Building the fully European supplY chain on RFSOI, enabling New RF Domains for Sensing, Communication, 5G and beyond

High-Temperature Characterization of Multiple Silicon-Based Substrate for RF-IC Applications

Author(s): Q. Courte, M. Rack, M. Nabet, P. Cardinael and J.-P. Raskin
Published in: 2022
Publisher: in IEEE Journal of the Electron Devices Society
DOI: 10.1109/jeds.2022.3188893

Self-Heating Characterization in 22FDX and 45RFSOI

Author(s): A. Halder
Published in: 2021
Publisher: GlobalFoundries 45RFSOI Team USA, Online

Multi-beam antenna for Ka-band CubeSat connectivity using 3-D printed lens and antenna array

Author(s): K. Trzebiatowski, W. Kalista, M. Rzymowski, L. Kulas and K. Nyka
Published in: 2022
Publisher: in IEEE Antennas and Wireless Propagation Letters, 2022 (accepted for publication).

“FD-SOI mm-Wave Differential Single-Pole Switches with Ultra-High Isolation”,

Author(s): M. Rack et al.
Published in: Issue pp. 1-2., 2021
Publisher: Int. Symp. on VLSI Technology, Systems and Applications (VLSI-TSA)

Performance Evaluation of V2X Communication for Connected Autonomous Vehicles in Platooning

Author(s): Burak Senkus, Mujdat Soyturk.
Published in: 2022
Publisher: In: 48th Annual Conference of the Industrial Electronics Society IECON 2022 Conference.

The phrase-derived metric for human target recognition using a 77-GHz MIMO FMCW radar

Author(s): Keivan Alirezazad
Published in: 2023
Publisher: UNIBWM

Simulation of Nitrogen In-Diffusion and its Impact on Silicon Wafer Strength

Author(s): T. Müller, G. Kissinger, D. Kot, M. Gehmlich, M. Boy, A. Vollkopf, A. Sattler, A. Miller
Published in: 19th Conference on Gettering and Defect Engineering in Semiconductor Technology (GADEST 2021), 2022
Publisher: Siltronic

“Impact of Device Shunt Loss on mm-Wave Switch Performance in 22 nm FD-SOI and DC-80 GHz SPDT”

Author(s): [C4] M. Rack, L. Nyssens, Q. Courte, D. Lederer, and J.-P. Raskin
Published in: 2021
Publisher: ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference
DOI: 10.1109/essderc53440.2021.9631835

High-Efficiency Power Amplifiers in RF-SOI technology: Challenges, Progress and Perspectives

Author(s): A. Giry, A. Serhan, P. Reynier
Published in: 2021
Publisher: ESSCIRC 2021 Workshop

High-Resistivity Substrates with PN Interface Passivation in 22 nm FD-SOI

Author(s): M. Rack et al.
Published in: 2022
Publisher: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 2022, pp. 1-2,
DOI: 10.1109/vlsi-tsa54299.2022.9771028

A Configurable Implementation of Adaptive Digital Predistortion System for RF Power Amplifiers

Author(s): Dursun Baran, Emre Ulusoy
Published in: 2022
Publisher: MIKON 2022

Hybrid architectures and technologies for Load-Modulated Power Amplifiers

Author(s): A. Serhan, A. Giry, P. Reynier, D. Parat
Published in: 2022
Publisher: "Workshop IEEE RFIC ""Recent Developments in Sub-6 GHz PAs and Front-End Modules"""

Back-Gate Lumped Resistance Effect on AC Characteristics of FD-SOI MOSFET

Author(s): M. Vanbrabant, et al
Published in: vol. 32, no. 6, pp. 704-707, 2022
Publisher: in IEEE Microwave and Wireless Components Letter
DOI: 10.1109/lmwc.2022.3162497

11.8 GHz LC-VCO in 65 nm CMOS for 5G NR Based C-V2X Applications

Author(s): Kayanselcuk T. , Zencir E. A Low Power, Low Phase Noise
Published in: 31(08):2250140., 2022
Publisher: Journal of Circuits, Systems and Computers

