Resultado final
Demonstration of the functionality of the smart well plate lid.
Demonstration of the functionality of the high definition electrophysiology (HD e-Phys) multiwell plate
Demonstration of the three smart well plate platforms in a realistic setting using cell cultures that are representative for their application in a biological or pharmaceutical setting.
Demonstration of the three smart well plate platforms in a realistic setting using cell cultures that are representative for their application in a biological or pharmaceutical setting.
Final US powered fracture monitor demonstratorDemonstration of the optimized Organ-on-Chip devices ready for integration in the smart well plate platform.
Final inductively powered conformal peripheral nerve stimulating implant
Demonstration of the fluidic and electrical functionality of the smart well plate platform.
Prototypes demonstration
Report on the WP6 application demonstrators
Final dissemination and communication plan
Public summary of project
Low frequency CMUT & PMUT demonstration report
Low frequency CMUT PMUT demonstration report
Public report on projects' resultsPublic report on projects results
Initial dissemination and communication planWhite paper describing and advocating the smart well plate platforms highlighting their open technology character.
White paper describing and advocating the smart well plate platforms highlighting their open technology character
Report in the form of scientific publication on the benchmarking between the ultrasound and inductive wireless links for powering active implants (including trade-offs, suitability for location in the body, capacity for power transfer)Report in the form of scientific publication on the benchmarking between the ultrasound and inductive wireless links for powering active implants including tradeoffs suitability for location in the body capacity for power transfer
Publicaciones
Autores:
Agnes Bußmann
Publicado en:
2022
Editor:
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
DOI:
10.5445/ir/1000145645
Autores:
Grünerbel, Lorenz M.
Publicado en:
Edición 2, 2022
Editor:
TUM School of Computation, Information and Technology
Autores:
Eric Dijkema
Publicado en:
2020
Editor:
Delft University of Technology
Autores:
Youri Westhoek
Publicado en:
2020
Editor:
Delft University of Technology
Autores:
Tokihiko Shimura, Shun Sato, Peter Zalar, Naoji Matsuhisa
Publicado en:
Advanced Electronic Materials, Edición 2023, 2023, ISSN 1438-1656
Editor:
John Wiley & Sons Ltd.
DOI:
10.1002/aelm.202200512
Autores:
Laura Peralta, Daniele Mazierli, Alberto Gomez, Joseph V Hajnal, Piero Tortoli, Alessandro Ramalli
Publicado en:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control (Volume: 70, Edición: 3, March 2023), 2023, ISSN 0885-3010
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tuffc.2023.3241774
Autores:
Diogo Miguel Caetano, Ruben Afonso, Ana Rita Soares, João Silva, Hanna Iva Busse, Vania Silverio,
Taimur Rabuske, Gonçalo N. Tavares, Jorge Ribeiro Fernandes, Susana Cardoso
Publicado en:
IEEE Transactions on Instrumentation and Measurement ( Volume: 72), 2023, ISSN 0018-9456
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tim.2023.3244208
Autores:
Díaz de Cerio, Maria; Oliván García, Sara; Ochoa Garrido, Ignacio; Gracia-San Martin, Josune; Martinez, Alfredo
Publicado en:
Histology and histopathology (2023), Edición 1, 2023, ISSN 0213-3911
Editor:
Plaza Fuensanta
DOI:
10.14670/hh-18-656
Autores:
Daniele Mazierli, Alessandro Ramalli, Enrico Boni, Francesco Guidi, Piero Tortoli
Publicado en:
IEEE Transactions on Biomedical Circuits and Systems (Volume: 15, Edición: 3, June 2021), 2021, ISSN 1932-4545
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tbcas.2021.3077664
Autores:
Said Mosbah,Chemseddine Zebiri,Djamel Sayad,Issa Elfergani, Mohamed Lamine Bouknia, Samira Mekki, Rami Zegadi, Merih Palandoken, Jonathan Rodriguez, Raed A. Abd-Alhameed
Publicado en:
Applied Sciences 2022, 2022, ISSN 2076-3417
Editor:
MDPI
DOI:
10.3390/app12042144
Autores:
A. Amroun, C. Zebiri, Djamel Sayad, Issa T. E. Elfergani, A. Desai, M. L. Bouknia, R. Zegadi, J. Rodriguez
Publicado en:
International Journal of Communication Systems, Edición Volume 36, Edición 14, 2023, ISSN 1074-5351
Editor:
John Wiley & Sons Inc.
