli, Andrea; Slesazeck, Stefan; Mikolajick, Thomas; Spiga, Sabina; Menzel, Stephan; Valov, Ilia; Milano, Gianluca; Ricciardi, Carlo; Liang, Shi-Jun; Miao, Feng; Lanza, Mario; Quill, Tyler J.; Keene, Scott Tom; Salleo, Alberto; Grollier, Julie; Markovic, Danijela; Mizrahi, Alice;"
Published in: Neuromorphic Computing and Engineering, 00000000, 2022, ISSN 0000-0000
Publisher: IOP Publishing
DOI: 10.17863/cam.85140
Author(s): M. Lederer, T. Kämpfe, T. Ali, F. Müller, R. Olivo, R. Hoffmann, N. Laleni, K. Seidel
Published in: IEEE Transactions on Electron Devices, 00189383, 2021, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3068716
Author(s): Mateusz Chmurski; Gianfranco Mauro; Avik Santra; Mariusz Zubert; Gökberk Dagasan
Published in: MDPI Sensors, 00000000, 2021, ISSN 0000-0000
Publisher: MDPI
DOI: 10.3390/s21217298
Author(s): Maximilian Lederer, Konrad Seidel, Ricardo Olivo, Thomas Kämpfe, Lukas M. Eng
Published in: Frontiers in Nanotechnology, 00000000, 2022, ISSN 0000-0000
Publisher: Frontiers
DOI: 10.3389/fnano.2022.900379
Author(s): C. De la Parra, T. Soliman, A. Guntoro, A. Kumar, N. Wehn
Published in: IEEE Micro, 00000000, 2022, ISSN 0000-0000
Publisher: IEEE
DOI: 10.1109/mm.2022.3196865
Author(s): S. De, F. Müller, N. Laleni, T. Soliman, A. Shrivastava, N. Yadav, S. Abdulazhanov, M. Lederer, S. Mojumder, A. Vardar, T. Ali, T. Kirchner, F.-X. Liang, H.-H. Le, Md.A. Baig, D. Lu, K. Seidel, T. Kämpfe
Published in: TechRxiv, 00000000, 2022, ISSN 0000-0000
Publisher: IEEE
DOI: 10.36227/techrxiv.19491212.v1
Author(s): T. Soliman, N. Laleni, T. Kirchner, F. Müller, A. Shrivastava, T. Kämpfe, A. Guntoro, N. Wehn
Published in: ACM Transactions on Embedded Computing Systems, 00000000, 2022, ISSN 0000-0000
Publisher: ACM
DOI: 10.1145/3529760
Author(s): M. Arsalan, A. Santra, V. Issakov
Published in: IEEE Sensor Letters, 00000000, 2022, ISSN 0000-0000
Publisher: IEEE
DOI: 10.1109/lsens.2022.3173589
Author(s): M. Arsalan, A. Santra, V. Issakov
Published in: IEEE Transactions on Microwave Theory and Techniques, 00000000, 2022, ISSN 0000-0000
Publisher: IEEE
DOI: 10.1109/tmtt.2022.3148403
Author(s): Elisa Vianello, Alexandre Valentian
Published in: Journal Neuromorphic Computing and Engineering, 00000000, 2022, ISSN 0000-0000
Publisher: IOP Publishing
DOI: 10.1088/2634-4386/ac4a83
Author(s): Felix Christian Bauer; Dylan R. Muir; Giacomo Indiveri
Published in: IEEE Transactions on Biomedical Circuits and Systems, 19324545, 2019, ISSN 1932-4545
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tbcas.2019.2953001
Author(s): Julian Büchel; Dmitrii Zendrikov; Sergio Solinas; Giacomo Indiveri; Dylan R. Muir
Published in: Scientific Reports, Vol 11, Iss 1, 00000000, 2021, ISSN 0000-0000
Publisher: Nature
DOI: 10.1038/s41598-021-02779-x
Author(s): S. Hoppner, Y. Yan, B. Vogginger, C. Liu, F. Kelber, A. Dixius, S. Scholze, J. Partzsch, M. Stolba, F. Neumarker, G. Ellguth, S. Hartmann, S. Schiefer, T.Hocker, D. Walter, G. Liu, M. Mikaitis, J. Garside, S. Furber, C. Mayr
Published in: arxiv, 00000000, 2022, ISSN 0000-0000
Publisher: arxiv
DOI: 10.48550/arxiv.2103.08392
Author(s): A.F. Wandesleben, D. Truffier-Boutry, V. Brackmann, B. Lilienthal-Uhlig, M. Jaysnkar, S. Beckx, I. Madarevic, A. Demarest, B. Hintze, F. Hochschulz, Y. Le Tiec, A. Spessot, F. Nemouchi
Published in: Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher: River Publishers