Trends and innovation on engineering substrates for 5G and beyond

Author(s): L. Andia
Published in: IEEE LAEDC 2021, 2021
Publisher: SOITEC

Spectrum Sensing and Signal Identification With Deep Learning Based on Spectral Correlation Function

Author(s): K. Tekbıyık, Ö. Akbunar, A. R. Ekti, A. Görçin, G. K. Kurt and K. A. Qaraqe
Published in: vol. 70, no. 10, pp. 10514-10527, 2021
Publisher: in IEEE Transactions on Vehicular Technology.

22 nm FD-SOI MOSFET Figures of Merit at high temperatures upto 175 °C

Author(s): A. Halder, L. Nyssens, M. Rack, D. Lederer, V. Kilchytska and J.-P. Raskin
Published in: 2022
Publisher: 2022 IEEE 22nd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
DOI: 10.1109/sirf53094.2022.9720052

"""Addressing design challenges in High-Power Wi-Fi 5/6 Front End Modules"""

Author(s): P. Reynier, V. Poisson
Published in: 2021
Publisher: ESSCIRC 2021 Workshop

PN Junctions Interface Passivation in 22 nm FD-SOI for Low-Loss Passives

Author(s): Lucas Nyssens
Published in: 24th International Microwave and Radar Conference, 2022
Publisher: MIKON 2022

European Semiconductor Outlook and two case studies; OCEAN12 & BEYOND5

Author(s): Erkan İsa, Dominique Morche
Published in: 2023
Publisher: FhG , CEA-LETI

A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications

Author(s): P. Reynier; A. Serhan; D. Parat; R. Mourot; M. Gaye; P. Kauv; A. Cardoso; A. Gouvea; S. Nogueira; A. Giry
Published in: 2021
Publisher: RFIC 2021 Conference

A highly rugged 39 GHz 19.3 dBm Power Amplifier for 5G Applications in 45nm SOI Technology

Author(s): N. Baudouin, Y. Morandini
Published in: EUMW - European Microwave Week, 2022
Publisher: LETI & SOITEC

"“ SOI technology and design challenges for RF and mmWave: from Front-End Modules to SoC"""

Author(s): Y. Morandini
Published in: 2021
Publisher: ESSDERC 2021

Modeling of Semiconductor Substrates for RF Applications: Part I—Static and Dynamic Physics of Carriers and Traps

Author(s): M. Rack, F. Allibert and J. -P. Raskin
Published in: vol. 68, no. 9, pp. 4598-4605, 2021
Publisher: IEEE TED
DOI: 10.1109/ted.2021.3096777

Wideband Load pull Techniques: State of the art and future perspective

Author(s): G. Avolio, M. Marchetti
Published in: URSI GAAS, 2021
Publisher: Anteverta

Wideband Modulated Load- Pull for Design Validation and Verification

Author(s): Mauro Marchetti
Published in: European Microwave Week(EUMW), 2021
Publisher: Anteverta

Back-Gate Network Extraction Free from Dynamic Self-Heating in FD SOI

Author(s): Lucas Nyssens, Martin Rack, Arka Halder, Martin Vanbrabant, Valeriya Kilchytska, Jean-Pierre Raskin
Published in: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), 2021, Page(s) 1-2, ISBN 978-1-6654-1934-5
Publisher: IEEE
DOI: 10.1109/vlsi-tsa51926.2021.9440125

A DC 120 GHz SPDT Switch Based on 22 nm FD SOI SLVT NFETs with Substrate Isolation Rings Towards Increased Shunt Impedance

Author(s): M. Rack
Published in: IEEE Radio Frequency Integrated Circuits Symposium, 2022
Publisher: UCL

VeNIT LAB By MU

Author(s): Müjdat Soytürk, Berkay Yaman, Burak Şenkuş, Hüseyin Aydın
Published in: 2022
Publisher: MU

High-Temperature Characterization of Novel Silicon-Based Substrate Solutions for RF-IC Applications

Author(s): Q. Courte, M. Rack, M. Nabet, P. Cardinael and J.-P. Raskin,
Published in: 51st European Solid-State Device Research Conference, 2021
Publisher: ESSDERC UCL_C3

“TCAD at the heart of innovation in RF SOI technology”

Author(s): J.-P. Raskin
Published in: 2020
Publisher: UCL

"""Pre-recorded presentation of Demo 2 (Beyond5) - How to build a smarter, more secure, greener automotive chips, software and systems”."

