COmponents and MAcrocomponents Packaging For Space

Project Information

COMAP-4S

Grant agreement ID: 870356

DOI

10.3030/870356

Project closed

EC signature date 20 December 2019

Start date 1 January 2020

End date 30 June 2024

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Space

Total cost

€ 3 000 275,00

EU contribution

€ 2 975 275,00

Coordinated by

SAFRAN ELECTRONICS & DEFENSE
France

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Publications

Conference proceedings (1)

High density PCB technology for high reliability applications using Low CTE material

Author(s): Joachim Verhegge (ACB), Jean-Claude Fabre (SAFRAN Electronics & Defense), Thomas Löher (TUB), Nadia Ibellaatti (NANOXPLORE)
Published in: 2023
Publisher: IPC APEX EXPO 2023