DOI:
10.1002/dac.5557
Autores:
Arpan Desai; Merih Palandoken; Issa Elfergani; Ismail Akdag; Chemseddine Zebiri; Joaquim Bastos; Jonathan Rodriguez; Raed A. Abd-Alhameed
Publicado en:
Electronics, Vol 11, Iss 251, p 251 (2022), Edición 1, 2022, ISSN 2079-9292
Editor:
MDPI
DOI:
10.3390/electronics11020251
Autores:
Ismael Essop; Jose Ribeiro; Maria Papaioannou; Georgios Zachos; Georgios Mantas; Jonathan Rodriguez
Publicado en:
Sensors (Basel, Switzerland), Edición 1, 2021, ISSN 1424-8220
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s21041528
Autores:
Mármol, Inés; Abizanda-Campo, Sara; Ayuso, José M.; Ochoa, Ignacio; Oliván, Sara
Publicado en:
Bioengineering 2023, Edición 1, 2023, ISSN 2306-5354
Editor:
MDPI
DOI:
10.3390/bioengineering10050572
Autores:
Aysajan Abidin, Mohieddine El Soussi, Jac Romme, Pepijn Boer, Dave Singelée, Christian Bachmann
Publicado en:
Transactions on Cryptographic Hardware and Embedded Systems, 2021, ISSN 2569-2925
Editor:
IACR
DOI:
10.46586/tches.v2021.i2.106-135
Autores:
Hector Castro-Abril, Jónathan Heras, Jesús del Barrio, Laura Paz, Clara Alcaine, Marina Pérez Aliácar, Diego Garzón-Alvarado, Manuel Doblaré, Ignacio Ochoa
Publicado en:
Macromolecular Bioscience 2023, 2300108, 2023, ISSN 1616-5195
Editor:
Wiley-VCH
DOI:
10.1002/mabi.202300108
Autores:
Prabakaran, Bharath Srinivas; Hamelmann, Paul; Ostrowski, Erik; Shafique, Muhammad
Publicado en:
IEEE Access, Edición 1, 2023, ISSN 2169-3536
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.48550/arxiv.2303.07852
Autores:
Massimo Mastrangeli; Janny van den Eijnden-van Raaij
Publicado en:
Stem Cell Reports . 2021 Sep 14;16(9):2037-2043, 2021, ISSN 2198-7866
Editor:
International Society for Stem Cell Research
DOI:
10.1016/j.stemcr.2021.06.015
Autores:
Luxi Wei, Enrico Boni, Alessandro Ramalli, Fabian Fool, Emile Noothout, Antonius F. W. van der Steen, Martin D. Verweij, Piero Tortoli, Nico de Jong, Hendrik J. Vos
Publicado en:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control (Volume: 69, Edición: 10, October 2022), 2022, ISSN 0885-3010
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tuffc.2022.3204118
Autores:
Alfredo Mameli, Hylke B. Akkerman, Sandra González-Lana, Héctor Castro-Abril, Kim Le Cann, Angelika Lampert, Gerwin H. Gelinck, Auke Jisk Kronemeijer, Albert J.J.M. van Breemen
Publicado en:
Microelectronic Engineering, Volume 277, 15 May 2023, 112016, 2023, ISSN 0167-9317
Editor:
Elsevier BV
DOI:
10.1016/j.mee.2023.112016
Autores:
Rebekah Maffett, Enrico Boni, Adrian J. Y. Chee, Billy Y. S. Yiu, Alessandro Stuart Savoia, Alessandro Ramalli, Piero Tortoli, Alfred C. H. Yu
Publicado en:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control ( Volume: 69, Edición: 10, October 2022), 2022, ISSN 0885-3010
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tuffc.2022.3188245
Autores:
Karthikeya Gulur Sadananda; Issa Elfergani; Chemseddine Zebiri; Jonathan Rodriguez; Shiban Kishen Koul; Raed A. Abd-Alhameed