Author(s): Berfin Kahraman, Anja Boelicke, François Brunier
Published in: 2020
Publisher: IP SoC 2020 Grenoble

Presentation of BEYOND5 project

Author(s): Soitec
Published in: IEEE BROAD Workshop, 2020
Publisher: Soitec

Integrated Circuits for 5G Wireless Communication”

Author(s): Giovanni Mangraviti
Published in: 2020
Publisher: the “5G Forum” EUROPEAN MICROWAVE WEEK 2020

Implementation of High Performance Multi-Agent Position Feeding Framework

Author(s): Burak Senkus, Berkay Yaman, Huseyin Aydin and Mujdat Soyturk
Published in: 2022
Publisher: 24th International Microwave and Radar Conference

Metrology for tomorrow s micro - and nanoelectronics

Author(s): Prof. Dr.rer.nat. Marius Enachescu
Published in: IEEE Nanotechnology Council, 2020
Publisher: UPB

Engineering Trap Rich Layers for communication applications

Author(s): F. Allibert
Published in: EUROSOI ULIS 2021, 2021
Publisher: SOITEC

Analysis of RF Stress Influence on Large-Signal Performance of 22nm FDSOI CMOS Transistors

Author(s): D. K. Huynh, Q. H. Le, S. Lehmann, Z. Zhao, G. Bossu, W. Arfaoui, D.
Published in: 2022
Publisher: EuMC Conference 2022

Impact of Substrate Resistivity on Spiral Inductors at MM Wave Frequencies

Author(s): L. Nyssens
Published in: EUROSOI ULIS 2022, 2022
Publisher: UCL
DOI: 10.1016/j.sse.2022.108377

“Modeling of Semiconductor Substrates for RF Applications: Part I—Static and Dynamic Physics of Carriers and Traps”

Author(s): M. Rack ( UCL), F. Allibert (SOITEC)
Published in: Issue IEEE TED, VOL. 68, NO. 9,, 2021
Publisher: IEEE TED

A Novel Approach for Doherty PA Design using a Compact L-C Combiner

Author(s): J. Bachi, A. Serhan, D-K. Germain Pham, D. Parat, P. Reynier, P. Desgreys, A. Giry
Published in: 2022
Publisher: IEEE Transactions on Circuits and Systems--II: Express Briefs

High-resistivity silicon-based substrate using buried PN junctions towards RFSOI applications

Author(s): M. Moulin et al.
Published in: 2022
Publisher: Solid-State Electronics 194
DOI: 10.1016/j.sse.2022.108301

A Novel OTA Near Field Measurement Approach Suitable for 5G mmWave Wideband Modulated Test

Author(s): M. Löhning , T. Deckert, V. Kotzsch, M. Vanden Bossche
Published in: 2022
Publisher: NI

A Reconfigurable SOI CMOS Doherty Power Amplifier Module for Broadband LTE High-Power User Equipment Applications

Author(s): A. Serhan, D. Parat, P. Reynier, M. Pezzin, R. Mourot, F. Chaix, R. Berro, P. Indirayanti , K. Han, M. Borremans, E. Mercier, A. Giry
Published in: 2020
Publisher: RFIC 2020 Conference

Characterization of Traps in High Resistivity Silicon Substrates and Link with Radio Frequency Performances

Author(s): Frédéric Allibert, Eric Vandermolen, Martin Rack
Published in: European Materials Research Society (E-MRS) 2021, 2021
Publisher: Soitec, UCL