Author(s): Nelli Laleni, Taha Soliman, Alptekin Vardar, Thomas Kämpfe
Published in: Embedded Artificial Intelligence, 2022
Publisher: River Publishers
Author(s): L. Zhang, D. Borggreve, F. Vanselow, R. Brederlow
Published in: Intelligent Edge-Embedded Technologies for Digitising Industry, 2022
Publisher: River Publishers
Author(s): Rameez Ismail
Published in: Embedded Artificial Intelligence, 2022
Publisher: River Publishers
Author(s): N. Laleni, T. Soliman, A. Vardar, T. Kämpfe
Published in: Intelligent Edge-Embedded Technologies for Digitising Industry, 2022
Publisher: River Publishers
Author(s): Loreto Mateu
Published in: Embedded Artificial Intelligence, 2022
Publisher: River Publishers
Author(s): Hannah Bos, Dylan Muir
Published in: Embedded Artificial Intelligence, 2022
Publisher: River Publishers
Author(s): P. Vijayan, A. Yousefzadeh, M. Sifalakis, R. van Leuken
Published in: Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher: River Publishers
Author(s): Roland Müller
Published in: Embedded Artificial Intelligence, 2022
Publisher: River Publishers
Author(s): M. Molendijk, K. Vadivel, F. Corradi, G.-J. van Schaik, A. Yousefzadeh, H. Corporaal
Published in: Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher: River Publishers
Author(s): Jianyu Zhao
Published in: Embedded Artificial Intelligence, 2022
Publisher: River Publishers
Author(s): Björn Debaillie, Ilja Ocket, and Peter Debacker
Published in: Intelligent Edge-Embedded Technologies for Digitising Industry, 2022
Publisher: River Publishers
DOI: 10.13052/rp-9788770226103
Author(s): C. De la Parra, A. El-Yamany, T. Soliman, A. Kumar, N. Wehn, A. Guntoro,
Published in: IEEE International Symposium on Circuits and Systems (ISCAS), 2021
Publisher: IEEE
DOI: 10.1109/iscas51556.2021.9401517
Author(s): Chirag Sudarshan; Taha Soliman; Cecilia De la Parra; Christian Weis; Leonardo Ecco; Matthias Jung; Norbert Wehn; Andre Guntoro
Published in: Asia and South Pacific Design Automation Conference (ASP-DAC), 2021
Publisher: IEEE
DOI: 10.1145/3394885.3431522
Author(s): Y. Raffel, S. Thunder, M. Lederer, R. Olivo, R. Hoffmann, L. Pirro, S. Beyer, T. Chohan, P.T. Huang, S. De, T. Kämpfe, K. Seidel, J. Heitman
Published in: International Conference on IC Design and Technology (ICICDT), 2022
Publisher: IEEE
DOI: 10.1109/icicdt56182.2022.993311
Author(s): M. Lederer, T. Kämpfe, T. Ali, K. Seidel
Published in: European Materials Research Society (E-MRS), 2019
Publisher: European Materials Research Society
Author(s): C. Frenkel, G. Indiveri
Published in: International Solid-State Circuits Conference (ISSCC), 2022
Publisher: IEEE
DOI: 10.1109/isscc42614.2022.9731734
Author(s): T. Soliman, R. Olivo, T. Kirchner, C. De La Parra, M. Lederer, T. Kämpfe, A. Guntoro, N. Wehn
Published in: International Conference on Application-specific Systems, Architectures and Processors (ASAP), 2020
Publisher: IEEE
DOI: 10.1109/asap49362.2020.00027
Author(s): L. Grenouillet, N. Castellani, A. Persico, V. Meli, S. Martin, O. Billoint, R. Segaud, S. Bernasconi, C. Pellissier, C. Jahan, C. Charpin-Nicolle, P. Dezest, C. Carabasse, P. Besombes, S. Ricavy, N.-P. Tran, A. Magalhaes-Lucas, A. Roman, C. Boixaderas, T. Magis, M. Bedjaoui, M. Tessaire, A. Seignard, F. Mazen, S. Landis, E. Vianello, G. Molas, F. Gaillard, J. Arcamone, E. Nowak
Published in: IEEE International Memory Workshop (IMW), 2021
Publisher: IEEE
DOI: 10.1109/imw51353.2021.9439607