Publicado en:
Electronics; Volume 11; Edición 4; Pages: 571, 2022, ISSN 2079-9292
Editor:
MDPI
DOI:
10.3390/electronics11040571
Autores:
Marta Saccher, Shinnosuke Kawasaki, Martina Proietti Onori, Geeske M. van Woerden, Vasiliki Giagka, Ronald Dekker
Publicado en:
Bioelectronic Medicine volume 8, Article number: 2 (2022), 2022, ISSN 2332-8886
Editor:
BMC
DOI:
10.1186/s42234-021-00083-7
Autores:
Mahum Naseer; Bharath Srinivas Prabakaran; Osman Hasan; Muhammad Shafique
Publicado en:
Springer Machine Learning Journal, Edición 2023, 2023, ISSN 0885-6125
Editor:
Kluwer Academic Publishers
DOI:
10.1007/s10994-023-06314-z
Autores:
Alexandru Grigoroiu; Carmen-Marinela Mihailescu; Mihaela Savin; Carmen Aura Moldovan; Costin Brasoveanu; Silviu Dinulescu; Nikolay Djourelov; Georgescu Vlad Cristian; Oana Brincoveanu; Gabriel Craciun; Cristina Pachiu; Ion Stan; Bogdan Firtat; George Stelian Muscalu; Marian Ion; Adrian Anghelescu
Publicado en:
Carbon Nanomaterials and Related Materials for Sensing Applications, Edición 1, 2023, ISSN 2227-9040
Editor:
MDPI
DOI:
10.3390/chemosensors11020132
Autores:
Peter Zalar, Lucia Rubino, Fatima Margani, Gerwin Kirchner, Daniele Raiteri, Maurizio Stefano Galimberti, Vincenzina Barbera
Publicado en:
Advanced Engineering Materials, Volume 25, Edición 17, 2023, ISSN 1438-1656
Editor:
John Wiley & Sons Ltd.
DOI:
10.1002/adem.202300706
Autores:
Stefano Rossi, Alessandro Ramalli, Piero Tortoli
Publicado en:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control (Volume: 68, Edición: 8, August 2021), 2021, ISSN 0885-3010
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tuffc.2021.3076284
Autores:
Alessandro Ramalli, Enrico Boni, Emmanuel Roux, Herve Liebgott, Piero Tortoli
Publicado en:
IEEE Trans Ultrason Ferroelectr Freq Control. 2022 Oct;69(10):2739-2755., 2022, ISSN 0885-3010
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tuffc.2022.3162419
Autores:
Fatima Garcia-Villen; Idoia Gallego; Myriam Sainz-Ramos; Jorge Ordoyo-Pascual; Sandra Ruiz-Alonso; Laura Saenz-del-Burgo; Conor O’Mahony; Jose Luis Pedraz
Publicado en:
Pharmaceutics 2023, 15(8), 2049, 2023, ISSN 1999-4923
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/pharmaceutics15082049
Autores:
Thomas Thalhofer; Mauro Keck; Sebastian Kibler; Oliver Hayden
Publicado en:
Sensors, Vol 22, Iss 1273, p 1273 (2022), Edición 3, 2022, ISSN 2078-2489
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22031273
Autores:
Agnes Bußmann; Henry Leistner; Doris Zhou; Martin Wackerle; Yücel Congar; Martin Richter; Jürgen Hubbuch
Publicado en:
Applied Sciences, Vol 11, Iss 8008, p 8008 (2021), Edición 1, 2021, ISSN 2078-2489
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/app11178008
Autores:
Stefano Rossi, Enrico Boni
Publicado en:
Electronics, Edición 10/8, 2021, Página(s) 884, ISSN 2079-9292
Editor:
MDPI
DOI:
10.3390/electronics10080884
Autores:
Agnes Bußmann; Thomas Thalhofer; Sophie Hoffmann; Leopold Daum; Nivedha Surendran; Oliver Hayden; Jürgen Hubbuch; Martin Richter
Publicado en:
Micromachines 2021, Edición Volume 12 / Edición 12, 2021, ISSN 2078-2489
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi12121459
Autores:
Claudio Giangrossi, Alessandro Ramalli, Alessandro Dallai, Daniele Mazierli, Valentino Meacci, Enrico Boni, Piero Tortoli
Publicado en:
Applied Sciences 2022, 12(13), 6562, 2022, ISSN 2076-3417
Editor:
MDPI
DOI:
10.3390/app12136562
Autores:
Marta Saccher, Shinnosuke Kawasaki, Johan H. Klootwijk, Rob Van Schaijk, Ronald Dekker
Publicado en:
IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control (Volume: 3), 2023, ISSN 2694-0884
Editor:
IEEE
DOI:
10.1109/ojuffc.2023.3240699
Autores:
Georgios Zachos; Ismael Essop; Georgios Mantas; Kyriakos Porfyrakis; Jose Ribeiro; Jonathan Rodriguez
Publicado en:
Electronics, Vol 10, Iss 2562, p 2562 (2021), Edición 1, 2021, ISSN 2079-9292
Editor:
MDPI
DOI:
10.3390/electronics10212562
Autores:
Francesco Guidi, Piero Tortoli
Publicado en:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Edición 68/6, 2021, Página(s) 2193-2201, ISSN 0885-3010
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tuffc.2021.3064612
Autores:
Sara Abizanda-Campo; María Virumbrales-Muñoz; Mouhita Humayun; Ines Marmol; David J. Beebe; Ignacio Ochoa; Sara Oliván; Jose M. Ayuso
Publicado en:
Microsystems & Nanoengineering, Edición 154 (2023), 2023, ISSN 2055-7434
Editor:
Springer Nature
DOI:
10.1038/s41378-023-00616-x
Autores:
Sajedin, Maryam; Elfergani, Issa; Rodriguez, Jonathan; Abd-Alhameed, Raed; Fernández Barciela, Mónica
Publicado en:
2021 IEEE 26th International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD), 2021
Editor:
IEEE
DOI:
10.1109/camad52502.2021.9617791
Autores:
Naseer, Mahum; Shafique, Muhammad
Publicado en:
Crossref, Edición 1, 2023
Editor:
IEEE
DOI:
10.1109/icst57152.2023.00054
Autores:
Samira Mekki; Chemseddine Zebiri; Djamel Sayad; Issa Elfergani; Hanene Bendjedi; Jonathan Rodriguez; Raed A. Abd-Alhameed
Publicado en:
2021 IEEE 26th International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD), Edición 1, 2021
Editor:
IEEE
DOI:
10.1109/camad52502.2021.9617800
Autores:
Kolovou-Kouri, Konstantina; Rashidi, Amin; Varkevisser, Francesc; Serdijn, Wouter A.; Giagka, Vasiliki
Publicado en:
44th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2022, 3443 - 3446, Edición 1, 2022
Editor:
IEEE
DOI:
10.1109/embc48229.2022.9871145
Autores:
Laura Peralta, Alessandro Ramalli, Kirsten Christensen-Jeffries, Sevan Harput, Piero Tortoli, Joseph V Hajnal
Publicado en:
2021
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593571
Autores:
Prabakaran, Bharath Srinivas; Ostrowski, Erik; Shafique, Muhammad
Publicado en:
Edición 1, 2023
Editor:
International Symposium on Visual Computing
DOI:
10.48550/arxiv.2303.07853
