Periodic Reporting for period 2 - CHALLENGES (Real time nano CHAracterization reLatEd techNloGiEeS)
Berichtszeitraum: 2021-10-01 bis 2024-08-31
The CHALLENGES project aimed to develop a real-time, non-destructive nanoscale metrology system for strain characterisation in industrial environments. Addressing a key gap in in-line materials control, the project demonstrated that plasmon-enhanced scanning probe techniques, combined with machine learning, enable high-speed, high-precision strain analysis in semiconductor, photovoltaic and 2D materials applications.
Key advances include:
● Titanium nitride (TiN) AFM tips, offering enhanced plasmonic performance and superior durability in clean room environments compared to conventional AgAu probes.
● Neural network based analysis to improve identification of nanoscale features and optimise measurement efficiency.
● Validation of nanoscale metrology in CMOS electronics, silicon photovoltaics and 2D materials, demonstrating the feasibility of in-line strain characterisation.
The project's results increase measurement speed and strain sensitivity, outperforming conventional techniques. Despite external geopolitical challenges, CHALLENGES successfully delivered a robust, high-resolution and industrially relevant metrology system with applications beyond semiconductors and photovoltaics to DRAM, MEMS, nanocoatings and biomedical devices. Its technological innovations set a new benchmark for nanoscale metrology, improving product reliability, manufacturing efficiency and industrial competitiveness
Key advances include:
● Titanium nitride (TiN) AFM tips, offering enhanced plasmonic performance and superior durability in clean room environments compared to conventional AgAu probes.
● Neural network based analysis to improve identification of nanoscale features and optimise measurement efficiency.
● Validation of nanoscale metrology in CMOS electronics, silicon photovoltaics and 2D materials, demonstrating the feasibility of in-line strain characterisation.
The project's results increase measurement speed and strain sensitivity, outperforming conventional techniques. Despite external geopolitical challenges, CHALLENGES successfully delivered a robust, high-resolution and industrially relevant metrology system with applications beyond semiconductors and photovoltaics to DRAM, MEMS, nanocoatings and biomedical devices. Its technological innovations set a new benchmark for nanoscale metrology, improving product reliability, manufacturing efficiency and industrial competitiveness
The CHALLENGES project extended the capabilities of AFM-based nanoscale metrology by integrating plasmonic enhancement techniques and machine learning driven analysis. The work was divided into six technical work packages, each contributing to the development, validation and industrial application of advanced metrology solutions.
In the initial phase, CHALLENGES focused on the technical groundwork, resulting in key deliverables:
● D1.1-D1.4: Sample characterisation for CMOS, photovoltaic and 2D materials.
● D2.1: Modelling of laser-tip interactions and plasmonic materials for TERS applications.
● D3.1-D3.2: Definition of spectrometer requirements and achievable performance.
● D6.1: Innovation management framework.
● D7.1-D7.3: Dissemination strategy, including a plan for the exploitation and dissemination of results (PEDR), a training plan and outreach activities.
● D8.1-D8.3: project management tools, such as the project manual, risk catalogue and establishment of a collaborative workspace.
Dissemination activities started early with participation in international conferences, workshops and training events to ensure broad knowledge transfer.
Key technological breakthroughs were achieved as the project progressed:
● Development of TiN AFM probes: The TiN-coated probes demonstrated superior plasmonic enhancement, durability and cleanroom compatibility, outperforming AgAu probes in both performance and durability.
● Machine learning based strain characterisation: A neural network model was trained to identify nanoscale regions of interest, significantly reducing measurement time and improving characterisation efficiency.
● Validation in industrial environments: The TERS-based metrology system has been successfully tested and proven effective in CMOS electronics, silicon photovoltaics and 2D materials, confirming its practical application in in-line manufacturing.
Strategic partnerships with semiconductor and photovoltaic manufacturers facilitated the direct exploitation of CHALLENGES innovations and ensured seamless integration into real production environments. Collaboration with the EU twin project, Charisma, further contributed to the standardisation of inline nanoscale strain measurement protocols.
In the initial phase, CHALLENGES focused on the technical groundwork, resulting in key deliverables:
● D1.1-D1.4: Sample characterisation for CMOS, photovoltaic and 2D materials.
● D2.1: Modelling of laser-tip interactions and plasmonic materials for TERS applications.
● D3.1-D3.2: Definition of spectrometer requirements and achievable performance.
● D6.1: Innovation management framework.
● D7.1-D7.3: Dissemination strategy, including a plan for the exploitation and dissemination of results (PEDR), a training plan and outreach activities.
● D8.1-D8.3: project management tools, such as the project manual, risk catalogue and establishment of a collaborative workspace.
Dissemination activities started early with participation in international conferences, workshops and training events to ensure broad knowledge transfer.
Key technological breakthroughs were achieved as the project progressed:
● Development of TiN AFM probes: The TiN-coated probes demonstrated superior plasmonic enhancement, durability and cleanroom compatibility, outperforming AgAu probes in both performance and durability.
● Machine learning based strain characterisation: A neural network model was trained to identify nanoscale regions of interest, significantly reducing measurement time and improving characterisation efficiency.