A Digital Filter Design at Auxiliary Receiver for Optimal Pre-Distortion Performance

Author(s): Dursun Baran
Published in: Signal Processing and Communications Applications, 2022
Publisher: TUBITAK

Load pull techniques for 5G and 6G applications: state of the art and future

Author(s): M. Marchetti, et al.
Published in: Benelux RF conference, 2022
Publisher: Anteverta

Stress analysis by XRD and Raman on different semiconductor substrates

Author(s): L.B. Enache, G. Mihai, S. Rosoiu, A.G. Pantazi, C. Moise, A.A. Messina, M. Enachescu
Published in: 2022
Publisher: "9th INTERM 2022 ""International Congress on Microscopy & Spectroscopy"", Muğla Province, Turkey"

Sub-6GHz SOI-CMOS High-efficiency linear PA architectures: challenges, techniques, and opportunities

Author(s): Ayssar Serhan
Published in: GdR SoC, National Conference, 2021
Publisher: CEA-Leti

Assessment of RF compact modelling of FD SOI transistors

Author(s): Martin Vanbrabant, Lucas Nyssens, Valeriya Kilchytska, Jean-Pierre Raskin
Published in: 2021 IEEE Latin America Electron Devices Conference (LAEDC), 2021, Page(s) 1-3, ISBN 978-1-6654-1510-1
Publisher: IEEE
DOI: 10.1109/laedc51812.2021.9437955

Modeling of Semiconductor Substrates for RF Applications

Author(s): M. Rack, F. Allibert and J. -P. Raskin
Published in: Part II—Parameter Impact on Harmonic Distortion; vol. 68, no. 9, pp. 4606-4613, 2021
Publisher: IEEE TED
DOI: 10.1109/ted.2021.3096781

A Fully Differential 146.6 157.4 GHz LNA Utilizing Back Gate Control to Adjust Gain in 22 nm FDSOI

Author(s): Patrick Artz et al.
Published in: International Microwave Symposium, 2022
Publisher: FhG

A 2.5-2.6 dB Noise Figure LNA for 39 GHz band in 22 nm FD-SOI with Back-Gate Bias Tunability

Author(s): L. Nyssens, et al
Published in: 2022
Publisher: submitted to EuMW 2022.

Fully Depleted SOI Technology for Millimeter-Wave Integrated Circuits

Author(s): Jean-Pierre Raskin
Published in: vol.10, pp.424-434, 2023
Publisher: IEEE Journal of the Electron Devices Society
DOI: 10.1109/jeds.2022.3165877

A Linear High-Power Reconfigurable SOI-CMOS Front-End Module for WI-FI 6/6E Applications

Author(s): D. Parat, A. Serhan, P. Reynier, R. Mourot, A. Giry
Published in: 2022
Publisher: IEEE RFIC

65nm RFSOI Power Amplifier Transistor Ageing at mmW frequencies, 14GHz and 28GHz

Author(s): A. Divay et al.
Published in: 2021
Publisher: IEDM

From Connected to Autonomous Vehicles: Intelligent Transportation Systems Workshop

Author(s): Mujdat Soyturk, Berkay Yaman
Published in: 2022
Publisher: Marmara University Mehmet Genc Campus

Wideband Load pull Techniques: State of the art and future perspective

Author(s): G. Avolio, M. Marchetti
Published in: EUMW - European Microwave Week, 2022
Publisher: Anteverta

mmWave Communications for Indoor Dense Spaces: Ray Tracing Based Channel Characterization and Performance Comparison

Author(s): O. A. Topal, M. Özger , D. Schupke , E. Björnson , C. Cavdar
Published in: IEEE International Conference on Communications (ICC), 2022
Publisher: KTH

28 GHz Down-Conversion Mixer with RF Back-Gate Excitation Topology in 22-nm FD-SOI

Author(s): M. Nabet, et al
Published in: 2022
Publisher: submitted to EuMW 2022.

