Resultado final
Establishment of a transparent cost structure based on the processing results and yields achieved in WP1, WP2 and WP3 in order to be able to evaluate the costs of the MPW runs. This will also address prospects, financial viability and integration of the 2D-EPL with EUROPRACTICE.
Single entry-point web portalDevelop an embedded section on the graphene-flaghsip.eu fully dedicated to the 2D-EPL. The sub-page shall be visible from the landing page and have a primary positioning to reach the industry sector.
Set-up of an Industrial advisory boardFirst meeting of the Industrial Advisory board. Roles, tasks and procedure agreed and validated by IAB.
Report on customer requests (sector, reasons for rejections, customer type [GF, GF AMs, other European, other non-European], costs), including feedback from serviced customers and rejected customers. A confidential annex will include detailed information about customers.
Evaluation and adaptation of access policy and proceduresReport on the evaluation of the access policy to the pilot line. Based on customer feedback and internal user friendliness the access procedure will be adapted and rolled out.
Fact sheet for the MPW runsThe deliverable will summarise the key parameters, boundary conditions and material stack for the planned MPW runs. It will form the basis for informing the customers on the MPW runs and for setting up the official fact sheet.
Protocol for characterisationProtocol for chemical, electrical and structural characterization regarding residual doping, mobility, hysteresis, stability and contact resistance, to allow comparative numerical characterization and optimization of the transfer, cleaning, dielectrics and contacting methods developed in tasks 3.1 - 3.4 by all the partners
Compare wafer scale single crystalline to polycrystallineThe 2D-EPL will test the wafer-scale transferred crystalline graphene and compare its performance to large area film of transferred polycrystalline graphene. The device performance, design flexibility, reliability, scalability and total cost of ownership will be independently evaluated and assessed by a sub-contractor of the 2D-EPL as well as the 2D-EPL Industrial Advisory Board. Once this approach results in a better device performance than polycrystalline graphene on a given wafer size (200 or 300 mm), its inclusion in the 2D-EPL will be pursued, provided that it is competitive in comparison to polycrystalline graphene in terms of design flexibility, reliability and scalable at commercially justifiable costs, considering total cost of ownership.
Report on received requests year 1Report on customer requests (sector, reasons for rejections, customer type [GF, GF AMs, other European, other non-European], costs), including feedback from serviced customers and rejected customers. A confidential annex will include detailed information about customers.
Dissemination and communication planCUT will prepare a dissemination and communication plan for the 2D-EPL.
Publicaciones
Autores:
J.-F. de Marneffe, D. Marinov, A. Goodyear, P.-J. Wyndaele, N. St. J. Braithwaite, S. Kundu, I. Asselberghs, M. Cooke, and S. De Gendt
Publicado en:
Journal of Vacuum Science & Technology, Edición 15208559, 2022, ISSN 1520-8559
Editor:
AIP Publishing LLC
DOI:
10.1116/6.0001726
Autores:
R. Lukose, M. Lisker, F. Akhtar, M. Fraschke, T. Grabolla, A. Mai, M. Lukosius
Publicado en:
Scientific Reports, Edición 11/1, 2021, ISSN 2045-2322
Editor:
Nature Publishing Group
DOI:
10.1038/s41598-021-92432-4
Autores:
M. Elviretti, M. Lisker, R. Lukose, M. Lukosius, F. Akhtara, A. Maiab
Publicado en:
Nanoscale Advances, Edición 25160230, 2022, ISSN 2516-0230
Editor:
The Royal Society of Chemistry
DOI:
10.1039/d2na00351a
Autores:
Mohamed Saeed,Paula Palacios,Muh-Dey Wei,Eyyub Baskent,Chun-Yu Fan,Burkay Uzlu,Kun-Ta Wang,Andreas Hemmetter,Zhenxing Wang,Daniel Neumaier,Max C. Lemme,Renato Negra