Author(s): D. Lehninger, H. Mähne, T. Ali, R. Hoffmann, R. Olivo, M. Lederer, K. Mertens, T. Kämpfe, K. Biedermann, M. Landwehr, A. Heinig, D. Wang, Y. Shen, K. Bernert, S. Thiem, K. Seidel
Published in: International Memory Workshop (IMW), 2022
Publisher: IEEE
DOI: 10.1109/imw52921.2022.9779252
Author(s): F. Müller , M. Lederer, R. Olivo, A. Reck, T. Ali, K. Seidel, T. Kämpfe
Published in: IEEE International Symposium on Applications of Ferroelectrics (ISAF), 2021
Publisher: IEEE
DOI: 10.1109/isaf51943.2021.9477384
Author(s): S. Mohapatra, M. Hodaei, S. Yogamani, S. Milz, H. Gotzig, M. Simon, H. Rashed, P. Maeder
Published in: International Conference on Computer Vision Theory and Applications (VISAPP), 2022
Publisher: arxiv
DOI: 10.48550/arxiv.2111.04875
Author(s): T. Soliman, A. Eldebiky, C. De La Parra, A. Guntoro, N. Wehn
Published in: International System-on-Chip Conference (SOCC), 2022
Publisher: IEEE
DOI: 10.1109/socc56010.2022.9908072
Author(s): A. Yousefzadeh, M. Sifalakis
Published in: International Joint Conference on Neural Networks (IJCNN), 2021
Publisher: IEEE
DOI: 10.48550/arxiv.2107.07305
Author(s): M. Lederer, T. Kämpfe, C. Mart, T. Ali, L. Roy, K. Seidel
Published in: Dresden Nanoanalysis Symposium (DNS), 2019
Publisher: Dresden Nanoanalysis Symposium
Author(s): A. Safa, I. Ocket, A. Bourdoux, H. Sahli, Francky Catthoor, Georges G.E. Gielen
Published in: International Joint Conference on Neural Networks (IJCNN), 2022
Publisher: IEEE
DOI: 10.1109/ijcnn55064.2022.9892362
Author(s): Arman Kazemi; Mohammad Mehdi Sharifi; Ann Franchesca Laguna; Franz Muller; Ramin Rajaei; Ricardo Olivo; Thomas Kampfe; Michael Niemier; X. Sharon Hu
Published in: Design, Automation & Test in Europe (DATE), 2021
Publisher: IEEE
DOI: 10.48550/arxiv.2011.07095
Author(s): N. Laleni, T. Soliman, F. Muller, S. Mojumder, T. Kirchner, M. Lederer, T. Hoffmann, A. Guntoro, N. Wehn, T. Kampfe
Published in: MikroSystemTechnik Congress (MSTK), 2021
Publisher: IEEE
Author(s): T. Soliman, F. Müller, T. Kirchner, T. Hoffmann, H. Ganem, E. Karimov, T. Ali, M. Lederer, C. Sudarshan, T. Kämpfe, A. Guntoro, N. Wehn
Published in: IEEE International Electron Devices Meeting (IEDM), 2020
Publisher: IEEE
DOI: 10.1109/iedm13553.2020.9372124
Author(s): M. Lederer, O. R. Olivo, Y. Nandakishor, de Sourav, K. Seidel, E. Lukas, T. Kämpfe
Published in: International Conference on Simulation of Semiconductor Processes and Devices, 2022
Publisher: IEEE
Author(s): K. Seidel, D. Lehninger, R. Hoffmann, T. Ali, M. Lederer, R. Revello, K. Mertens, K. Biedermann, Y. Shen, D. Wang, M. Landwehr, A. Heinig, T. Kämpfe, H. Mähne, K. Bernert, S. Thiem
Published in: VLSI Symposium on Technology & Circuits, 2022
Publisher: IEEE
DOI: 10.1109/vlsitechnologyandcir46769.2022.9830141
Author(s): T. Soliman, R. Olivo, M. Lederer, T. Kämpfe, T. Kirchner, A. Guntoro, N. Wehn
Published in: IEEE International System-on-Chip Conference (SOCC), 2020
Publisher: IEEE
DOI: 10.1109/socc49529.2020.9524750
Author(s): Alexandre Valentian
Published in: AI Expo, 2020
Publisher: ValleyML
Author(s): T. Ali, A. Sünbül, K. Mertens, R. Revello, M. Lederer, D. Lehninger, F. Müller, K. Kühnel, M. Rudolph, S. Oehler, R. Hoffmann, K. Zimmermann, K. Biedermann, M. Czernohorsky, K. Seidel, T. Kämpfe, L.M. Eng
Published in: Silicon Nanoelectronics Workshop (SNW), 2021
Publisher: IEEE
DOI: 10.1109/snw51795.2021.00032
Author(s): Büchel, Julian; Faber, Fynn; Muir, Dylan R.
