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Verwertbare Ergebnisse
Customers purchasing electronic products are demanding increased product functionality, reduced unit size and higher reliability. The first 2 factors combined result in products with a higher density of internal connections, which in turn forces the component leads to become narrower and have a finer pitch. This puts enormous pressure on the existing methods for inspecting the integrity of the soldered joints between the component leads and the printed circuit board.
A system has been developed to demonstrate the feasibility of assessing the integrity of joints by measuring and quantifying selected key joint characteristics. This is achieved via noncontact inspection of the joint.
An extensive range of components have been addressed, including advanced packages such as Ball Grid Arrays and Fine Pitch Surface Mounted Devices, giving rise to a broad range of inspection challenges. The inspection system itself is modular in design, having the capability to inspect both visible and hidden joints by employing a combination of sensing technologies.
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