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Advanced techniques for high temperature system-on-chip

Objective

ATHIS aims to demonstrate advanced techniques required for novel maximally integrated, miniaturised, distributed electronic systems with high reliability in high-temperature environments (in excess of 200°C), for future deployment in safety and efficiency critical systems within the automotive, aerospace, avionics, ships and oil extraction industries. This will be based on the realization of novel mixed analogue-digital-memory circuit IP cores in aggressive thin-film SOI technologies, their original integration into a system-on-chip, their combination with new dedicated power and passive devices using advanced MCM and flip-chip packaging solutions, their verification by appropriate methodologies for highly-integrated system level testing and by a final demonstrator targeting future high-efficiency cars.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

UNIVERSITE CATHOLIQUE DE LOUVAIN
Address
3,Place Du Levant 3
1348 Louvain-la-neuve
Belgium

Participants (6)

CENTRO RICERCHE FIAT S.C.P.A.
Italy
Address
Strada Torino 50
10043 Orbassano
CISSOID S.A.
Belgium
Address
Place Des Sciences 4/3 Bte 7
1348 Louvain-la-neuve
CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS
Spain
Address
Campus Universidad Autonoma De Barcelona
08193 Bellaterra
INSTITUT FUER MIKROELEKTRONIK- UND MECHANOTRONIK SYSTEME GGMBH
Germany
Address
Langewiesener Strasse 22
98693 Ilmenau
UNIVERSITY OF NEWCASTLE UPON TYNE
United Kingdom
Address
Kensington Terrace 6
NE1 7RU Newcastle Upon Tyne
X-FAB SEMICONDUCTOR FOUNDRIES AG
Germany
Address
Haarbergstrasse 67
Erfurt