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Extensible Processing Units (XPUs) as Enablers of the High-Performance Low-Power Embedded Market

Project description

More powerful processor units for self-driving cars

By 2024, more than 1.5 million cars in Europe will be conditionally automated, allowing drivers to turn their attention away from the road by handing over control to the system. This is classified as Level 3 automation – a precursor to self-driving vehicles (Level 5). Fully autonomous cars (with performance equal to that of a human driver) require substantially high processing power that is not currently available with today’s microprocessors, which are either high-performance but not power efficient, or low-power but unable to reach top performance. The EU-funded XPU project will develop a modular architecture solution to reach high performance at low power. The aim is to strike a balance between performance, security and power consumption.

Objective

According to Frost & Sullivan (2017), https://store.frost.com/global-autonomous-driving-market-outlook-2018.html(opens in new window) in 2024 there will be in Europe more than 1.5 million cars which will have at least conditional automation with each car requiring an average of about 2000€ in chips to enable automatic driving. Thus the total available market in Europe will reach 3000M€ in 5 years with a robust CAGR of 30%. Markets in USA and China will be of similar size.
The requirements for Level 5 autonomous cars (fully-autonomous vehicles with performance equal to that of a human driver in every driving scenario including extreme environments) will require substantially high processing power not currently available with today’s microprocessors. Processors in future cars not only must deliver increasing higher computing power but also they must do so as efficiently (low-power) as possible given strict automotive safely constraints. Furthermore, fully-autonomous cars require robust real-time features and dynamic balance between safety, performance and power. In contrast, current microprocessors are either high-performance but are not power efficient (e.g. Intel), or are low-power but unable to reach top performance (e.g. ARM), and generally do not have a strong real-time capability. These key bottlenecks are hindering advances towards fully automated vehicles. MOSAIK has defined a novel modular architecture designed from the ground-up to solve these urgent challenges.
To keep European Industry leadership (https://www.mckinsey.com/industries/automotive-and-assembly/our-insights/a-long-term-vision-for-the-european-automotive-industry(opens in new window)) setting the framework for car connectivity and user experience is a must. And to do so European industry needs a European Semiconductor company able to reach very high-performance at low power and provide the balance between performance, security and power consumption the industry is asking for.

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Topic(s)

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Funding Scheme

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SME-1 - SME instrument phase 1

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Call for proposal

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(opens in new window) H2020-EIC-SMEInst-2018-2020

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Coordinator

MOSAIK TECH SL
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 50 000,00
Address
JOAN OBIOLS 15 PLANTA 5 PUERTA 2
08034 BARCELONA
Spain

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Este Cataluña Barcelona
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 71 429,00
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