Objective Electronic Integration companies are facing sharp thermal management problems in the use of existing and emerging high integrated electronic components and modules. The heat removal capabilities of existing cooling techniques are overtaken in two different directions: increase of cards global dissipations (P > 100W) increase of local heat densities (HD > 10W/cm2) These objectives, twice higher than the current pratices, are associated with size limitations (3 mm max thickness of the system) and high reliability requirement (thermal expansion mismatch limited to 3 PPM). The proposed multidisciplinary technological development is directed at developing an active cold plate composed of integrated micro heat pipes through the following tasks: I. Development of the phase change heat exchanger: As regards this development, several steps will be considered: - - Design of capillary system - - Selection of the working fluid - - Compatibility of the components - - Operating limits II. Development of an advanced composite materials cooling substrate The objective of this task is to develop an MMC based phase change system by finding solutions for: - The functional requirements - The electronic packaging requirements - The possible manufacturing route (combine heatpipe systems with MMC bases or integrate heatpipes directly into MMC) - The maunfacturing parameters - The application specific lowable costs III. Electronic components integration and interconnection processes - For each slected multilevel media, the analysis of the assembly process will be made and incompatibilities will be mentioned. - The driving criterions will be coefficient of thermal expension, the ability to be brazed or glued and the resulting thermal resistance and hear removal capabilities. - Thermal simulations will be undertaken to compute the different temperature elevation and to compare the thermal efficiency of the differents stacks. - The different steps of the integration process will be defined and validated on mockups IV. Thermomechanical performance evaluation on technological demonstrators The objective of the present task is to realize a full size technological demonstrator equipped with representative components packaged in mono and multichip modules and to evaluate the heat transport capabilities in telecom and avionics environment. The complementary partnership structure is composed of two research centers (INSA de LYON and IKE aus STUTTGART) in charge of the heat pipe definition, ELECTROVAC (AT) as the active cooling substrate manufacturer and NOKIA (Fl) and SEXTANT (FR) as end users for telecommunications and avionics equipments. Fields of science engineering and technologymaterials engineeringcompositesengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunications Programme(s) FP4-BRITE/EURAM 3 - Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998 Topic(s) 0201 - Materials engineering Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator Sextant Avionique SA Address 25,rue jules vedrines 25 26027 Valence France See on map EU contribution € 0,00 Participants (4) Sort alphabetically Sort by EU Contribution Expand all Collapse all ELECTROVAC FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GMBH Austria EU contribution € 0,00 Address 37-39,aufeldgasse 37-39 3400 Klosterneuburg See on map INSAVALOR S.A. France EU contribution € 0,00 Address 20,avenue albert einstein 20, insa batiment 404 69621 Villeurbanne See on map Nokia Research Centre Finland EU contribution € 0,00 Address 7,heikkiläntie 7 211 Helsinki See on map UNIVERSITAET STUTTGART Germany EU contribution € 0,00 Address 31,pfaffenwaldring 31 70569 Stuttgart See on map
