Several technological achievements have been made in the development of the TiPlate process:
1. Testing and Optimization of the Original Formulation of the TiPlate Process
Traditional titanium electroplating challenges, like hydrogen gas and titanium oxide formation, were addressed through collaboration with Prof. Daniel Mandler's academic group at the Hebrew University of Jerusalem. Extensive testing used techniques like cyclic voltammetry and morphological assessments. Initially, denatured ethanol was the plating medium in a nitrogen-rich environment. However, as experiments progressed, it became clear that the original TiPlate process wasn't cost-effective, prompting the search for an alternative approach.
2. Development of the Alternative TiPlate Process
Three distinct approaches were investigated to discover an alternative technology for the TiPlate process. The chosen final process offered advantages like the capability to plate diverse metals and function under ambient conditions using an aqueous solution.
3. TiPlate by EPD Development Stages
Stabilizing the electrolyte was a crucial step in the TiPlate process. We optimized various factors, including dispersion solvent, agents, mixing, and additives. Polymertal achieved a durable electrolyte solution.
Other parameters were refined, such as anode materials, current density, electrode spacing, plating time, and temperature. Experiments on copper foil and 3D polymer substrates yielded promising results. Polymertal identified the suitable electrolyte composition, resulting in uniform titanium particle plating.
4. Pilot Studies
Pilot studies were initiated to explore the feasibility of using TiPlate technology for various applications. In Pilot 1, thin layers of titanium plating were substituted with nickel to assess their impact on plated polymers' mechanical, thermal, and electrical properties. The study demonstrated improved electrical conductivity, mechanical and thermal properties, flame resistance, and enhanced chemical stability.
In Pilot 2, the biocompatibility of TiPlate was intended to be tested on a PEEK substrate plated with a thin evaporated layer of titanium. Unfortunately, this pilot did not yield favorable results due to the low conductivity of the initial titanium layer. In future endeavors, the first titanium layer will be replaced with gold, which offers significantly higher conductivity.
5. Establishment of Technical and Business Infrastructure
Polymertal has actively penetrated global markets, with initial sales efforts in EU markets. The company is engaged in the automotive, semiconductor, and medical industries, with notable collaborations with companies like Porsche, BMW, ASML, and J&J. A global expansion plan for 2025 includes establishing a production line in the EU region, enhancing the company's international presence. These achievements underscore Polymertal's commitment to advancing TiPlate technology for diverse industries.
