Ziel
The quality and applicability of two different connection technologies will be investigated for bonding metallic tapes to CIGS thin film solar cells and modules:
i)using conductive adhesives and
ii)ultrasonic welding. This will be realised by using test layers and solar cells/modules on
i) glass substrates and
ii) flexible metal substrates (new applications). Various adhesives will be tested and analysed to achieve an optimised formulation. The following goals are pursued: i)optimisation of adhesive properties and welding components,
ii) optimisation of process steps and parameters,
iii) increase of module power output and lifetime by reduction of contact resistance and adhesion problems,
iv) decrease of process costs by rationalisation of process steps, vii) design and concept for a manufacturing equipment (separate for each technology).
Wissenschaftliches Gebiet
Programm/Programme
Aufforderung zur Vorschlagseinreichung
Data not availableFinanzierungsplan
CSC - Cost-sharing contractsKoordinator
70565 STUTTGART
Deutschland