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Content archived on 2024-05-24

Spatially resolved subsurface characterization of semiconductor wafers by high resolution x-ray diffraction

Objective

The main knowledge and technology to be transferred is the applicant's experience in characterization of grown-in and process-induced defects and stresses in semiconductors by means of X-ray diffraction techniques and his potential to contribute significantly to the research of surface damage depth profiling and lateral mapping after wafer surface preparation. His multiple beam diffracting technique can be useful base for the development of new techniques related to subsurface damage profiling and characterization and understanding of stresses and defects generation and treatment in semiconductor wafers.

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Call for proposal

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

RGI - Research grants (individual fellowships)

Coordinator

FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
EU contribution
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Address
Krügerstraße 22
01326 WEISSIG - DRESDEN
Germany

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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