Low-Latency MAC Design for Pairwise Random Networks

Author(s): I. A. Meer
Published in: IEEE VTC Spring, 2022
Publisher: KTH
DOI: 10.48550/arxiv.2206.06978

RF-SOI for 5G and beyond

Author(s): Yan Morandini
Published in: ESSCIRC ESSDERC Virtual Educational, 2020
Publisher: Soitec

2D CNN GRU Model for Multi Hand Gesture Recognition System Using FMCW Radar

Author(s): Keivan Alirezazad, Gregor Rhiel, Linus Maurer
Published in: NEWCAS 20th IEEE International NEWCAS Conference, 2022
Publisher: UBWM

Linear Power Amplifiers for Sub-6GHz Mobile Applications : Progress and Trends

Author(s): A. Giry; A. Serhan; D. Parat; P. Reynier
Published in: 2020
Publisher: NEWCAS 2020 Conference

Practical Verification of Over-the-Air Measurements and Correlation across Measurement Setups

Author(s): Thomas Deckert, Okay Schierhorn, Harsh Nitharwal, Jan Fromme
Published in: 2023
Publisher: NI

Energy Efficiency Optimization of Radiofrequency Power Amplifiers for Massive MIMO: A Data Based Approach

Author(s): L. Godoy, E. Matúš and G. Fettweis
Published in: 2021
Publisher: in Proceedings of 2021 IEEE 22nd International Workshop on Signal Processing Advances in Wireless Communications (SPAWC 2021), Lucca, Italy

A dual-polarized 39 GHz 4x4 microstrip antenna array for 5G MU-MIMO airflight cabin connectivity

Author(s): K. Trzebiatowski, J. Fromme, D. Duraj, L. Kulas, K. Nyka,
Published in: 2022
Publisher: 24th International Microwave and Radar Conference (MIKON) 2022 (accepted for publication).

Soitec's engineered substrates for 5G

Author(s): Soitec
Published in: Soitec 5G webinar, 2020
Publisher: Soitec

Effect of probe coupling on MOSFET series resistance extraction up to 110 GHz

Author(s): Lucas Nyssens, Martin Rack, Dimitri Lederer and Jean-Pierre Raskin
Published in: 2022
Publisher: LAEDC Conference

Virtual booth representing BEYOND5 project

Author(s): Soitec
Published in: EFECS 2020, 2020
Publisher: Soitec

A Performance Study of 22nm FDSOI CMOS for Wideband 5G Power Amplifier Applications

Author(s): Quang Huy Le et al.
Published in: 14th German Microwave Conference GeMIC, 2022
Publisher: FhG

Back-Gate Network Extraction Free from Dynamic Self-Heating in FD SOI,

Author(s): L. Nyssens, M. Rack, A. Halder, M. Vanbrabant, V. Kilchytska and J.-P. Raskin,
Published in: Issue Systems and Applications (VLSI-TSA), 2021, pp. 1-2,, 2021
Publisher: UCL_C12021 International Symposium on VLSI Technology, Systems and Applications

“Field-Effect Passivation of Lossy Interfaces in High-Resistivity RF Silicon Substrates”

Author(s): M. Rack, L. Nyssens, M. Nabet, D. Lederer, and J.-P. Raskin,
Published in: 2021
Publisher: EuroSOI-ULIS UCL_C5

Advanced MOSFETs Electrical Characterization for Further Analog and RF applications

Author(s): V. Kilchytska, et al
Published in: 2021
Publisher: invited talk at SBMicro

The Antenna Dome Real-Time Distributed Antenna Pattern Characterization System

Author(s): F. A. Musters; R.A. Coesoij; M.D. Migliore; F. Schettino; M. Spirito
Published in: 2021
Publisher: IMS ARFTG Conference

TCAD at the heart of innovation in RF SOI technology

Author(s): J.-P. Raskin
Published in: 2021
Publisher: (invited talk), Silvaco SURGE 2021

