Advanced techniques for high temperature system-on-chip

Objective

ATHIS aims to demonstrate advanced techniques required for novel maximally integrated, miniaturised, distributed electronic systems with high reliability in high-temperature environments (in excess of 200°C), for future deployment in safety and efficiency critical systems within the automotive, aerospace, avionics, ships and oil extraction industries. This will be based on the realization of novel mixed analogue-digital-memory circuit IP cores in aggressive thin-film SOI technologies, their original integration into a system-on-chip, their combination with new dedicated power and passive devices using advanced MCM and flip-chip packaging solutions, their verification by appropriate methodologies for highly-integrated system level testing and by a final demonstrator targeting future high-efficiency cars.

Programme(s)

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Topic(s)

• 1.1.3.-1. - Key Action Innovative Products, Processes and Organisation

Call for proposal

Data not available

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

UNIVERSITE CATHOLIQUE DE LOUVAIN

Address

3,place Du Levant 3
1348 Louvain-la-neuve
Belgium

Participants (6)

CENTRO RICERCHE FIAT S.C.P.A.

Italy

Address

Strada Torino 50
10043 Orbassano

CISSOID S.A.

Belgium

Address

Place Des Sciences 4/3 Bte 7
1348 Louvain-la-neuve

CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS

Spain

Address

Campus Universidad Autonoma De Barcelona
08193 Bellaterra

INSTITUT FUER MIKROELEKTRONIK- UND MECHANOTRONIK SYSTEME GGMBH

Germany

Address

Langewiesener Strasse 22
98693 Ilmenau

UNIVERSITY OF NEWCASTLE UPON TYNE

United Kingdom

Address

Kensington Terrace 6
NE1 7RU Newcastle Upon Tyne

X-FAB SEMICONDUCTOR FOUNDRIES AG

Germany

Address

Haarbergstrasse 67
Erfurt