Autores:
Shinnosuke Kawasaki, Jia–Jun Yeh, Marta Saccher, Jian Li, Ronald Dekker
Publicado en:
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022, ISBN 978-1-6654-0912-4
Editor:
IEEE
DOI:
10.1109/mems51670.2022.9699807
Autores:
Georgios Zachos, Ismael Essop, Georgios Mantas, Kyriakos Porfyrakis, José C. Ribeiro, Jonathan Rodriguez
Publicado en:
2021 IEEE 26th International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD), 2021, ISBN 978-1-6654-1779-2
Editor:
IEEE
DOI:
10.1109/camad52502.2021.9617799
Autores:
Revyn, N.; Hu, Michel H.Y.; Frimat, Jean-Philippe; de Wagenaar, B.; van den Maagdenberg, Arn M.J.M.; Sarro, Pasqualina M; Mastrangeli, Massimo
Publicado en:
Proceedings of the 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Edición 09-13 January 2022, 2022
Editor:
IEEE
DOI:
10.1109/mems51670.2022.9699597
Autores:
Andrada I. Velea, Joshua Wilson, Astrid Gollhardt, Cyril B. Karuthedath, Abhilash S. Thanniyil, Vasiliki Giagka
Publicado en:
45th Int. Conf. of the IEEE Engineering in Medicine and Biology (EMBC) 2023, 2023
Editor:
IEEE
Autores:
Shinnosuke Kawasaki, et al.
Publicado en:
2021 IEEE Wireless Power Transfer Conference (WPTC), Edición 1-4 June 2021, 2021, ISBN 978-1-7281-9633-6
Editor:
IEEE
DOI:
10.1109/wptc51349.2021.9458104
Autores:
Maria Papaioannou; Jose C Ribeiro; Valdemar Monteiro; Victor Sucasas; Georgios Mantas; Jonathan Rodriguez
Publicado en:
IEEE International Workshop on Computer-Aided Modeling, Analysis, and Design of Communication Links and Networks, CAMAD, Edición 25-27 October 2021, 2021
Editor:
IEEE
DOI:
10.1109/camad52502.2021.9617809
Autores:
Marta Saccher, Shinnosuke Kawasaki, Ronald Dekker
Publicado en:
2021 IEEE International Ultrasonics Symposium (IUS), 2021, ISBN 978-1-6654-0355-9
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593683
Autores:
Filippos Pelekoudas Oikonomou, Jose Ribeiro, Georgios Mantas, Joaquim Manuel C.S. Bastos, Jonathan Rodriguez
Publicado en:
2021 IEEE International Mediterranean Conference on Communications and Networking (MeditCom), 2021, ISBN 978-1-6654-4505-4
Editor:
IEEE
DOI:
10.1109/meditcom49071.2021.9647521
Autores:
Fjodors Tjulkins, Ryan Sebastian, Theo Guillerm, A James P Clover, Yuan Hu, Alexander Lyness, Conor O'Mahony
Publicado en:
44th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (IEEE EMBC 2022), 2022
Editor:
IEEE
DOI:
10.1109/embc48229.2022.9871455
Autores:
Ryan Sebastian; Theo Guillerm; Fjodors Tjulkins; Yuan Hu; A. James P. Clover; Alexander Lyness; Conor O'Mahony
Publicado en:
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), 2022
Editor:
IEEE
DOI:
10.1109/embc48229.2022.9871582
Autores:
Alessandro Ramalli, Alessandro Dallai, Francesco Guidi, Valentino Meacci, Piero Tortoli
Publicado en:
2021
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593699
Autores:
Marta Saccher, Sai Sandeep Lolla, Shinnosuke Kawasaki, Ronald Dekker
Publicado en:
2022 IEEE International Ultrasonics Symposium (IUS), 2022, ISBN 978-1-6654-7813-7
Editor:
IEEE
DOI:
10.1109/ius54386.2022.9957652
Autores:
Laura Peralta, Daniele Mazierli, Alberto Gomez, Joseph V. Hajnal, Piero Tortoli, Alessandro Ramalli
Publicado en:
IUS 2022 - IEEE International Ultrasonics Symposium, 2022, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/ius54386.2022.9958667
Autores:
Shinnosuke Kawasaki, et al
Publicado en:
2021 10th International IEEE/EMBS Conference on Neural Engineering (NER), Edición 4-6 May 2021, 2021, ISBN 978-1-7281-4337-8
Editor:
IEEE
DOI:
10.1109/ner49283.2021.9441225
Autores:
Alessandro S. Savoia, Marco Casavola, Enrico Boni, Marco Ferrera, Carlo Prelini, Piero Tortoli, Domenico Giusti, Fabio Quaglia
Publicado en:
2021 IEEE International Ultrasonics Symposium (IUS), 2021, ISBN 978-1-6654-4777-5
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593751
Autores:
Andrada I. Velea, Joshua Wilson, Anna Pak, Manuel Seckel, Sven Schmidt, Stefan Kosmider, Nasim Bakhshaee, Wouter A. Serdijn, Vasiliki Giagka
Publicado en:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021, ISBN 978-0-9568086-7-7
Editor:
IEEE
DOI:
10.23919/empc53418.2021.9584962
Autores:
Alessandro S. Savoia, Andrea Mazzanti, Stefano Ottaviani, Lara Novaresi, Piero Malcovati, Davide Ugo Ghisu, Edoardo Bonizzoni, Marco Terenzi, Fabio Quaglia
Publicado en:
2022 IEEE International Ultrasonics Symposium (IUS), 2022, ISBN 978-1-6654-6657-8
Editor:
IEEE
DOI:
10.1109/ius54386.2022.9958896
Autores:
Benedito, Oscar; Delgado-Gonzalo, Ricard; Schiavoni, Valerio
Publicado en:
21st International Conference on Distributed Applications and Interoperable Systems (DAIS21), 2021
Editor:
IFIP
DOI:
10.48550/arxiv.2104.13285
Autores:
Shinnosuke Kawasaki, Indulakshmi Subramaniam, Marta Saccher, Ronald Dekker
Publicado en:
2021 IEEE International Ultrasonics Symposium (IUS), 2021, ISBN 978-1-6654-4777-5
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593603
Autores:
Alessandro S. Savoia, Domenico Giusti, Mark Andrew Shaw, Marco Ferrera, Fabio Quaglia
Publicado en:
2022 IEEE International Ultrasonics Symposium (IUS), 2022, ISBN 978-1-6654-7813-7
Editor:
IEEE
DOI:
10.1109/ius54386.2022.9958888
Autores:
Ostrowski, Erik; Prabakaran, Bharath Srinivas; Shafique, Muhammad
Publicado en:
Edición 1, 2023
Editor:
International Joint Conference on Neural Networks
DOI:
10.48550/arxiv.2303.07892
Autores:
Francesco Guidi, Claudio Giangrossi, Alessandro Dallai, Alessandro Ramalli, Piero Tortoli
Publicado en:
2021 IEEE International Ultrasonics Symposium (IUS), 2021, ISBN 978-1-6654-0355-9
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593479
Autores:
Daniele Mazierli, Alessandro Ramalli, Enrico Boni, Francesco Guidi, Piero Tortoli
Publicado en:
2021 IEEE International Ultrasonics Symposium (IUS), 2021, ISBN 978-1-6654-0355-9
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593831