Published in: International Conference on Learning Representations (ICLR), 2022
Publisher: ICLR
DOI: 10.48550/arxiv.2106.05009
Author(s): B. Vogginger, F. Kelber, S.B. Sampath, J. Partzsch, C. Mayr
Published in: Workshop on Compilers, Deployment, and Tooling for Edge AI (CDAI), 2022
Publisher: IEEE
Author(s): Lei Zhang; David Borggreve; Frank Vanselow; Ralf Brederlow
Published in: International Conference on Modern Circuits and Systems Technologies (MOCAST), 2020
Publisher: IEEE
DOI: 10.1109/mocast49295.2020.9200280
Author(s): M. Gall, M. Gardill, T. Horn, J. Fuchs
Published in: German Microwave Conference (GeMiC), 2020, ISBN 978-3-9820-3971-8
Publisher: IEEE
Author(s): M. Gall, M. Gardill, J. Fuchs, T. Horn
Published in: MTT-S International Microwave Symposium (IMS), 2020
Publisher: IEEE
DOI: 10.1109/ims30576.2020.9223841
Author(s): Amirreza Yousefzadeh, Manolis Sifalakis
Published in: International Joint Conference on Neural Networks (IJCNN), 2022
Publisher: IEEE
DOI: 10.1109/ijcnn55064.2022.9892578
Author(s): M. Arsalan,M. Chmurski, A. Santra, M. El-Masry, R. Weigel, V. Issakov
Published in: IEEE MTT-S International Microwave Symposium (IMS), 2021
Publisher: IEEE
DOI: 10.1109/ims19712.2021.9574994
Author(s): M. Arsalan, A. Santra, V. Issakov
Published in: IEEE International Conference on Machine Learning an Application (ICMLA), 2022
Publisher: IEEE
Author(s): C. Sudarshan, T. Soliman, T. Kämpfe, C. Weis, N. Wehn
Published in: IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), 2022
Publisher: IEEE
Author(s): Giacomo Indiveri
Published in: IEEE International Electron Devices Meeting (IEDM), 2021
Publisher: IEEE
Author(s): Alexandre Valentian
Published in: Planet Tech’Care, 2021
Publisher: Planet Tech’Care
Author(s): A. Safa, I. Ocket, A. Bourdoux, H. Sahli, Francky Catthoor, Georges G.E. Gielen
Published in: International Conference on Intelligent Robots and Systems (IROS), 2022
Publisher: IEEE
DOI: 10.48550/arxiv.2202.08023
Author(s): M. Arsalan,M. Chmurski, A. Santra, M. El-Masry, G. Mauro, V. Issakov
Published in: IEEE International Conference on Emerging Technologies and Factory Automation, 2021
Publisher: IEEE
DOI: 10.1109/etfa45728.2021.9613183
Author(s): M. Lederer, T. Kämpfe, T. Ali, Y. Gao, K. Seidel
Published in: International Symposium on Integrated Functionalities (ISIF), 2019
Publisher: International Symposium on Integrated Functionalities
Author(s): E. Esmanhotto, L. Brunet, N. Castellani, D. Bonnet, T. Dalgaty, L. Grenouillet, D.R.B Ly, C. Cagli, C. Vizioz, N. Allouti, F. Laulagnet, O. Gully, N. Bernard-Henriques, M. Bocquet, G. Molas, P. Vivet, D. Querlioz, J.M. Portal, S. Mitra, F. Andrieu, C. Fenouillet-Beranger, E. Nowak, E. Vianello
Published in: IEEE International Electron Devices Meeting (IEDM), 2020
Publisher: IEEE
DOI: 10.1109/iedm13553.2020.9372019
Author(s): T. Soliman, C. De La Parra, A. Guntoro and N. Wehn
Published in: International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2021
Publisher: IEEE
DOI: 10.1109/aicas51828.2021.9458456
Author(s): X. Guo, X. Ma, F. Müller, R. Olivo, J. Wu, K. Ni, T. Kämpfe, Y. Liu, H. Yang, X. Li
Published in: European Solid State Circuits Conference (ESSCIRC), 2021
Publisher: IEEE
DOI: 10.1109/esscirc53450.2021.9567880
Author(s): S. Mohapatra, T. Mesquida, M. Hodaei, S. Yogamani, H. Gotzig, P. Maeder
Published in: International Conference on Event-Based Control, Communication, and Signal Processing (EBCCSP), 2022
Publisher: IEEE
DOI: 10.1109/ebccsp56922.2022.9845647
Author(s): A. Sünbül, T. Ali, Tarek, R. Hoffmann, R. Revello, Y. Raffel, P. Duhan, D. Lehninger, K. Kühnel, M. Rudolph, S. Oehler, P. Schramm, M. Czernohorsky, K. Seidel, T. Kämpfe, L.M. Eng