● Validation in industrial environments: The TERS-based metrology system has been successfully tested and proven effective in CMOS electronics, silicon photovoltaics and 2D materials, confirming its practical application in in-line manufacturing.
Strategic partnerships with semiconductor and photovoltaic manufacturers facilitated the direct exploitation of CHALLENGES innovations and ensured seamless integration into real production environments. Collaboration with the EU twin project, Charisma, further contributed to the standardisation of inline nanoscale strain measurement protocols.
The CHALLENGES project successfully advanced nanoscale metrology and set a new benchmark for real-time, high-resolution strain characterisation in the semiconductor, photovoltaic and 2D materials industries. By integrating plasmon-enhanced AFM techniques with machine learning-driven strain mapping, the project provided a non-destructive, highly accurate characterisation method that significantly improves manufacturing efficiency and product reliability.
Prior to CHALLENGES, strain characterisation at the nanoscale was limited by existing techniques. Transmission electron microscopy (TEM), while highly accurate, is destructive and requires extensive sample preparation. X-ray diffraction (XRD), while non-destructive, lacks the spatial resolution required for nanoscale analysis. Optical spectroscopies such as Raman, infrared (IR) and photoluminescence (PL) are widely used, but struggle with resolution and sensitivity in real-time industrial environments. To overcome these challenges, CHALLENGES introduced titanium nitride (TiN)-coated AFM tips, which outperform conventional AgAu probes in terms of durability, cleanroom compatibility and plasmonic enhancement, while being more cost effective. The project also proved effective a method for AI-driven strain mapping, which uses machine learning algorithms to autonomously detect nanoscale features, significantly reducing analysis time while improving accuracy. In addition, CHALLENGES contributed to the development of standardised metrology protocols, ensuring scalability and adoption in diverse industrial environments.
The project's innovations were successfully validated in real industrial environments, with the TERS-based metrology system demonstrating its effectiveness in CMOS electronics, silicon photovoltaics and 2D materials. The use of TiN AFM probes with their extended lifetime led to a significant reduction in operating costs, providing a more sustainable and efficient metrology solution. Collaboration with the EU twin project, Charisma, further strengthened the establishment of industry standard protocols, facilitating the wider adoption of CHALLENGES innovations across multiple sectors.
The impact of CHALLENGES extends well beyond its immediate applications. By improving manufacturing efficiency and reducing characterisation costs, the project is strengthening the competitiveness of European industry in nanometrology and advanced manufacturing. The innovations developed will support next-generation materials research and drive advances in flexible electronics, quantum computing and AI-driven nanomanufacturing. The potential applications of CHALLENGES extend to biomedical technologies, where high-precision metrology at the nanoscale can improve implantable devices and MEMS technologies, further broadening their societal relevance.
By bridging the gap between fundamental research and industrial applications, CHALLENGES has redefined nanoscale metrology and provided a scalable, adaptable framework that will drive future breakthroughs in semiconductor manufacturing, renewable energy technologies and materials science. The project's technological advances will continue to shape these fields long after its completion, bringing lasting industrial, economic and societal benefits.
Prior to CHALLENGES, strain characterisation at the nanoscale was limited by existing techniques. Transmission electron microscopy (TEM), while highly accurate, is destructive and requires extensive sample preparation. X-ray diffraction (XRD), while non-destructive, lacks the spatial resolution required for nanoscale analysis. Optical spectroscopies such as Raman, infrared (IR) and photoluminescence (PL) are widely used, but struggle with resolution and sensitivity in real-time industrial environments. To overcome these challenges, CHALLENGES introduced titanium nitride (TiN)-coated AFM tips, which outperform conventional AgAu probes in terms of durability, cleanroom compatibility and plasmonic enhancement, while being more cost effective. The project also proved effective a method for AI-driven strain mapping, which uses machine learning algorithms to autonomously detect nanoscale features, significantly reducing analysis time while improving accuracy. In addition, CHALLENGES contributed to the development of standardised metrology protocols, ensuring scalability and adoption in diverse industrial environments.
The project's innovations were successfully validated in real industrial environments, with the TERS-based metrology system demonstrating its effectiveness in CMOS electronics, silicon photovoltaics and 2D materials. The use of TiN AFM probes with their extended lifetime led to a significant reduction in operating costs, providing a more sustainable and efficient metrology solution. Collaboration with the EU twin project, Charisma, further strengthened the establishment of industry standard protocols, facilitating the wider adoption of CHALLENGES innovations across multiple sectors.
The impact of CHALLENGES extends well beyond its immediate applications. By improving manufacturing efficiency and reducing characterisation costs, the project is strengthening the competitiveness of European industry in nanometrology and advanced manufacturing. The innovations developed will support next-generation materials research and drive advances in flexible electronics, quantum computing and AI-driven nanomanufacturing. The potential applications of CHALLENGES extend to biomedical technologies, where high-precision metrology at the nanoscale can improve implantable devices and MEMS technologies, further broadening their societal relevance.
By bridging the gap between fundamental research and industrial applications, CHALLENGES has redefined nanoscale metrology and provided a scalable, adaptable framework that will drive future breakthroughs in semiconductor manufacturing, renewable energy technologies and materials science. The project's technological advances will continue to shape these fields long after its completion, bringing lasting industrial, economic and societal benefits.