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High density connection implementation

Leistungen

Good indicative data on preferred viscosity have been generated and printing trials conducted.
The µ-Screen can be used just like an ordinary mesh screen but unlike the latter comprises a custom etched metal foil supported by a surrounding mesh and mounted in the centre of a conventional screen frame. The foil is only etched where printed features are required and nowhere else. The underside of the foil is coated with an organic gasketting layer that provides a sealed channel into which the ink flows during printing. Consequently, there are no problems associated with holes in the screen being partly obscured by the print pattern. Straight and curved features can be printed with ease at any orientation. With this increased resolution capability it is possible to make circuits smaller, with fewer layers and with increased yield and also reduce laser trimming. This also opens the way for applications which are the traditional preserve of thin film and photoimageable processes – both of which cost approximately 5 times more in terms of substrate production costs. Applications which are showing the most promise are microwave circuits, high density interconnect, sensors and precision resistors and capacitors and many of these are currently under development. The µ-Screen has now been assessed at a development level across a wide range of applications and, in collaboration with MCI (Cambridge), is now available as a production tool. For more information see http://www.era.co.uk/microscreen.htm or email microscreen@era.co.uk
Sub-miniature pressure and motion sensors manufactured from thick film on stainless steel. Major applications in industrial and medical sectors. Industrial prototypes have been made. The pressure sensor is attached to the steel diaphragm. This is a low cost, small size device which will supplant traditional devices and, unlike the latter, does not require an additional fluid medium to operate
Improvements have been made to software and usability criteria in new machine designs as a result of feedback from end user partners and ERA.
Use of this fine line gold ink with a wide range of applications, circuit elements, printing machines and operators has allowed extensive optimisation of properties.
Thick film is a low cost route for device fabrication. Traditionally the preserve of thin film, it has now been demonstrated that comparable performance can be achieved in thick film printing using the µ-Screen and fine line gold inks. This is due to the greater dimensional control achievable and the smoother edges to printed entities. Demonstration devices built include. This technology is now commercially applicable