Descrizione del progetto
Sorgenti luminose monolitiche on-chip a base di colloidi a basso costo
La fotonica del silicio sta formando la spina dorsale delle tecnologie on-chip e delle telecomunicazioni ottiche di prossima generazione. A differenza della tecnologia dei semiconduttori III-V concorrente, la fotonica del silicio promette circuiti fotonici integrati (PIC) molto più efficienti dal punto di vista dei costi. Il progetto POSEIDON, finanziato dall’UE, affronterà l’esigenza critica di integrazione monolitica delle sorgenti luminose on-chip pronte per la produzione di massa. Utilizzando colloidi attivi in grado di auto-organizzarsi in strutture 3D, il progetto si propone di sviluppare sorgenti luminose in scala nanometrica di lunghezza variabile che possono essere integrate monoliticamente nel back-end dei PIC. Le attività del progetto comprenderanno l’intera catena di processo, dalla progettazione assistita da computer alla sintesi controllata, all’assemblaggio gerarchico, all’integrazione optoelettronica e alla fabbricazione dei dispositivi. La realizzazione di questa piattaforma innovativa per PIC generici, che comprende componenti colloidali attivi monoliticamente integrati, potrebbe aumentare la competitività dell’Europa in molti settori.
Obiettivo
Silicon photonics made tremendous progress in the last decade and promises far more cost effective photonic integrated circuits (PICs) than competing III-V semiconductors. However, a monolithically integrable, mass-manufacturable light source is missing. All approaches of heterogeneous integration of III-V light sources are costly and not highly scalable, creating massive cost and complexity barriers for the commercialization of PICs. The ground-breaking aim of POSEIDON is to develop a radically new bottom-up approach towards multi-scale, on chip self-assembly of active colloids based on low cost colloid technology. For the first time this encompasses the entire process chain of computer-aided design, controlled synthesis, hierarchical assembly, optoelectronic integration and device fabrication. By controlling and designing self-assembly processes directly on a device, addressing length scales from nm to 100’s of μm simultaneously, our approach allows to fabricate functional nanophotonic components with 3D, single-nm resolution integrated into complex PICs. The ambitious goal of POSEIDON is to thereby develop electrically pumped light sources which can be monolithically integrated into the back-end of CMOS chips. This breakthrough overcomes the limitations of top-down PIC fabrication and tears down the massive cost and complexity barriers initially mentioned. The short term benefits can be quantum leaps in data center energy efficiency and network performance, enabled by the project targeting the usual Datacom wavelengths, and cheap yet powerful optical sensors. In the long run a revolutionary platform for generic PICs consisting of monolithically integrated active colloidal components (light sources and detectors), Si/Si nitride photonics and CMOS electronics can emerge from POSEIDON. This will transform Europe’s industrial landscape and provide sustainable solutions to societal challenges across ICT, quantum technologies, energy, environment, health and security.
Campo scientifico
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensors
- natural sciencesphysical sciencescondensed matter physicssoft matter physics
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
- natural scienceschemical sciencesinorganic chemistrymetalloids
- engineering and technologynanotechnologynanophotonics
Programma(i)
Invito a presentare proposte
Vedi altri progetti per questo bandoBando secondario
H2020-FETOPEN-2018-2019-2020-01
Meccanismo di finanziamento
RIA - Research and Innovation actionCoordinatore
52074 Aachen
Germania
L’organizzazione si è definita una PMI (piccola e media impresa) al momento della firma dell’accordo di sovvenzione.