Published in: International Reliability Physics Symposium (IRPS), 2022
Publisher: IEEE
DOI: 10.1109/irps48227.2022.9764585
Author(s): S. De, Y. Raffel, S. Thunder, F. Müller, M. Lederer, T. Kämpfe
Published in: International Electron Devices & Materials Symposium (IEDMS), 2022
Publisher: IEEE
Author(s): L. Zhang, D. Borggreve, F. Vanselow, R. Brederlow
Published in: IEEE International Symposium on Circuits and Systems (ISCAS), 2021
Publisher: IEEE
DOI: 10.1109/iscas51556.2021.9401279
Author(s): S. Mohapatra, S. Yogamani, H. Gotzig, S. Milz, P. Mader
Published in: IEEE Intelligent Transportation Systems Conference (ITSC), 2021
Publisher: IEEE
DOI: 10.48550/arxiv.2104.10780
Author(s): A. Yousefzadeh, G.-J. van Schaik, M. Tahghighi, P. Detterer, S. Traferro, M. Hijdra, J. Stuijt, F. Corradi, M. Sifalakis, M. Konijnenburg
Published in: Artificial Intelligence Circuit and Systems (AICAS), 2022
Publisher: IEEE
DOI: 10.1109/aicas54282.2022.9870025
Author(s): M. Lederer, F. Müller, A. Varanasi, R. Olivo, K. Mertens, D. Lehninger, Y. Raffel, R. Hoffmann, T. Ali, K. Seidel, T. Kämpfe, L.M. Eng
Published in: Silicon Nanoelectronics Workshop (SNW), 2021
Publisher: IEEE
DOI: 10.1109/snw51795.2021.00033
Author(s): Cagla Sozen
Published in: MSc dissertation, 2022
Publisher: TUe
Author(s): Thomas Kämpfe
Published in: Thesis (habilitation), 2022
Publisher: ResearchGate
Author(s): G. van Schaik
Published in: ICT.OPEN2022, 2022
Publisher: ictopen.nl
Author(s): AI4DI, TEMPO, ANDANTE
Published in: Workshop announcement, 2022
Publisher: vimeo
Author(s): TEMPO consortium
Published in: Press release Fraunhofer Journal, 2020
Publisher: Fraunhofer Journal
Author(s): G. van Schaik
Published in: Neuromorphic Computing Netherlands (NCN2021), 2021
Publisher: cwi
Author(s): Thomas Kämpfe
Published in: WIOT Day Automotive & IIOT Livestream, 2022
Publisher: WIOT Day Automotive & IIOT
Author(s): Giacomo Indiveri
Published in: tinyML EMEA Technical Forum, 2021
Publisher: tinyML
Author(s): T. Soliman, A. Eldebiky, C. De La Parra, A. Guntoro, N. Wehn
Published in: Design Automation Conference (DAC), 2021
Publisher: IEEE
Author(s): AI4DI, TEMPO, ANDANTE
Published in: Workshop announcement, 2022
Publisher: vimeo
Author(s): Videantis
Published in: Press release videantis, 2022
Publisher: Videantis
Author(s): Björn Debaillie
Published in: The international workshop on edge artificial intelligence for industrial applications (EAI4IA), 2022
Publisher: TEMPO
Author(s): Giacomo Indiveri
Published in: Invited lecture Dipartimento Politecnico di Ingegneria e Architettura, University of Udine, 2021
Publisher: University of Udine
Author(s): A. Yousefzadeh
Published in: TinyML summit 2022, 2022
Publisher: TinyML
Author(s): Giacomo Indiveri
Published in: International Workshop on Artificial life and evolutionary computation, 2021
Publisher: International Workshop on Artificial life and evolutionary computation
Author(s): TEMPO consortium
Published in: Imec press release, 2019
Publisher: imec
Author(s): Thomas Kämpfe
Published in: International Conference on IC Design and Technology, 2022
Publisher: IEEE
Author(s): SynSense
Published in: SynSense press release, 2019
Publisher: SynSense
Author(s): Ovidiu Vermesan, Franz Wotawa, Mario Diaz Nava, Björn Debaillie
Published in: Industrial Artificial Intelligence Technologies and Applications, 2022
Publisher: River Publishers
DOI: 10.13052/rp-9788770227902
Author(s): Ovidiu Vermesan, Björn Debaillie, Mario Diaz Nava
Published in: Embedded Artificial Intelligence, 2022
Publisher: River Publishers