The main objective of the project is to introduce into microelectronics industrial processes an approach of the electron beam resist production based on modified Langmuir-Blodgett (LB) technique, which ensures fast formation of highly uniform super thin films on solid supports with large surface areas. Such an approach could improve resolution of the created micro lithographic patterns which is an important factor for the fabrication of integrated circuits. The objectives of the project are in conformity with Tasks 2.1.4.M, 2.1.2.L and partially of the Brite-Euram programme. The innovative steps of present proposal to solve these problems consist in: i) synthesis and application of new surface-active polymers for the deposition of high quality electron beam sensitive LB films; ii) elaboration of deposition process conditions which enable to form such films on solid supports with large surface areas within few minutes; iii) development of specialised LB Instrument adapted for film deposition under industrial conditions. The last part of the RTD activity would be the study of functional properties of produced negative and positive LB resists, their characterisation and socioeconomic evaluations of their performance. The project will require extensive research into the above areas but the industrial benefits could be significant due to low level of investment required for the introduction of the LB technology into production cycles. The application sector for thin film resists is undoubtedly confined within microelectronics and the expected benefits are within this very field, plus possible the computer industry.
Funding SchemeEAW - Exploratory awards
DL2 2SL Croft On Tees