Autores:
Grünerbel, Lorenz; Leikam, Barbara; Schrag, Gabriele
Publicado en:
MikroSystemTechnik Kongress 2021, 2021
Editor:
Fraunhofer Gesellschaft
Autores:
Mohamed Lamine Bouknia; Chemseddine Zebiri; Djamel Sayad; Issa Elfergani; Said Mosbah; Jonathan Rodriguez; Raed A. Abd-Alhameed
Publicado en:
Crossref, Edición 1, 2021
Editor:
IEEE
DOI:
10.1109/camad52502.2021.9617801
Autores:
Paolo Mattesini, Alessandro Stuart Savoia, Alessandro Ramalli, Fabio Quaglia, Piero Tortoli, Enrico Boni
Publicado en:
2021 IEEE International Ultrasonics Symposium (IUS), 2021, ISBN 978-1-6654-4777-5
Editor:
IEEE
DOI:
10.1109/ius52206.2021.9593805
Autores:
Ostrowski, Erik; Shafique, Muhammad
Publicado en:
Edición 1, 2023
Editor:
International Symposium on Visual Computing
DOI:
10.48550/arxiv.2303.07898
Autores:
Marcus De Ree, Damian Vizár, Georgios Mantas, Joaquim Bastos, Corinne Kassapoglou-Faist, Jonathan Rodriguez
Publicado en:
2021 IEEE 26th International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD), 2021, ISBN 978-1-6654-1779-2
Editor:
IEEE
DOI:
10.1109/camad52502.2021.9617796
Autores:
Daniele Mazierli, Laura Peralta, Joseph V Hajnal, Alessandro Ramalli, Piero Tortoli
Publicado en:
IUS 2022 - IEEE International Ultrasonics Symposium, 2022, ISBN 978-1-6654-6657-8
Editor:
IEEE
DOI:
10.1109/ius54386.2022.9957438
Autores:
Peter Zalar, Milan Saalmink, Daniele Raiteri, Jeroen van den Brand, Edsger C. P. Smits
Publicado en:
Advanced Engineering Materials, 2022, ISSN 1527-2648
Editor:
Wiley-VCH GmbH
DOI:
10.1002/adem.202000714
Autores:
C. Zebiri, M. L. Bouknia, D. Sayad, I. Elfergani, Preecha Yupapin, M. Matin, Arpan Desai, Merih Palandoken, A. Iqbal, J. Rodriguez
Publicado en:
Wireless Networks volume 28, pages2237–2254 (2022), 2022, ISSN 1022-0038
Editor:
Baltzer Science Publishers B.V.
DOI:
10.1007/s11276-022-02962-6
Autores:
Marta Saccher, Shinnosuke Kawasaki, Ronald Dekker
Publicado en:
2021
Editor:
4TU.ResearchData
DOI:
10.4121/16635193.v1
Autores:
Sandra González-Lana; Teodora Randelovic; Jesús Ciriza; María López-Valdeolivas; Rosa Monge; Carlos Sánchez-Somolinos; Ignacio Ochoa
Publicado en:
Zaguán. Repositorio Digital de la Universidad de Zaragoza, 2022
Editor:
TMElab, University of Zaragoza
DOI:
10.26754/jjii3a.20227230
Autores:
Ostrowski, Erik; Prabakaran, Bharath Srinivas; Shafique, Muhammad
Publicado en:
Edición 1, 2023
Editor:
arXiv
DOI:
10.48550/arxiv.2303.07896
Autores:
Marta Saccher, Shinnosuke Kawasaki, Martina Proietti Onori, Geeske M. van Woerden, Vasiliki Giagka, Ronald Dekker
Publicado en:
2021
Editor:
4TU.ResearchData
DOI:
10.4121/17055329.v3
Autores:
Mattia Ballerini, Mohammad Jouybar, Andrea Mainardi, Marco Rasponi, Giovanni Stefano Ugolini
Publicado en:
Organ-on-a-Chip, 2021
Editor:
Humana New York, NY
DOI:
10.1007/978-1-0716-1693-2_2
Buscando datos de OpenAIRE...
Se ha producido un error en la búsqueda de datos de OpenAIRE
No hay resultados disponibles