The CHALLENGES project successfully advanced nanoscale metrology and set a new benchmark for real-time, high-resolution strain characterisation in the semiconductor, photovoltaic and 2D materials industries. By integrating plasmon-enhanced AFM techniques with machine learning-driven strain mapping, the project provided a non-destructive, highly accurate characterisation method that significantly improves manufacturing efficiency and product reliability.
Prior to CHALLENGES, strain characterisation at the nanoscale was limited by existing techniques. Transmission electron microscopy (TEM), while highly accurate, is destructive and requires extensive sample preparation. X-ray diffraction (XRD), while non-destructive, lacks the spatial resolution required for nanoscale analysis. Optical spectroscopies such as Raman, infrared (IR) and photoluminescence (PL) are widely used, but struggle with resolution and sensitivity in real-time industrial environments. To overcome these challenges, CHALLENGES introduced titanium nitride (TiN)-coated AFM tips, which outperform conventional AgAu probes in terms of durability, cleanroom compatibility and plasmonic enhancement, while being more cost effective. The project also proved effective a method for AI-driven strain mapping, which uses machine learning algorithms to autonomously detect nanoscale features, significantly reducing analysis time while improving accuracy. In addition, CHALLENGES contributed to the development of standardised metrology protocols, ensuring scalability and adoption in diverse industrial environments.
The project's innovations were successfully validated in real industrial environments, with the TERS-based metrology system demonstrating its effectiveness in CMOS electronics, silicon photovoltaics and 2D materials. The use of TiN AFM probes with their extended lifetime led to a significant reduction in operating costs, providing a more sustainable and efficient metrology solution. Collaboration with the EU twin project, Charisma, further strengthened the establishment of industry standard protocols, facilitating the wider adoption of CHALLENGES innovations across multiple sectors.
The impact of CHALLENGES extends well beyond its immediate applications. By improving manufacturing efficiency and reducing characterisation costs, the project is strengthening the competitiveness of European industry in nanometrology and advanced manufacturing. The innovations developed will support next-generation materials research and drive advances in flexible electronics, quantum computing and AI-driven nanomanufacturing. The potential applications of CHALLENGES extend to biomedical technologies, where high-precision metrology at the nanoscale can improve implantable devices and MEMS technologies, further broadening their societal relevance.
By bridging the gap between fundamental research and industrial applications, CHALLENGES has redefined nanoscale metrology and provided a scalable, adaptable framework that will drive future breakthroughs in semiconductor manufacturing, renewable energy technologies and materials science. The project's technological advances will continue to shape these fields long after its completion, bringing lasting industrial, economic and societal benefits.