Tunable Power Amplifiers for 5G-FR1 Applications

Author(s): A. Giry, A. Serhan, P. Reynier, D. Parat
Published in: 2022
Publisher: IEEE Radio Wireless Week

IC and Package Co-design Techniques & Technologies for High Efficiency Linear PA Modules

Author(s): P. Reynier, A. Serhan, D. Parat, A. Giry
Published in: "Workshop ""Fully Integrated Silicon vs. Hybrid RFFE Systems for mm-Wave 5G Highly Efficient PA Design Trade-offs""", 2021
Publisher: RFIC 2021 Workshop

SOI technology and design challenges for RF and mmWave

Author(s): Y. Morandini (SOITEC)
Published in: 2022
Publisher: from Front End Modules to SoC

‘A Digital Filter Design at Auxiliary Receiver for Optimal Pre-Distortion Performance’.

Author(s): Dursun Baran
Published in: 2022
Publisher: SİU 2022

Design and Integration of Multiband High Efficiency Linear PA Modules for 5G

Author(s): Alexandre Giry
Published in: European Microwave Week(EUMW), 2021
Publisher: CEA-Leti

Large-Signal Modeling for Nonlinear Analysis of Experimental Devices in 22nm FDSOI Technology

Author(s): Quang Huy Le et al.
Published in: 16th European Microwave Integrated Circuits Conference EuMIC, 2022
Publisher: FhG

Stress analysis by XRD and Raman on different semiconductor substrates

Author(s): L.B. Enache, G. Mihai, S. Rosoiu, A.G. Pantazi, C. Moise, A.A. Messina, M. Enachescu
Published in: International Congress on Microscopy & Spectroscopy, 2022
Publisher: UPB

Nox and buried PN junctions effect on RF performance of High-Resistivity Silicon substrates

Author(s): M. Moulin et al.
Published in: 2022
Publisher: SiRF
DOI: 10.1109/sirf53094.2022.9720037

Sub-6GHz SOI-CMOS High-Efficiency Linear PA Architectures: Challenges, Technics and Opportunities

Author(s): A. Serhan, P. Reynier, D. Parat, A. Giry
Published in: "Workshop ""Frontières et interfaces cyberphysiques"" GDR-SoC2", 2021
Publisher: RFIC 2021 Workshop

High-Resistivity Substrates for RF and mm-wave Applications: Focus on Impact in 22FDX

Author(s): M. Rack
Published in: 2022
Publisher: CTO talk Global Foundries, Dresden

Experimental study of thermal coupling effects in FD-SOI MOSFET

Author(s): M. Vanbrabant
Published in: EuroSOI-ULIS 2022, 2022
Publisher: UCL

Assessment of RF 04/2021 compact modeling of FD SOI transistors

Author(s): M. Vanbrabant, L. Nyssens, V. Kilchytska and J.-P. Raskin
Published in: IEEE Latin America Electron Devices Conference, 2021
Publisher: UCL

RF characterization of the back-gate contact on Fully Depleted SOI MOSFETs - Master Thesis defended

Author(s): M. Vanbrabant
Published in: 2020
Publisher: UCL

Design of an RC Low Pass Filter 22 nm FD SOI Technology

Author(s): Ömer Taha Keleş
Published in: 2022
Publisher: MKR IC

Design of an RC Low-Pass Filter 22 nm FD-SOI Technology

Author(s): Ömer Taha Keleş
Published in: 2022
Publisher: MKR IC

Modelling of Advanced Silicon-Based Substrates for RF and mm-Wave Applications

Author(s): [PhD1] M. Rack promoter J.-P. Raskin.
Published in: 2021
Publisher: UCL

RF characterization of the back-gate contact on Fully Depleted SOI MOSFETs

Author(s): M. Vanbrabant
Published in: 2020
Publisher: UCL

Inter-Transistor Heat Transfer in PDSOI and UTBB FDSOI MOSFET Technologies - Master Thesis defended