Publicado en:
Advanced Materials, Edición 15214095, 2021, ISSN 1521-4095
Editor:
Wiley
DOI:
10.1002/adma.202108473
Autores:
Eros Reato,Paula Palacios,Burkay Uzlu,Mohamed Saeed,Annika Grundmann,Zhenyu Wang,Daniel S. Schneider,Zhenxing Wang,Michael Heuken,Holger Kalisch,Andrei Vescan,Alexandra Radenovic,Andras Kis,Daniel Neumaier,Renato Negra,Max C. Lemme
Publicado en:
Advanced Materials, Edición 15214095, 2022, ISSN 1521-4095
Editor:
Wiley
DOI:
10.1002/adma.202108469
Autores:
Bárbara Canto, Martin Otto, Michael J. Powell, Vitaliy Babenko, Aileen O'Mahony, Harm C. M. Knoops, Ravi S. Sundaram, Stephan Hofmann, Max C. Lemme, Daniel Neumaier
Publicado en:
Advanced Materials Technologies, Edición 6/11, 2021, Página(s) 2100489, ISSN 2365-709X
Editor:
Wiley
DOI:
10.1002/admt.202100489
Autores:
Zhenxing Wang, Andreas Hemmetter, Burkay Uzlu, Mohamed Saeed, Ahmed Hamed, Satender Kataria, Renato Negra, Daniel Neumaier, Max C. Lemme
Publicado en:
Advanced Electronic Materials, Edición 7/7, 2021, Página(s) 2001210, ISSN 2199-160X
Editor:
Wiley
DOI:
10.1002/aelm.202001210
Autores:
Agata Piacentini,Damiano Marian,Daniel S. Schneider,Enrique González Marín,Zhenyu Wang,Martin Otto,Bárbara Canto,Aleksandra Radenovic,Andras Kis,Gianluca Fiori,Max C. Lemme,Daniel Neumaier
Publicado en:
Advanced Electronic Materials, Edición 2199160X, 2022, ISSN 2199-160X
Editor:
Wiley
DOI:
10.1002/aelm.202200123
Autores:
Benny Ku,Ferdinandus van de Wetering,Jens Bolten,Bart Stel,Mark A. van de Kerkhof,Max C. Lemme
Publicado en:
Advanced Materials Technologies, Edición 2365709X, 2022, ISSN 2365-709X
Editor:
Wiley
DOI:
10.1002/admt.202200411
Autores:
Arne Quellmalz, Xiaojing Wang, Simon Sawallich, Burkay Uzlu, Martin Otto, Stefan Wagner, Zhenxing Wang, Maximilian Prechtl, Oliver Hartwig, Siwei Luo, Georg S. Duesberg, Max C. Lemme, Kristinn B. Gylfason, Niclas Roxhed, Göran Stemme, Frank Niklaus
Publicado en:
Nature Communications, Edición 12/1, 2021, ISSN 2041-1723
Editor:
Nature Publishing Group
DOI:
10.1038/s41467-021-21136-0
Autores:
Max C. Lemme, Deji Akinwande, Cedric Huyghebaert & Christoph Stampfer
Publicado en:
Nature Communications, Edición 20411723, 2022, ISSN 2041-1723
Editor:
Nature Publishing Group
DOI:
10.1038/s41467-022-29001-4
Autores:
Zhihui Cheng, Chin-Sheng Pang, Peiqi Wang, Son T. Le, Yanqing Wu, Davood Shahrjerdi, Iuliana Radu, Max C. Lemme, Lian-Mao Peng, Xiangfeng Duan, Zhihong Chen, Joerg Appenzeller, Steven J. Koester, Eric Pop, Aaron D. Franklin & Curt A. Richter
Publicado en:
Nature Electronics, Edición 25201131, 2022, ISSN 2520-1131
Editor:
Nature Publishing Group
DOI:
10.1038/s41928-022-00798-8
Autores:
T.Schram, Q.Smets, D.Radisic, B.Groven, A.Thiam, W.Li, E.Dupuy,K.Vandersmissen, T.Maurice, I.Asselberghs & I.Radu
Publicado en:
2021 Symposium on VLSI Technology, 2021
Editor:
IEEE
Autores:
Quentin Smets; Tom Schram; Devin Verreck; Daire Cott; Benjamin Groven; Zubair Ahmed; Ben Kaczer; Jerome Mitard; Xiangyu Wu; Souvik Kundu; Hans Mertens; Dunja Radisic; Arame Thiam; Waikin Li; Emmanuel Dupuy; Zheng Tao; Kevin Vandersmissen; Thibaut Maurice; Dennis Lin; Pierre Morin; Inge Asselberghs; Iuliana Radu
Publicado en:
2021 IEEE International Electron Devices Meeting, 2021
Editor:
IEEE
DOI:
10.1109/iedm19574.2021.9720517
Autores:
Tom Schram; Hikmet. Celiker; Quentin Smets; Inge Asselbergs; G. S. Kar, Kris Myny
Publicado en:
2022 IEEE Silicon Nanoelectronics Workshop (SNW), 2022
Editor:
IEEE
DOI:
10.1109/snw56633.2022.9889048
Autores:
Yuanyuan Shi; Benjamin Groven; Quentin Smets; Surajit Sutar; Sreetama Banerjee; Henry Medina; Xiangyu Wu; Cedric Huyghebaert; Steven Brems; Dennis Lin; Pierre Morin; Matty Caymax; Inge Asselberghs; Iuliana Radu
Publicado en:
2021 IEEE International Electron Devices Meeting, 2021
Editor:
IEEE
DOI:
10.1109/iedm19574.2021.9720676
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