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Content archived on 2024-05-24

New European Ozonated Water vapour solution for resist stripping and organic residues removal

Objective

The objective of the SEA project NOW is to assess a new semiconductor process equipment for resists and organic residues removal, up to production mode for front-end processes and in development mode for back end processes. This equipment will run a new process based on Ozone chemistry in a water moisture environment on 200mm wafers in a 50 wafers batch configuration. This process aims at the suppression of SPM/ SOM sulfuric acid based processes as well as the suppression of some specific chemicals used for organic residues removal, by contrast to standard industrial processes (SPM/ SOM) known to generate large chemical, water, distribution and waste treatment costs. The project will also address the Tool Installation and optimisation, Factory Acceptance Test and verification of Final specification Target. It will produce a Cost of Ownership of the process developed in the project as well as a benchmarking of the tool and processes versus competition.

Work description:
This 15 months Semiconductor Equipment Assessment NOW will cover MATTSON WET PRODUCTS GmbH Equipment Installation and optimisation, Tool Factory acceptance as well as production of Tool Final Specifications. It will address as a key objective FEOL (Front End Of Line) resist stripping and organic residues removal applications and as soon tool and processes have been demonstrated as being industrially mature, BEOL (Back End Of Line) applications. Project will encompass CoO (Cost of Ownership) calculations for tools and process steps in the scope of the project. This tool will be assessed for different layers (silicium, nitride, low K dielectrics, Copper), for different resist types after both ion implantation and etching, with different ion implantation dosage and energy.

Process data will be produced on residues and contamination removal capability, with the strong support of industrial and laboratory physical + chemical characterization, and with electrical defectivity/ yield measurement analysis on production wafers. Industrial characterisation of results will be performed in ATMEL, ALTIS, LETI. Metallic, organic, surface characterisations will be performed in ALTIS, LETI. FEOL tool will be installed and assessed in ATMEL Rousset production fabrication line (ATMEL FAB7), BEOL tool will be installed and assessed in IMEC. BEOL tool specific costs are not asked to the Commission to be financed

Milestones:
-Tool and its facilities optimisation, complete safety vs. Ozone hazards, DIW waste reclaim. Production of Factory and Site Acceptance as well as Final specifications;
- Development and implementation to FEOL processes in production;
- Process Development on BEOL processes;
- Characterization of metallic and organic contaminants, surface roughness of this technique on FEOL and BEOL processes;
-Cost of Ownership of the process developed in the project as well as benchmark of the tool+ processes versus competition.

Fields of science (EuroSciVoc)

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Call for proposal

Data not available

Coordinator

ATMEL ROUSSET S.A.
EU contribution
No data
Address
ZONE INDUSTRIELLE AVENUE DE LA VICTOIRE
13790 ROUSSET
France

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Total cost
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Participants (3)