Author(s): M. Pace
Published in: 2020
Publisher: UCL

Heat Sink implementation in Back-End of Line for Self-Heating reduction in 22 nm FDSOI MOSFETs

Author(s): Arka Halder, Lucas Nyssens, Martin Rack, Dimitri Lederer, Jean-Pierre Raskin, Valeriya Kilchytska
Published in: Solid-State Electronics, 2021, Page(s) 108088, ISSN 0038-1101
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2021.108088

A low-power high-gain and high linearity CMOS RF front-end design involving a charge injection mixer for V2X technology

Author(s): Ozkan B. & Zencir E
Published in: Journal of Circuits, Systems, and Computers, 2021
Publisher: TUBITAK

Development of High Resistivity FD SOI substrates for mmWave applications

Author(s): I. Bertrand (SOITEC) , LETI and UCL
Published in: ECS Transactions, 2022
Publisher: SOITEC, LETI and UCL

Gain and Bandwidth Programmable Fourth-Order Multiple Feedback Butterworth Low-Pass Filter for C–V2X Applications

Author(s): Barin F, Zencir E.
Published in: Journal of Circuits, Systems and Computers, 2022
Publisher: TUBITAK

A High-Speed Fully Differential Telescopic Op-Amp for Active Filter Designs in V2X Applications

Author(s): Barin F, Zencir E
Published in: Journal of Circuits, Systems and Computers, Issue 2022;31(08):2250140, 2022
Publisher: TUBITAK

Engineering SOI Substrates for RF to mmWave Front-Ends

Author(s): F. Allibert, L. Andia, Y. Morandini and C. Veytizou, Soitec, Bernin, France, M. Rack, L. Nyssens and J. P. Raskin, ICTEAM, Université Catholique de Louvain, Louvain-la-Neuve, Belgium, and E. Augendre, CEA-LETI and Université Alpes Grenoble, Grenoble, France
Published in: Microwave Journal, 2020
Publisher: Soitec, CEA, UCL

On the Separate Extraction of Self-Heating and Substrate Effects in FD-SOI MOSFET

Author(s): Lucas Nyssens, M. Rack, A. Halder, J.-P. Raskin, V. Kilchytska
Published in: IEEE Electron Device Letters, Issue 42/5, 2021, Page(s) 665-668, ISSN 0741-3106
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2021.3071272

A low-power 65-nm CMOS mixer linearized with IM2 injection for V2X applications

Author(s): Özkan B., Zencir E.
Published in: Analog Integr Circ Sig Process 110, Issue 489–497 (2022), 2022
Publisher: TUBITAK

Ultra-Wide Bandwidth Fully Differential CMOS Opamp with a Novel Bandwidth Extension Technique for SoC Active Filter Applications

Author(s): Kayanselcuk T. , Zencir E.
Published in: Journal of Circuits, Systems and Computers, Issue 2021;30(12):2150226, 2021
Publisher: TUBITAK

Engineered RF SOI substrates for Smart and Sustainable Mobility

Author(s): L. Andia
Published in: EETimes Europe May22, 2022
Publisher: SOITEC

Characterization and role of deep traps on the radio frequency performances of high resistivity substrates

Author(s): Eric Vandermolen, Frédéric Allibert,Martin Rack
Published in: Journal of Applied Physics 129, 215701 (2021), 2021
Publisher: Journal of Applied Physics 129
DOI: 10.1063/5.0045306

Spectrum Sensing and Signal Identification With Deep Learning Based on Spectral Correlation Function

Author(s): K. Tekbiyik, Ö. Akbunar, A. R. Ekti, A. Görçin, G. K. Kurt and K. A. Qaraqe
Published in: IEEE Transactions on Vehicular Technology, Issue vol. 70, no. 10, pp. 10514-10527, Oct. 2021, 2021
Publisher: TUBITAK

"""Press Release on RF / ConnectivityREFERENCE awarded for “TROPHEE des Etoiles de l’Europe”"""

Author(s): Soitec
Published in: 2020
Publisher: SOITEC

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